JPH028192U - - Google Patents

Info

Publication number
JPH028192U
JPH028192U JP8580688U JP8580688U JPH028192U JP H028192 U JPH028192 U JP H028192U JP 8580688 U JP8580688 U JP 8580688U JP 8580688 U JP8580688 U JP 8580688U JP H028192 U JPH028192 U JP H028192U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
heat
lead wire
power line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8580688U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8580688U priority Critical patent/JPH028192U/ja
Publication of JPH028192U publication Critical patent/JPH028192U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案を用いた電子機器の一部の装置
を示す斜視図、第2図、第3図は要部を示すを示
す斜視図、第4図は従来例を示す斜視図である。 6……シヤーシ、7……半導体、8……ヒート
シンク、9……送風機、10……プリント基板、
14……電源供給用のリード線、15……電源ラ
イン。
FIG. 1 is a perspective view showing a part of an electronic device using the present invention, FIGS. 2 and 3 are perspective views showing main parts, and FIG. 4 is a perspective view showing a conventional example. . 6... Chassis, 7... Semiconductor, 8... Heat sink, 9... Air blower, 10... Printed circuit board,
14... Lead wire for power supply, 15... Power line.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板に設けられた電子部品の被冷却物
にヒートシークを固定し、内蔵された電動機によ
り駆動する送風機をヒートシンクに密接させてプ
リント基板に設けると共に、プリント基板の固定
を兼ねた電源供給用のリード線をプリント基板の
電源ラインに接続したことを特徴とする電子部品
の冷却装置。
A heat seek is fixed to the electronic component to be cooled on the printed circuit board, and a blower driven by a built-in electric motor is installed on the printed circuit board in close contact with the heat sink. A cooling device for electronic components, characterized in that a lead wire is connected to a power line of a printed circuit board.
JP8580688U 1988-06-30 1988-06-30 Pending JPH028192U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8580688U JPH028192U (en) 1988-06-30 1988-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8580688U JPH028192U (en) 1988-06-30 1988-06-30

Publications (1)

Publication Number Publication Date
JPH028192U true JPH028192U (en) 1990-01-19

Family

ID=31310462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8580688U Pending JPH028192U (en) 1988-06-30 1988-06-30

Country Status (1)

Country Link
JP (1) JPH028192U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100867916B1 (en) * 2006-04-19 2008-11-10 가부시키가이샤 도요다 지도숏키 Power supply
KR20190124556A (en) * 2018-04-26 2019-11-05 엘에스산전 주식회사 Device for driving motor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100867916B1 (en) * 2006-04-19 2008-11-10 가부시키가이샤 도요다 지도숏키 Power supply
KR20190124556A (en) * 2018-04-26 2019-11-05 엘에스산전 주식회사 Device for driving motor
US10804662B2 (en) 2018-04-26 2020-10-13 Lsis Co., Ltd. Device for driving motor

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