JPH0276845U - - Google Patents
Info
- Publication number
- JPH0276845U JPH0276845U JP15670388U JP15670388U JPH0276845U JP H0276845 U JPH0276845 U JP H0276845U JP 15670388 U JP15670388 U JP 15670388U JP 15670388 U JP15670388 U JP 15670388U JP H0276845 U JPH0276845 U JP H0276845U
- Authority
- JP
- Japan
- Prior art keywords
- locking
- semiconductor element
- chassis
- inner edge
- flat part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15670388U JPH0621252Y2 (ja) | 1988-12-02 | 1988-12-02 | 半導体素子の取付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15670388U JPH0621252Y2 (ja) | 1988-12-02 | 1988-12-02 | 半導体素子の取付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0276845U true JPH0276845U (el) | 1990-06-13 |
JPH0621252Y2 JPH0621252Y2 (ja) | 1994-06-01 |
Family
ID=31435480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15670388U Expired - Lifetime JPH0621252Y2 (ja) | 1988-12-02 | 1988-12-02 | 半導体素子の取付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0621252Y2 (el) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004086501A1 (ja) * | 2003-03-25 | 2004-10-07 | Toshiba Carrier Corporation | 放熱装置 |
WO2019139305A1 (ko) * | 2018-01-10 | 2019-07-18 | 엘지이노텍 주식회사 | 컨버터 |
CN115513073A (zh) * | 2022-11-23 | 2022-12-23 | 季华实验室 | 一种功率器件散热结构及其装配方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4323305B2 (ja) | 2003-12-25 | 2009-09-02 | アイシン精機株式会社 | 固定装置 |
US20230232718A1 (en) * | 2020-06-15 | 2023-07-20 | Lg Innotek Co., Ltd. | Thermoelectric module and power generation apparatus including the same |
-
1988
- 1988-12-02 JP JP15670388U patent/JPH0621252Y2/ja not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004086501A1 (ja) * | 2003-03-25 | 2004-10-07 | Toshiba Carrier Corporation | 放熱装置 |
CN100373600C (zh) * | 2003-03-25 | 2008-03-05 | 东芝开利株式会社 | 散热装置 |
WO2019139305A1 (ko) * | 2018-01-10 | 2019-07-18 | 엘지이노텍 주식회사 | 컨버터 |
CN115513073A (zh) * | 2022-11-23 | 2022-12-23 | 季华实验室 | 一种功率器件散热结构及其装配方法 |
CN115513073B (zh) * | 2022-11-23 | 2023-03-07 | 季华实验室 | 一种功率器件散热结构及其装配方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0621252Y2 (ja) | 1994-06-01 |