JPH0275774U - - Google Patents
Info
- Publication number
- JPH0275774U JPH0275774U JP15478888U JP15478888U JPH0275774U JP H0275774 U JPH0275774 U JP H0275774U JP 15478888 U JP15478888 U JP 15478888U JP 15478888 U JP15478888 U JP 15478888U JP H0275774 U JPH0275774 U JP H0275774U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- symmetrical
- circuit board
- printed circuit
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15478888U JPH0275774U (zh) | 1988-11-30 | 1988-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15478888U JPH0275774U (zh) | 1988-11-30 | 1988-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0275774U true JPH0275774U (zh) | 1990-06-11 |
Family
ID=31431835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15478888U Pending JPH0275774U (zh) | 1988-11-30 | 1988-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0275774U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011100987A (ja) * | 2009-10-07 | 2011-05-19 | Renesas Electronics Corp | 配線基板 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61256792A (ja) * | 1985-05-10 | 1986-11-14 | 松下電器産業株式会社 | プリント配線基板 |
| JPS62188398A (ja) * | 1986-02-14 | 1987-08-17 | 株式会社日立製作所 | ２極チツプ形電気部品の面実装方式 |
-
1988
- 1988-11-30 JP JP15478888U patent/JPH0275774U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61256792A (ja) * | 1985-05-10 | 1986-11-14 | 松下電器産業株式会社 | プリント配線基板 |
| JPS62188398A (ja) * | 1986-02-14 | 1987-08-17 | 株式会社日立製作所 | ２極チツプ形電気部品の面実装方式 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011100987A (ja) * | 2009-10-07 | 2011-05-19 | Renesas Electronics Corp | 配線基板 |