JPH0284338U - - Google Patents

Info

Publication number
JPH0284338U
JPH0284338U JP1988164703U JP16470388U JPH0284338U JP H0284338 U JPH0284338 U JP H0284338U JP 1988164703 U JP1988164703 U JP 1988164703U JP 16470388 U JP16470388 U JP 16470388U JP H0284338 U JPH0284338 U JP H0284338U
Authority
JP
Japan
Prior art keywords
microprotrusions
semiconductor device
external lead
resin molded
molded semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988164703U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988164703U priority Critical patent/JPH0284338U/ja
Publication of JPH0284338U publication Critical patent/JPH0284338U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/0198
    • H10W72/536
    • H10W72/5363
    • H10W90/756

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1988164703U 1988-12-20 1988-12-20 Pending JPH0284338U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988164703U JPH0284338U (cg-RX-API-DMAC10.html) 1988-12-20 1988-12-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988164703U JPH0284338U (cg-RX-API-DMAC10.html) 1988-12-20 1988-12-20

Publications (1)

Publication Number Publication Date
JPH0284338U true JPH0284338U (cg-RX-API-DMAC10.html) 1990-06-29

Family

ID=31450546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988164703U Pending JPH0284338U (cg-RX-API-DMAC10.html) 1988-12-20 1988-12-20

Country Status (1)

Country Link
JP (1) JPH0284338U (cg-RX-API-DMAC10.html)

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