JPH0279037U - - Google Patents

Info

Publication number
JPH0279037U
JPH0279037U JP15900888U JP15900888U JPH0279037U JP H0279037 U JPH0279037 U JP H0279037U JP 15900888 U JP15900888 U JP 15900888U JP 15900888 U JP15900888 U JP 15900888U JP H0279037 U JPH0279037 U JP H0279037U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
roller
adhesive tape
suction stage
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15900888U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0727627Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988159008U priority Critical patent/JPH0727627Y2/ja
Publication of JPH0279037U publication Critical patent/JPH0279037U/ja
Application granted granted Critical
Publication of JPH0727627Y2 publication Critical patent/JPH0727627Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1988159008U 1988-12-08 1988-12-08 半導体ウエハマウント装置 Expired - Lifetime JPH0727627Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988159008U JPH0727627Y2 (ja) 1988-12-08 1988-12-08 半導体ウエハマウント装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988159008U JPH0727627Y2 (ja) 1988-12-08 1988-12-08 半導体ウエハマウント装置

Publications (2)

Publication Number Publication Date
JPH0279037U true JPH0279037U (enExample) 1990-06-18
JPH0727627Y2 JPH0727627Y2 (ja) 1995-06-21

Family

ID=31439841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988159008U Expired - Lifetime JPH0727627Y2 (ja) 1988-12-08 1988-12-08 半導体ウエハマウント装置

Country Status (1)

Country Link
JP (1) JPH0727627Y2 (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166243A (ja) * 1986-12-27 1988-07-09 Mitsubishi Electric Corp 半導体ウエハのテ−プ貼付装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166243A (ja) * 1986-12-27 1988-07-09 Mitsubishi Electric Corp 半導体ウエハのテ−プ貼付装置

Also Published As

Publication number Publication date
JPH0727627Y2 (ja) 1995-06-21

Similar Documents

Publication Publication Date Title
JPH0279037U (enExample)
JPH0415846U (enExample)
JPS63153531U (enExample)
JPS5920092U (ja) ベルト駆動機器用支持台構造
JPH0366929U (enExample)
JPS62118141U (enExample)
JPH0455134U (enExample)
JPS6088548U (ja) 半導体ウエ−ハの真空吸着具
JPH0270429U (enExample)
JPS6135752U (ja) ナツト締め付け装置用アタツチメント
JPH0425231U (enExample)
JPS58188280U (ja) 自転車の載置台
JPS6253931U (enExample)
JPH0440544U (enExample)
JPS6049119U (ja) 支柱付きベルトサポ−タ−
JPH0173963U (enExample)
JPS6381786U (enExample)
JPS5831989U (ja) 吸着式ハンドリング装置
JPH045645U (enExample)
JPH0479444U (enExample)
JPS6165746U (enExample)
JPS63175910U (enExample)
JPH0387665U (enExample)
JPS6295863U (enExample)
JPS63171367U (enExample)