JPH0228361U - - Google Patents
Info
- Publication number
- JPH0228361U JPH0228361U JP1988104018U JP10401888U JPH0228361U JP H0228361 U JPH0228361 U JP H0228361U JP 1988104018 U JP1988104018 U JP 1988104018U JP 10401888 U JP10401888 U JP 10401888U JP H0228361 U JPH0228361 U JP H0228361U
- Authority
- JP
- Japan
- Prior art keywords
- solder layer
- heat
- adhesive layer
- heating device
- laser heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 238000004093 laser heating Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988104018U JPH0730209Y2 (ja) | 1988-08-08 | 1988-08-08 | ハイブリッド基板及びハイブリッド基板用レーザ加熱装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988104018U JPH0730209Y2 (ja) | 1988-08-08 | 1988-08-08 | ハイブリッド基板及びハイブリッド基板用レーザ加熱装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0228361U true JPH0228361U (enrdf_load_stackoverflow) | 1990-02-23 |
| JPH0730209Y2 JPH0730209Y2 (ja) | 1995-07-12 |
Family
ID=31335365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988104018U Expired - Lifetime JPH0730209Y2 (ja) | 1988-08-08 | 1988-08-08 | ハイブリッド基板及びハイブリッド基板用レーザ加熱装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0730209Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8981249B2 (en) | 2007-03-28 | 2015-03-17 | Mazda Motor Corporation | Joining structure and method of metal works |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55159579U (enrdf_load_stackoverflow) * | 1979-05-04 | 1980-11-15 | ||
| JPS5950597A (ja) * | 1982-09-16 | 1984-03-23 | 松下電器産業株式会社 | 電子回路部品の取付方法 |
| JPS62206896A (ja) * | 1986-03-06 | 1987-09-11 | 富士通株式会社 | リフロ−はんだ付け接合方式 |
-
1988
- 1988-08-08 JP JP1988104018U patent/JPH0730209Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55159579U (enrdf_load_stackoverflow) * | 1979-05-04 | 1980-11-15 | ||
| JPS5950597A (ja) * | 1982-09-16 | 1984-03-23 | 松下電器産業株式会社 | 電子回路部品の取付方法 |
| JPS62206896A (ja) * | 1986-03-06 | 1987-09-11 | 富士通株式会社 | リフロ−はんだ付け接合方式 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8981249B2 (en) | 2007-03-28 | 2015-03-17 | Mazda Motor Corporation | Joining structure and method of metal works |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0730209Y2 (ja) | 1995-07-12 |