JPH0279072U - - Google Patents
Info
- Publication number
- JPH0279072U JPH0279072U JP15856688U JP15856688U JPH0279072U JP H0279072 U JPH0279072 U JP H0279072U JP 15856688 U JP15856688 U JP 15856688U JP 15856688 U JP15856688 U JP 15856688U JP H0279072 U JPH0279072 U JP H0279072U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- resin
- insert
- length
- thickness direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 238000010586 diagram Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15856688U JPH0279072U (pl) | 1988-12-07 | 1988-12-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15856688U JPH0279072U (pl) | 1988-12-07 | 1988-12-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0279072U true JPH0279072U (pl) | 1990-06-18 |
Family
ID=31439011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15856688U Pending JPH0279072U (pl) | 1988-12-07 | 1988-12-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0279072U (pl) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997050280A1 (en) * | 1996-06-27 | 1997-12-31 | Asahi Kasei Kogyo Kabushiki Kaisha | Thick-film conductor circuit and production method therefor |
CN102222829A (zh) * | 2010-03-12 | 2011-10-19 | 日信工业株式会社 | 电子基板的电连接结构 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63175494A (ja) * | 1987-01-14 | 1988-07-19 | 古河電気工業株式会社 | モ−ルドプリント配線板 |
-
1988
- 1988-12-07 JP JP15856688U patent/JPH0279072U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63175494A (ja) * | 1987-01-14 | 1988-07-19 | 古河電気工業株式会社 | モ−ルドプリント配線板 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997050280A1 (en) * | 1996-06-27 | 1997-12-31 | Asahi Kasei Kogyo Kabushiki Kaisha | Thick-film conductor circuit and production method therefor |
CN102222829A (zh) * | 2010-03-12 | 2011-10-19 | 日信工业株式会社 | 电子基板的电连接结构 |
CN102222829B (zh) * | 2010-03-12 | 2016-06-15 | 日信工业株式会社 | 电子基板的电连接结构 |