JPH0275729U - - Google Patents
Info
- Publication number
- JPH0275729U JPH0275729U JP15500688U JP15500688U JPH0275729U JP H0275729 U JPH0275729 U JP H0275729U JP 15500688 U JP15500688 U JP 15500688U JP 15500688 U JP15500688 U JP 15500688U JP H0275729 U JPH0275729 U JP H0275729U
- Authority
- JP
- Japan
- Prior art keywords
- jig
- chip thermistor
- pellet
- monitoring
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
- 238000011156 evaluation Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000012544 monitoring process Methods 0.000 claims 2
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15500688U JPH0275729U (US20100056889A1-20100304-C00004.png) | 1988-11-28 | 1988-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15500688U JPH0275729U (US20100056889A1-20100304-C00004.png) | 1988-11-28 | 1988-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0275729U true JPH0275729U (US20100056889A1-20100304-C00004.png) | 1990-06-11 |
Family
ID=31432241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15500688U Pending JPH0275729U (US20100056889A1-20100304-C00004.png) | 1988-11-28 | 1988-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0275729U (US20100056889A1-20100304-C00004.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015137023A1 (ja) * | 2014-03-11 | 2015-09-17 | 新東工業株式会社 | 被試験デバイスの検査システム、及びその操作方法 |
| WO2016117105A1 (ja) * | 2015-01-23 | 2016-07-28 | 三菱電機株式会社 | 半導体装置評価用治具、半導体装置評価装置および半導体装置評価方法 |
-
1988
- 1988-11-28 JP JP15500688U patent/JPH0275729U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015137023A1 (ja) * | 2014-03-11 | 2015-09-17 | 新東工業株式会社 | 被試験デバイスの検査システム、及びその操作方法 |
| JPWO2015137023A1 (ja) * | 2014-03-11 | 2017-04-06 | 新東工業株式会社 | 被試験デバイスの検査システム、及びその操作方法 |
| US10161990B2 (en) | 2014-03-11 | 2018-12-25 | Sintokogio, Ltd. | Inspection system for device to be tested, and method for operating inspection system for device to be tested |
| WO2016117105A1 (ja) * | 2015-01-23 | 2016-07-28 | 三菱電機株式会社 | 半導体装置評価用治具、半導体装置評価装置および半導体装置評価方法 |
| JPWO2016117105A1 (ja) * | 2015-01-23 | 2017-10-05 | 三菱電機株式会社 | 半導体装置評価用治具、半導体装置評価装置および半導体装置評価方法 |
| US10168380B2 (en) | 2015-01-23 | 2019-01-01 | Mitsubishi Electric Corporation | Semiconductor device evaluation jig, semiconductor device evaluation apparatus, and semiconductor device evaluation method |
