JPH0278299U - - Google Patents
Info
- Publication number
- JPH0278299U JPH0278299U JP15638088U JP15638088U JPH0278299U JP H0278299 U JPH0278299 U JP H0278299U JP 15638088 U JP15638088 U JP 15638088U JP 15638088 U JP15638088 U JP 15638088U JP H0278299 U JPH0278299 U JP H0278299U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- nozzle
- water
- receiving plate
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15638088U JPH0278299U (ko) | 1988-11-30 | 1988-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15638088U JPH0278299U (ko) | 1988-11-30 | 1988-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0278299U true JPH0278299U (ko) | 1990-06-15 |
Family
ID=31434869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15638088U Pending JPH0278299U (ko) | 1988-11-30 | 1988-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0278299U (ko) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010110852A (ja) * | 2008-11-05 | 2010-05-20 | Calsonic Kansei Corp | 複数取りワークのトリミング加工装置 |
| US8884424B2 (en) | 2010-01-13 | 2014-11-11 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
| US9349611B2 (en) | 2010-03-22 | 2016-05-24 | Advanced Semiconductor Engineering, Inc. | Stackable semiconductor package and manufacturing method thereof |
| US9406658B2 (en) | 2010-12-17 | 2016-08-02 | Advanced Semiconductor Engineering, Inc. | Embedded component device and manufacturing methods thereof |
-
1988
- 1988-11-30 JP JP15638088U patent/JPH0278299U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010110852A (ja) * | 2008-11-05 | 2010-05-20 | Calsonic Kansei Corp | 複数取りワークのトリミング加工装置 |
| US8884424B2 (en) | 2010-01-13 | 2014-11-11 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
| US9196597B2 (en) | 2010-01-13 | 2015-11-24 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
| US9349611B2 (en) | 2010-03-22 | 2016-05-24 | Advanced Semiconductor Engineering, Inc. | Stackable semiconductor package and manufacturing method thereof |
| US9406658B2 (en) | 2010-12-17 | 2016-08-02 | Advanced Semiconductor Engineering, Inc. | Embedded component device and manufacturing methods thereof |