JPH028098U - - Google Patents
Info
- Publication number
- JPH028098U JPH028098U JP8540888U JP8540888U JPH028098U JP H028098 U JPH028098 U JP H028098U JP 8540888 U JP8540888 U JP 8540888U JP 8540888 U JP8540888 U JP 8540888U JP H028098 U JPH028098 U JP H028098U
- Authority
- JP
- Japan
- Prior art keywords
- fixing structure
- frequency electronic
- heat sink
- fixed
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8540888U JPH028098U (en:Method) | 1988-06-27 | 1988-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8540888U JPH028098U (en:Method) | 1988-06-27 | 1988-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028098U true JPH028098U (en:Method) | 1990-01-18 |
Family
ID=31310077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8540888U Pending JPH028098U (en:Method) | 1988-06-27 | 1988-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028098U (en:Method) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62156621U (en:Method) * | 1986-03-27 | 1987-10-05 | ||
| JPH09139592A (ja) * | 1995-11-15 | 1997-05-27 | Nec Corp | 電子装置の放熱構造 |
| JP2016503969A (ja) * | 2013-01-16 | 2016-02-08 | シーメンス リサーチ センター リミテッド ライアビリティ カンパニーSiemens Research Center Limited Liability Company | チップパッケージアッセンブリ |
-
1988
- 1988-06-27 JP JP8540888U patent/JPH028098U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62156621U (en:Method) * | 1986-03-27 | 1987-10-05 | ||
| JPH09139592A (ja) * | 1995-11-15 | 1997-05-27 | Nec Corp | 電子装置の放熱構造 |
| JP2016503969A (ja) * | 2013-01-16 | 2016-02-08 | シーメンス リサーチ センター リミテッド ライアビリティ カンパニーSiemens Research Center Limited Liability Company | チップパッケージアッセンブリ |
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