JPH0281035U - - Google Patents
Info
- Publication number
- JPH0281035U JPH0281035U JP16002988U JP16002988U JPH0281035U JP H0281035 U JPH0281035 U JP H0281035U JP 16002988 U JP16002988 U JP 16002988U JP 16002988 U JP16002988 U JP 16002988U JP H0281035 U JPH0281035 U JP H0281035U
- Authority
- JP
- Japan
- Prior art keywords
- furnace
- portion located
- semiconductor manufacturing
- furnace tube
- quartz
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010453 quartz Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Description
第１図は、この考案の半導体製造装置の一実施
例の縦断面図である。
１……均熱部石英管、２……炉口側部石英管、
３……キヤツプ、４……炉体均熱部、５……炉体
ヒーター部、６……接続テーパー部。
FIG. 1 is a longitudinal sectional view of an embodiment of the semiconductor manufacturing apparatus of this invention. 1... Quartz tube in the soaking section, 2... Quartz tube on the side of the furnace mouth,
3...Cap, 4...Furnace body soaking part, 5...Furnace body heater part, 6...Connection taper part.
Claims (1)
この石英炉心管内に挿入された半導体基板に加熱
処理を施す半導体製造装置において、前記石英炉
心管が前記加熱炉の均熱部に位置する部分と炉口
側に位置する部分とに分離されており着脱可能に
嵌合されていることを特徴とする半導体製造装置
。 A long quartz furnace tube is housed in the heating furnace.
In this semiconductor manufacturing apparatus that heat-treats a semiconductor substrate inserted into a quartz furnace tube, the quartz furnace tube is separated into a portion located in a soaking section of the heating furnace and a portion located on the furnace mouth side. A semiconductor manufacturing device characterized by being removably fitted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16002988U JPH0281035U (en) | 1988-12-09 | 1988-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16002988U JPH0281035U (en) | 1988-12-09 | 1988-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0281035U true JPH0281035U (en) | 1990-06-22 |
Family
ID=31441742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16002988U Pending JPH0281035U (en) | 1988-12-09 | 1988-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0281035U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259146A (en) * | 1992-03-09 | 1993-10-08 | Hitachi Ltd | Semiconductor manufacturing apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52150961A (en) * | 1976-06-11 | 1977-12-15 | Hitachi Ltd | Reaction tube in a heat treatment furnace |
| JPS58123719A (en) * | 1982-01-19 | 1983-07-23 | Seiko Instr & Electronics Ltd | Apparatus for manufacturing semiconductor device |
-
1988
- 1988-12-09 JP JP16002988U patent/JPH0281035U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52150961A (en) * | 1976-06-11 | 1977-12-15 | Hitachi Ltd | Reaction tube in a heat treatment furnace |
| JPS58123719A (en) * | 1982-01-19 | 1983-07-23 | Seiko Instr & Electronics Ltd | Apparatus for manufacturing semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259146A (en) * | 1992-03-09 | 1993-10-08 | Hitachi Ltd | Semiconductor manufacturing apparatus |