JPH0279037U - - Google Patents
Info
- Publication number
- JPH0279037U JPH0279037U JP15900888U JP15900888U JPH0279037U JP H0279037 U JPH0279037 U JP H0279037U JP 15900888 U JP15900888 U JP 15900888U JP 15900888 U JP15900888 U JP 15900888U JP H0279037 U JPH0279037 U JP H0279037U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- roller
- adhesive tape
- suction stage
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 6
- 239000002390 adhesive tape Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988159008U JPH0727627Y2 (ja) | 1988-12-08 | 1988-12-08 | 半導体ウエハマウント装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988159008U JPH0727627Y2 (ja) | 1988-12-08 | 1988-12-08 | 半導体ウエハマウント装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0279037U true JPH0279037U (fi) | 1990-06-18 |
| JPH0727627Y2 JPH0727627Y2 (ja) | 1995-06-21 |
Family
ID=31439841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988159008U Expired - Lifetime JPH0727627Y2 (ja) | 1988-12-08 | 1988-12-08 | 半導体ウエハマウント装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727627Y2 (fi) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63166243A (ja) * | 1986-12-27 | 1988-07-09 | Mitsubishi Electric Corp | 半導体ウエハのテ−プ貼付装置 |
-
1988
- 1988-12-08 JP JP1988159008U patent/JPH0727627Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63166243A (ja) * | 1986-12-27 | 1988-07-09 | Mitsubishi Electric Corp | 半導体ウエハのテ−プ貼付装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727627Y2 (ja) | 1995-06-21 |