JPH0286495A - Construction of mask for printing semi-liquid material - Google Patents
Construction of mask for printing semi-liquid materialInfo
- Publication number
- JPH0286495A JPH0286495A JP23821688A JP23821688A JPH0286495A JP H0286495 A JPH0286495 A JP H0286495A JP 23821688 A JP23821688 A JP 23821688A JP 23821688 A JP23821688 A JP 23821688A JP H0286495 A JPH0286495 A JP H0286495A
- Authority
- JP
- Japan
- Prior art keywords
- squeegee
- mask
- solder cream
- printing
- window hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007639 printing Methods 0.000 title claims abstract description 18
- 239000011344 liquid material Substances 0.000 title claims description 5
- 238000010276 construction Methods 0.000 title 1
- 239000007788 liquid Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000001125 extrusion Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 22
- 239000006071 cream Substances 0.000 abstract description 20
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 abstract 2
- 230000002349 favourable effect Effects 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野1
本発明は、半液状体印刷用マスクの構造に係り、さらに
詳しくはプリント基板等の平面板状の規定の位置に規定
の量で規定の形状の封止樹脂やはんだクリーム等の半液
状体を印刷するときの。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to the structure of a semi-liquid printing mask, and more specifically, it relates to the structure of a semi-liquid printing mask, and more specifically, it relates to the structure of a semi-liquid printing mask. When printing semi-liquid materials such as shaped sealing resin and solder cream.
マスク開口部の形状の改良に関するものである。This invention relates to an improvement in the shape of a mask opening.
〔従来の技術1
例えばプリント基板に表面実装用電子部品をはんだ付は
実装する場合、プリント基板の接続用端子上に、これに
対応した位置、形状、量のはんだクリームを印刷し、電
子部品の電極を当接した後、リフロー装置等により前記
はんだクリームを加熱溶融せしめ、電子部品の電極とプ
リント基板上の端子をはんだ付は接合している。[Conventional technology 1] For example, when surface-mounting electronic components are soldered or mounted on a printed circuit board, solder cream is printed on the connection terminals of the printed circuit board in a corresponding position, shape, and amount. After the electrodes are brought into contact, the solder cream is heated and melted using a reflow device or the like, and the electrodes of the electronic component and the terminals on the printed circuit board are joined by soldering.
この時のはんだクリームの印刷方法は、第2図に示すよ
うに、プリント基板の端子に対応した位置にはんだクリ
ーム印刷のためのマスク開口部2すなわち窓穴を持ちス
テンレス等よりなるマスクlを用い、樹脂あるいはゴム
等からなるスキジ4より前記マスクの窓穴よりはんだク
リームを押し出してプリント基板上に印刷する方法が普
通である。The method for printing the solder cream at this time is to use a mask l made of stainless steel or the like, which has mask openings 2, or window holes, for printing the solder cream at positions corresponding to the terminals of the printed circuit board, as shown in Figure 2. The usual method is to use a squeegee 4 made of resin or rubber to extrude solder cream from the window hole of the mask and print on the printed circuit board.
[発明が解決しようとする課題]
従来の技術では、はんだクリームを印刷するためのマス
クの窓穴について、第2図に示すように、1つの塗布部
に対して1つの開口部を設0たマスクを用いて印刷して
いた。この方法で粘度の高いはんだクリームを印刷する
場合、かすれの発生を防ぐためスキジの押し圧を高くす
る必要があった。[Problems to be Solved by the Invention] In the conventional technology, as shown in FIG. 2, one opening in a mask for printing solder cream is provided for one application area. It was printed using a mask. When printing highly viscous solder cream using this method, it was necessary to increase the pressure of the squeegee to prevent blurring.
しかし、スキジの押し圧が高いと、マスク開口部でスキ
ジがたわんではんだクリームをかきとるため、必要量の
クリームを印刷することができず、繰り返しによるばら
つきも出るため、印刷量のコントロールが難しかった。However, if the pressing force of the squeegee is high, the squeegee bends at the mask opening and scrapes off the solder cream, making it impossible to print the required amount of cream and causing variations due to repetition, making it difficult to control the amount of printing. Ta.
また、この現象を防ぐため、マスク開口部でたわみに(
い剛性の高いスキジを使用する場合は。In addition, to prevent this phenomenon, the mask opening should be bent (
When using a rigid squeegee.
スキジが硬く、押し圧も高くする必要があるために、マ
スクを傷付けたり、マスクとスキジが互いに摩耗したり
して耐久性に問題があった。Since the squeegee is hard and requires high pressing pressure, the mask may be damaged or the mask and squeegee may wear against each other, resulting in durability problems.
〔課題を解決するための手段1
本発明の半液状体印刷用マスクの構造は、マスクの開口
部にスキジの移動方向と同方向のスキジ保持部材を設け
たことを特徴とする。[Means for Solving the Problems 1] The structure of the semi-liquid material printing mask of the present invention is characterized in that a squeegee holding member is provided in the opening of the mask in the same direction as the moving direction of the squeegee.
【実 施 例]
以下に本発明の実施例を1図面に基ずいて説明する。第
1図において、はんだクリーム印部11用マスクlの開
口部2すなわち窓穴には、スキジの移動する方向にスキ
ジ保持部材3が配設されている。矢印の方向にスキジ4
が移動してはんだクリーム5が印刷される。このとき、
スキジ4はある規定の押し圧でマスクlへ押し付けられ
ているが、窓穴2に配設されたスキジ保持部材3によっ
てスキジがたわみにくくなるため、所望の量のはんだク
リームが再現性よく印刷される。[Example] An example of the present invention will be described below based on one drawing. In FIG. 1, a squeegee holding member 3 is disposed in the opening 2, that is, the window hole, of the mask l for the solder cream marking portion 11 in the direction in which the squeegee moves. Squeegee 4 in the direction of the arrow
moves and the solder cream 5 is printed. At this time,
Although the squeegee 4 is pressed against the mask L with a certain specified pressure, the squeegee holding member 3 disposed in the window hole 2 makes it difficult for the squeegee to bend, so that the desired amount of solder cream can be printed with good reproducibility. Ru.
