JPH028473Y2 - - Google Patents
Info
- Publication number
- JPH028473Y2 JPH028473Y2 JP1982152758U JP15275882U JPH028473Y2 JP H028473 Y2 JPH028473 Y2 JP H028473Y2 JP 1982152758 U JP1982152758 U JP 1982152758U JP 15275882 U JP15275882 U JP 15275882U JP H028473 Y2 JPH028473 Y2 JP H028473Y2
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- speaker
- layer
- plating layer
- composite plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 238000007733 ion plating Methods 0.000 claims description 4
- 229910003465 moissanite Inorganic materials 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052580 B4C Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Description
【考案の詳細な説明】
本考案は、振動板表面硬度を高めて高域特性の
改善を図つたスピーカの振動板に関する。[Detailed Description of the Invention] The present invention relates to a diaphragm for a speaker, which improves high-frequency characteristics by increasing the surface hardness of the diaphragm.
一般に、ヤング率や伝播速度が高いことなどは
振動板に要求される特性であるが、高域成分をロ
スなく帯域の拡大を図るためには剛性や振動板表
面硬度も重要な要素となる。 Generally, high Young's modulus and high propagation velocity are required characteristics of a diaphragm, but rigidity and diaphragm surface hardness are also important factors in order to expand the band without loss of high-frequency components.
そこでこの硬度を、得るための対策としてボロ
ン製振動板の表面をSiO2などでサーメツト化し、
層表面の組成を硬くしたものが知られているが、
従来のようにこの表面層の生成をスパッタリン
グ、イオンプレーテイングなどの方法で行う場合
には極めて生産性の悪いものとなり、高価なもの
となつていた。これは一般の装置では300Å／
min〜1500Å／minであるため振動板表面に十分
な層厚（10μ以上）を得るためには長時間必要と
するからである。 Therefore, as a measure to obtain this hardness, the surface of the boron diaphragm was made of cermet with SiO 2 etc.
It is known that the composition of the layer surface is hardened,
Conventionally, when this surface layer is formed by sputtering, ion plating, or other methods, productivity is extremely poor and the cost is high. This is 300Å/
This is because it takes a long time to obtain a sufficient layer thickness (10 μm or more) on the surface of the diaphragm since the heating rate is from min to 1500 Å/min.
本考案の目的は上記した従来の欠点を解消し、
充分な硬度が得られて帯域を拡大し得るようにし
たスピーカの振動板を提供することにある。 The purpose of this invention is to eliminate the above-mentioned conventional drawbacks,
An object of the present invention is to provide a diaphragm for a speaker that has sufficient hardness and can expand the band.
本考案の実施例を図面に基づいて説明するに、
図中１は振動板基体であつて、アルミニウム、チ
タン等の金属材料で形成されたものや炭素繊維を
熱硬化性樹脂で結着成形したもの等が用いられ
る。２は振動板基体１表面に形成された複合メツ
キ層であり、ニツケルをマトリツクスとし、複合
メツキ素材としては、ダイヤモンド、立方晶ボロ
ン、Sic、酸化アルミ等の硬質粒子が使用される。
一般に、電着メツキ層の例として、ニツケル単体
の場合そのビツカース硬度は700Kg／mm2であるが、
上記したようにニツケルとSicによる複合メツキ
層の場合は1300Kg／mm2であり、Sic単体のメツキ
層4500Kg／mm2には及ばないが、ニツケル単体のも
のに比して著しく高い硬度が得られる。なお、こ
のままではニツケルが組成の間に存在するので未
だ十分な硬度とはならないが、その表面にスパツ
タ、イオンプレーテイングの方法による無機質層
３を生成せしめることにより更に表面硬度を上げ
ることができる。無機質層３はその素材は、酸化
アルミ、Sic，SiO2、炭化ボロン、WCなどが用
いられるが、その層厚は0.1μ〜3μ程度とする。特
に上記複合メツキ層素材をSicやダイヤモンドと
した場合にはこれらの粒径（約2μ）と同等かこ
れ以上の層厚とすることが望ましい。 An embodiment of the present invention will be described based on the drawings.
In the figure, reference numeral 1 denotes a diaphragm base, which is made of a metal material such as aluminum or titanium, or made of carbon fiber bonded and molded with a thermosetting resin. Reference numeral 2 denotes a composite plating layer formed on the surface of the diaphragm base 1, which uses nickel as a matrix, and hard particles such as diamond, cubic boron, SiC, and aluminum oxide are used as the composite plating material.
