JPH028147U - - Google Patents
Info
- Publication number
- JPH028147U JPH028147U JP1988086815U JP8681588U JPH028147U JP H028147 U JPH028147 U JP H028147U JP 1988086815 U JP1988086815 U JP 1988086815U JP 8681588 U JP8681588 U JP 8681588U JP H028147 U JPH028147 U JP H028147U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- heat dissipation
- ceramic mold
- houses
- protects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988086815U JPH028147U (en18) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988086815U JPH028147U (en18) | 1988-06-30 | 1988-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028147U true JPH028147U (en18) | 1990-01-19 |
Family
ID=31311456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988086815U Pending JPH028147U (en18) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028147U (en18) |
-
1988
- 1988-06-30 JP JP1988086815U patent/JPH028147U/ja active Pending