JPH028145U - - Google Patents

Info

Publication number
JPH028145U
JPH028145U JP1988086132U JP8613288U JPH028145U JP H028145 U JPH028145 U JP H028145U JP 1988086132 U JP1988086132 U JP 1988086132U JP 8613288 U JP8613288 U JP 8613288U JP H028145 U JPH028145 U JP H028145U
Authority
JP
Japan
Prior art keywords
electronic circuit
sealing
hybrid integrated
circuit
constituted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988086132U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988086132U priority Critical patent/JPH028145U/ja
Publication of JPH028145U publication Critical patent/JPH028145U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP1988086132U 1988-06-29 1988-06-29 Pending JPH028145U (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988086132U JPH028145U (it) 1988-06-29 1988-06-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988086132U JPH028145U (it) 1988-06-29 1988-06-29

Publications (1)

Publication Number Publication Date
JPH028145U true JPH028145U (it) 1990-01-19

Family

ID=31310777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988086132U Pending JPH028145U (it) 1988-06-29 1988-06-29

Country Status (1)

Country Link
JP (1) JPH028145U (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0779708A2 (en) 1995-12-14 1997-06-18 Murata Manufacturing Co., Ltd. Surface acoustic wave apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0779708A2 (en) 1995-12-14 1997-06-18 Murata Manufacturing Co., Ltd. Surface acoustic wave apparatus

Similar Documents

Publication Publication Date Title
JPS6284973U (it)
JPH028145U (it)
JPS62184727U (it)
JPS61144675U (it)
JPH0467372U (it)
JPS6416668U (it)
JPS63137975U (it)
JPS63165877U (it)
JPS6367278U (it)
JPS61100168U (it)
JPH0351872U (it)
JPH0183340U (it)
JPS6183073U (it)
JPS59135627U (ja) 複合チツプコンデンサ
JPS6312853U (it)
JPS6260069U (it)
JPS59107139U (ja) 回路基板のicチップ実装構造
JPH0167774U (it)
JPS6236578U (it)
JPS6371572U (it)
JPH0180975U (it)
JPH03110871U (it)
JPH0217868U (it)
JPS5936272U (ja) 印刷配線板
JPS63164246U (it)