ここで、第1図(a)は、スキジ4がマスク窓穴2にか
かる前の状態を示した斜視図であり、第1図(b)はス
キジがマスク窓穴上にある状態を示す断面図である。Here, FIG. 1(a) is a perspective view showing the state before the squeegee 4 is placed on the mask window hole 2, and FIG. 1(b) is a cross-sectional view showing the state where the squeegee is on the mask window hole. It is a diagram.
また、マスク保持部材3はマスク窓穴2の補強効果も合
わせ持つため、スキジの押し圧の不具合や、マスクの取
り扱い上の不注意等によって生ずるマスクのねじれ、引
っ張り、折り曲げ力に対して、マスク窓穴の変形や破損
を防ぐはたらきもある。In addition, since the mask holding member 3 also has the effect of reinforcing the mask window hole 2, the mask can withstand twisting, pulling, and bending forces of the mask caused by malfunctions in the pressing force of the squeegee or carelessness in handling the mask. It also works to prevent deformation and damage to window holes.
また1本発明のマスクの構造は上記のように。Furthermore, the structure of the mask of the present invention is as described above.
リフローはんだ付けのためのはんだクリーム印刷に使用
できるほかに、樹脂封止のための半液状樹脂の印刷とい
った半液状体の印刷一般に広(適用でき、その効果は同
様に得られる。In addition to being used for solder cream printing for reflow soldering, it can also be widely applied to semi-liquid printing in general, such as semi-liquid resin printing for resin sealing, and the same effect can be obtained.
[発明の効果1
本発明のマスクの構造は以上説明したように、マスク窓
穴にスキジ保持部材を設けたことにより、スキジがたわ
まなくなり、所望の量のはんだクリームを再現性よく印
刷することができるようになった。これにより、はんだ
量の多少による、はんだブリッジ、はんだオーブンとい
ったはんだ付は不良が減少し、これを修正する工数も減
少するため、電子機器の品質向上とコストダウンに多大
の効果がある。[Effect of the invention 1] As explained above, the structure of the mask of the present invention is such that the squeegee holding member is provided in the mask window hole, so that the squeegee does not bend, and the desired amount of solder cream can be printed with good reproducibility. Now I can do it. This reduces the number of soldering defects such as solder bridges and solder ovens due to the amount of solder, and reduces the number of man-hours required to correct them, which has a great effect on improving the quality of electronic devices and reducing costs.
また、スキジ保持部材のマスク窓穴補強の効果により、
マスクが壊れにくくなったため、マスク寿命が延びて、
ランニングコストが安くなり、これにより製品固有の開
発費用を減少せしめる効果を合わせ持つ。In addition, due to the effect of reinforcing the mask window hole of the squeegee holding member,
The mask is less likely to break, extending its lifespan.
Running costs are lower, which also has the effect of reducing product-specific development costs.
第1図は本発明のマスク構造の一実施例を示す図であり
、第1図(a)は斜視図、(b)は断面図である。第2
図(a)、(b)は従来のマスク構造を示す図。
マスク
マスク開口部(窓穴)
スキジ保持部材
スキジ
はんだクリーム
以上
出願人 セイコーエプソン株式会社
代理人 弁理士 鈴 木 喜三部(他1名)箋
図
(αン
嶺
?Cb)
箋2m
(Q)
篤2閃FIG. 1 is a diagram showing an embodiment of the mask structure of the present invention, with FIG. 1(a) being a perspective view and FIG. 1(b) being a sectional view. Second
Figures (a) and (b) are diagrams showing conventional mask structures. Mask Mask opening (window hole) Squeegee holding member Squeegee solder cream and above Applicant Seiko Epson Co., Ltd. Agent Patent attorney Kizobe Suzuki (and 1 other person) Notebook diagram (α-ridge? Cb) Notebook 2m (Q) Atsushi 2 flashes
Claims (1)
法により塗布印刷するための半液状体印刷用マスクの構
造において、前記マスクの開口部にスキジの移動方向と
同方向のスキジ保持部材を設けたことを特徴とする半液
状体印刷用マスクの構造。In the structure of a semi-liquid material printing mask for coating and printing a semi-liquid material onto a flat plate such as a printed circuit board by a squeegee extrusion method, a squeegee holding member is provided in the opening of the mask in the same direction as the moving direction of the squeegee. A structure of a semi-liquid printing mask characterized by the following.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23821688A JPH0286495A (en) | 1988-09-22 | 1988-09-22 | Construction of mask for printing semi-liquid material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23821688A JPH0286495A (en) | 1988-09-22 | 1988-09-22 | Construction of mask for printing semi-liquid material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0286495A true JPH0286495A (en) | 1990-03-27 |
Family
ID=17026873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23821688A Pending JPH0286495A (en) | 1988-09-22 | 1988-09-22 | Construction of mask for printing semi-liquid material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0286495A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008235404A (en) * | 2007-03-19 | 2008-10-02 | Denso Corp | Method of mounting electronic component |
-
1988
- 1988-09-22 JP JP23821688A patent/JPH0286495A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008235404A (en) * | 2007-03-19 | 2008-10-02 | Denso Corp | Method of mounting electronic component |
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