JPH028042U - - Google Patents

Info

Publication number
JPH028042U
JPH028042U JP8385088U JP8385088U JPH028042U JP H028042 U JPH028042 U JP H028042U JP 8385088 U JP8385088 U JP 8385088U JP 8385088 U JP8385088 U JP 8385088U JP H028042 U JPH028042 U JP H028042U
Authority
JP
Japan
Prior art keywords
nut
external connection
outer envelope
plate material
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8385088U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451486Y2 (US20020051482A1-20020502-M00012.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8385088U priority Critical patent/JPH0451486Y2/ja
Publication of JPH028042U publication Critical patent/JPH028042U/ja
Application granted granted Critical
Publication of JPH0451486Y2 publication Critical patent/JPH0451486Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP8385088U 1988-06-27 1988-06-27 Expired JPH0451486Y2 (US20020051482A1-20020502-M00012.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8385088U JPH0451486Y2 (US20020051482A1-20020502-M00012.png) 1988-06-27 1988-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8385088U JPH0451486Y2 (US20020051482A1-20020502-M00012.png) 1988-06-27 1988-06-27

Publications (2)

Publication Number Publication Date
JPH028042U true JPH028042U (US20020051482A1-20020502-M00012.png) 1990-01-18
JPH0451486Y2 JPH0451486Y2 (US20020051482A1-20020502-M00012.png) 1992-12-03

Family

ID=31308559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8385088U Expired JPH0451486Y2 (US20020051482A1-20020502-M00012.png) 1988-06-27 1988-06-27

Country Status (1)

Country Link
JP (1) JPH0451486Y2 (US20020051482A1-20020502-M00012.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0474860U (US20020051482A1-20020502-M00012.png) * 1990-11-13 1992-06-30

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0474860U (US20020051482A1-20020502-M00012.png) * 1990-11-13 1992-06-30

Also Published As

Publication number Publication date
JPH0451486Y2 (US20020051482A1-20020502-M00012.png) 1992-12-03

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