Generally, as an example of an electrodeposited plating layer, the Vickers hardness of nickel alone is 700Kg/ mm2 ,
As mentioned above, the hardness of a composite plating layer made of nickel and SiC is 1300Kg/mm 2 , which is not as high as the 4500Kg/mm 2 plating layer of single SiC, but significantly higher hardness can be obtained compared to a single plating layer made of nickel. . In this case, since nickel is present in the composition, sufficient hardness is not yet achieved, but the surface hardness can be further increased by forming an inorganic layer 3 on the surface by sputtering or ion plating. The material used for the inorganic layer 3 is aluminum oxide, SiC, SiO 2 , boron carbide, WC, etc., and the layer thickness is about 0.1 μm to 3 μm. In particular, when the composite plating layer material is Sic or diamond, it is desirable that the layer thickness be equal to or greater than the grain size of these (approximately 2 μ).
本考案のスピーカの振動板によれば、振動板基
体表面にニツケルをマトリツクスとし、ダイヤモ
ンド、立方晶ボロン、Sic、酸化アルミ等の硬質
粒子による複合メツキ層が形成され、その上に無
機質層を生成させるようにしたから、振動板の剛
性及び表面硬度を著しく高めることができ、再生
帯域の拡大を図ることができる。 According to the speaker diaphragm of the present invention, a nickel matrix is formed on the surface of the diaphragm substrate, and a composite plating layer is formed using hard particles such as diamond, cubic boron, SiC, and aluminum oxide, and an inorganic layer is formed on top of this. By doing so, the rigidity and surface hardness of the diaphragm can be significantly increased, and the reproduction band can be expanded.
また、複合メツキ層の生成そのものは迅速に所
定の厚さにできると共に安価であるからこの上に
生成するスパツタ、イオンプレーテイングによる
無機質層は薄くてもよく、これによつて十分な硬
度を得ることができるから、生産時間は短かく生
産性は良好であつて安価な振動板とすることがで
きる。 In addition, since the composite plating layer itself can be quickly formed to a desired thickness and is inexpensive, the inorganic layer formed on top of it by spatter or ion plating may be thin, thereby achieving sufficient hardness. Therefore, the production time is short, the productivity is good, and the diaphragm can be made at low cost.
図面は本考案に係るスピーカの振動板の実施例
を示し、第１図はドーム型振動板の断面図、第２
図はコーン型振動板の断面図である。
１：振動板基体、２：複合メツキ層、３：無機
質層。
The drawings show an embodiment of the speaker diaphragm according to the present invention, and FIG. 1 is a sectional view of a dome-shaped diaphragm, and FIG.
The figure is a sectional view of a cone-shaped diaphragm. 1: Diaphragm base, 2: Composite plating layer, 3: Inorganic layer.
Claims (1)
スピーカ用振動板において、 振動板基体上に、ニツケルをマトリツクスと
し、ダイヤモンド、立方晶ボロン、Sic、酸化
アルミ等の硬質粒子による複合メツキ層が形成
され、該複合メツキ層上にはスパツタリング又
はイオンプレーテイングの方法により無機質層
が形成されていることを特徴とするスピーカの
振動板。 ２ 振動板基体が金属材料で形成されていること
を特徴とする実用新案登録請求の範囲第１項記
載のスピーカの振動板。 ３ 振動板基体が炭素繊維を熱硬化性樹脂で結着
成形されたものであることを特徴とする実用新
案登録請求の範囲第１項記載のスピーカの振動
板。[Scope of Claim for Utility Model Registration] 1. A diaphragm for a speaker having a laminated structure consisting of a diaphragm base and an inorganic layer, with a nickel matrix on the diaphragm base, diamond, cubic boron, SiC, aluminum oxide, etc. A diaphragm for a speaker, characterized in that a composite plating layer made of hard particles is formed, and an inorganic layer is formed on the composite plating layer by sputtering or ion plating. 2. The diaphragm for a speaker according to claim 1, wherein the diaphragm base is made of a metal material. 3. The speaker diaphragm according to claim 1, wherein the diaphragm base is formed by bonding and molding carbon fibers with a thermosetting resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15275882U JPS5957092U (en) | 1982-10-09 | 1982-10-09 | speaker diaphragm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15275882U JPS5957092U (en) | 1982-10-09 | 1982-10-09 | speaker diaphragm |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5957092U JPS5957092U (en) | 1984-04-13 |
| JPH028473Y2 true JPH028473Y2 (en) | 1990-02-28 |
Family
ID=30338156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15275882U Granted JPS5957092U (en) | 1982-10-09 | 1982-10-09 | speaker diaphragm |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5957092U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5711598A (en) * | 1980-06-26 | 1982-01-21 | Sony Corp | Acoustic diaphragm |
-
1982
- 1982-10-09 JP JP15275882U patent/JPS5957092U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5711598A (en) * | 1980-06-26 | 1982-01-21 | Sony Corp | Acoustic diaphragm |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5957092U (en) | 1984-04-13 |
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