JPH0275726U - - Google Patents

Info

Publication number
JPH0275726U
JPH0275726U JP15500288U JP15500288U JPH0275726U JP H0275726 U JPH0275726 U JP H0275726U JP 15500288 U JP15500288 U JP 15500288U JP 15500288 U JP15500288 U JP 15500288U JP H0275726 U JPH0275726 U JP H0275726U
Authority
JP
Japan
Prior art keywords
die bonding
base
solder
irradiate
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15500288U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15500288U priority Critical patent/JPH0275726U/ja
Publication of JPH0275726U publication Critical patent/JPH0275726U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP15500288U 1988-11-28 1988-11-28 Pending JPH0275726U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15500288U JPH0275726U (enrdf_load_stackoverflow) 1988-11-28 1988-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15500288U JPH0275726U (enrdf_load_stackoverflow) 1988-11-28 1988-11-28

Publications (1)

Publication Number Publication Date
JPH0275726U true JPH0275726U (enrdf_load_stackoverflow) 1990-06-11

Family

ID=31432233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15500288U Pending JPH0275726U (enrdf_load_stackoverflow) 1988-11-28 1988-11-28

Country Status (1)

Country Link
JP (1) JPH0275726U (enrdf_load_stackoverflow)

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