JPH0276852U - - Google Patents
Info
- Publication number
- JPH0276852U JPH0276852U JP1988156519U JP15651988U JPH0276852U JP H0276852 U JPH0276852 U JP H0276852U JP 1988156519 U JP1988156519 U JP 1988156519U JP 15651988 U JP15651988 U JP 15651988U JP H0276852 U JPH0276852 U JP H0276852U
- Authority
- JP
- Japan
- Prior art keywords
- section
- semiconductor device
- semiconductor light
- optical semiconductor
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 24
- 230000003287 optical effect Effects 0.000 claims description 14
- 230000005669 field effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- 230000003321 amplification Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988156519U JPH0276852U (uk) | 1988-11-30 | 1988-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988156519U JPH0276852U (uk) | 1988-11-30 | 1988-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0276852U true JPH0276852U (uk) | 1990-06-13 |
Family
ID=31435131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988156519U Pending JPH0276852U (uk) | 1988-11-30 | 1988-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0276852U (uk) |
-
1988
- 1988-11-30 JP JP1988156519U patent/JPH0276852U/ja active Pending