JPH0275771U - - Google Patents
Info
- Publication number
- JPH0275771U JPH0275771U JP15570988U JP15570988U JPH0275771U JP H0275771 U JPH0275771 U JP H0275771U JP 15570988 U JP15570988 U JP 15570988U JP 15570988 U JP15570988 U JP 15570988U JP H0275771 U JPH0275771 U JP H0275771U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- hole
- center
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15570988U JPH0275771U (zh) | 1988-11-29 | 1988-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15570988U JPH0275771U (zh) | 1988-11-29 | 1988-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0275771U true JPH0275771U (zh) | 1990-06-11 |
Family
ID=31433582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15570988U Pending JPH0275771U (zh) | 1988-11-29 | 1988-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0275771U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07147471A (ja) * | 1993-11-26 | 1995-06-06 | Nec Corp | 搭載用ｈｉｃモジュール用接続金具 |
-
1988
- 1988-11-29 JP JP15570988U patent/JPH0275771U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07147471A (ja) * | 1993-11-26 | 1995-06-06 | Nec Corp | 搭載用ｈｉｃモジュール用接続金具 |