JPH028048U - - Google Patents

Info

Publication number
JPH028048U
JPH028048U JP8359888U JP8359888U JPH028048U JP H028048 U JPH028048 U JP H028048U JP 8359888 U JP8359888 U JP 8359888U JP 8359888 U JP8359888 U JP 8359888U JP H028048 U JPH028048 U JP H028048U
Authority
JP
Japan
Prior art keywords
lead
resin
out terminal
container
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8359888U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8359888U priority Critical patent/JPH028048U/ja
Publication of JPH028048U publication Critical patent/JPH028048U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP8359888U 1988-06-24 1988-06-24 Pending JPH028048U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8359888U JPH028048U (de) 1988-06-24 1988-06-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8359888U JPH028048U (de) 1988-06-24 1988-06-24

Publications (1)

Publication Number Publication Date
JPH028048U true JPH028048U (de) 1990-01-18

Family

ID=31308311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8359888U Pending JPH028048U (de) 1988-06-24 1988-06-24

Country Status (1)

Country Link
JP (1) JPH028048U (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014123618A (ja) * 2012-12-20 2014-07-03 Mitsubishi Electric Corp 半導体モジュール、その製造方法およびその接続方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6346755A (ja) * 1986-08-15 1988-02-27 Hitachi Ltd 絶縁モ−ルド型半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6346755A (ja) * 1986-08-15 1988-02-27 Hitachi Ltd 絶縁モ−ルド型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014123618A (ja) * 2012-12-20 2014-07-03 Mitsubishi Electric Corp 半導体モジュール、その製造方法およびその接続方法

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