JPH0281042U

JPH0281042U -

Info

Publication number: JPH0281042U
Application number: JP16079588U
Authority: JP
Priority date: 1988-12-13
Filing date: 1988-12-13
Publication date: 1990-06-22

Description

[Brief explanation of the drawing]

第１図は本考案による集積回路用パツケージの
一実施例を示す図であり、第１図Ａは分解斜視図
、第１図Ｂは蓋体をガイドレール内に挿入した状
態を示す背面図、第２図は従来の集積回路用パツ
ケージを示す図であり、第２図Ａはパツケージ本
体を示す斜視図、第２図Ｂは蓋体を示す斜視図、
第２図Ｃはパツケージ本体を示す正面図、第３図
は第２図の集積回路用パツケージにおいて蓋体を
パツケージ本体に載せた状態を示す図であり、第
３図Ａは斜視図、第３図Ｂは正面図である。１……パツケージ本体、２……開口部、３……
導電皮膜部、４……外部接続端子、５……蓋体、
６……ガイドレール。 FIG. 1 is a diagram showing an embodiment of an integrated circuit package according to the present invention, FIG. 1A is an exploded perspective view, FIG. 1B is a rear view showing a state in which the lid is inserted into the guide rail, FIG. 2 is a diagram showing a conventional integrated circuit package, FIG. 2A is a perspective view showing the package body, FIG. 2B is a perspective view showing the lid body,
2C is a front view showing the package body, FIG. 3 is a view showing the integrated circuit package of FIG. 2 with the lid placed on the package body, and FIG. 3A is a perspective view; Figure B is a front view. 1...package body, 2...opening, 3...
Conductive film portion, 4...external connection terminal, 5...lid body,
6...Guide rail.

Claims

[Scope of claim for utility model registration] A package body in which an integrated circuit is housed, an opening provided at the top of the package body, a ring-shaped conductive coating provided on the upper surface around the opening, and the opening. A lid body is placed on the conductive film part so as to cover the conductive film part, and the peripheral part is fixed to the conductive film part to airtightly seal the package body, and a lid body is provided on a part of the conductive film part to guide the lid body to the fixed position 1. A package for an integrated circuit, characterized by comprising a guide section for guiding the integrated circuit.