JPH0281054U - - Google Patents
Info
- Publication number
- JPH0281054U JPH0281054U JP15935888U JP15935888U JPH0281054U JP H0281054 U JPH0281054 U JP H0281054U JP 15935888 U JP15935888 U JP 15935888U JP 15935888 U JP15935888 U JP 15935888U JP H0281054 U JPH0281054 U JP H0281054U
- Authority
- JP
- Japan
- Prior art keywords
- electrode pattern
- exterior case
- semiconductor element
- semiconductor package
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案に係る半導体パツケージの斜
視図、第２図は、第１図の矢視線Ａによる正面図
であり、リードを省略した図、第３図は、第１図
の矢視線Ｂによる背面図であり、リードを省略し
た図。
１０……半導体素子、１２……外装ケース、１
２ａ〜１２ｆ……面、１４……リード、１６……
電極パターン、１８……凹所。
1 is a perspective view of a semiconductor package according to the present invention, FIG. 2 is a front view along the arrow line A in FIG. 1, with leads omitted, and FIG. 3 is a view along the arrow line A in FIG. FIG. 4 is a rear view of B, with the leads omitted. 10...Semiconductor element, 12...Exterior case, 1
2a-12f...face, 14...lead, 16...
Electrode pattern, 18... recess.
Claims (1)
子と外周縁部のリード１４とを結ぶ電極パターン
１６を設けた短形板状の外装ケース１２を有する
半導体パツケージにおいて、 前記リード１４が前記外装ケース１２の一側面
１２ｆにのみ設けられ、 前記電極パターン１６が前記外装ケース１２の
２以上の表面１２ａ，１２ｂ，１２ｃ，１２ｄ，
１２ｅを利用して設けられたことを特徴とする半
導体パツケージ。[Claims for Utility Model Registration] In a semiconductor package having a rectangular plate-shaped exterior case 12 that houses a semiconductor element 10 in the center and is provided with an electrode pattern 16 connecting the semiconductor element and leads 14 on the outer periphery. , the lead 14 is provided only on one side 12f of the exterior case 12, and the electrode pattern 16 is provided on two or more surfaces 12a, 12b, 12c, 12d,
A semiconductor package characterized in that it is provided using 12e.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15935888U JPH0281054U (en) | 1988-12-09 | 1988-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15935888U JPH0281054U (en) | 1988-12-09 | 1988-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0281054U true JPH0281054U (en) | 1990-06-22 |
Family
ID=31440499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15935888U Pending JPH0281054U (en) | 1988-12-09 | 1988-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0281054U (en) |
-
1988
- 1988-12-09 JP JP15935888U patent/JPH0281054U/ja active Pending
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