JPH0282038U - - Google Patents

Info

Publication number
JPH0282038U
JPH0282038U JP1988162932U JP16293288U JPH0282038U JP H0282038 U JPH0282038 U JP H0282038U JP 1988162932 U JP1988162932 U JP 1988162932U JP 16293288 U JP16293288 U JP 16293288U JP H0282038 U JPH0282038 U JP H0282038U
Authority
JP
Japan
Prior art keywords
film carrier
overlapping
lead terminals
same plane
conductive circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988162932U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988162932U priority Critical patent/JPH0282038U/ja
Publication of JPH0282038U publication Critical patent/JPH0282038U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1988162932U 1988-12-14 1988-12-14 Pending JPH0282038U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988162932U JPH0282038U (zh) 1988-12-14 1988-12-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988162932U JPH0282038U (zh) 1988-12-14 1988-12-14

Publications (1)

Publication Number Publication Date
JPH0282038U true JPH0282038U (zh) 1990-06-25

Family

ID=31447208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988162932U Pending JPH0282038U (zh) 1988-12-14 1988-12-14

Country Status (1)

Country Link
JP (1) JPH0282038U (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09306947A (ja) * 1996-05-10 1997-11-28 Nec Corp 半導体装置
JP2005079581A (ja) * 2003-09-03 2005-03-24 Samsung Electronics Co Ltd テープ基板、及びテープ基板を用いた半導体チップパッケージ、及び半導体チップパッケージを用いたｌｃｄ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09306947A (ja) * 1996-05-10 1997-11-28 Nec Corp 半導体装置
JP2005079581A (ja) * 2003-09-03 2005-03-24 Samsung Electronics Co Ltd テープ基板、及びテープ基板を用いた半導体チップパッケージ、及び半導体チップパッケージを用いたｌｃｄ装置

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