JPH0274565A - Aluminum nitride based calcined compact - Google Patents
Aluminum nitride based calcined compactInfo
- Publication number
- JPH0274565A JPH0274565A JP63227878A JP22787888A JPH0274565A JP H0274565 A JPH0274565 A JP H0274565A JP 63227878 A JP63227878 A JP 63227878A JP 22787888 A JP22787888 A JP 22787888A JP H0274565 A JPH0274565 A JP H0274565A
- Authority
- JP
- Japan
- Prior art keywords
- amount
- weight
- compound
- thermal conductivity
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 title claims description 21
- 150000001875 compounds Chemical class 0.000 claims abstract description 29
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 26
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 25
- 239000001301 oxygen Substances 0.000 claims description 25
- 239000012752 auxiliary agent Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000012535 impurity Substances 0.000 abstract description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 2
- 238000001354 calcination Methods 0.000 abstract 1
- 150000001768 cations Chemical class 0.000 abstract 1
- 238000010304 firing Methods 0.000 description 13
- 239000000843 powder Substances 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- -1 Si content Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は熱伝導性の高い窒化アルミニウム質焼結体に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an aluminum nitride sintered body having high thermal conductivity.
近年、LSIの発達に伴い、高集積回路、パワートラン
ジスタ、レーザーダイオードなどの発熱量の大きい半導
体素子を実装するために熱伝導率の高い絶縁材料が必要
とされてきている。In recent years, with the development of LSI, insulating materials with high thermal conductivity have been required for mounting semiconductor elements that generate a large amount of heat, such as highly integrated circuits, power transistors, and laser diodes.
このような熱伝導率の高いセラミック材料としては、従
来酸化ベリリウム(Bed)系焼結体が用いられてきた
が、その毒性のために使用範囲が限定されている。Conventionally, beryllium oxide (Bed)-based sintered bodies have been used as such ceramic materials with high thermal conductivity, but their range of use is limited due to their toxicity.
そこで、酸化ベリリウムに変わる高熱伝導性基板材料と
して、熱伝導率が高く、しかも安定で、高温強度も高く
、電気絶縁性のよい窒化アルミニウム(AβN)が使用
されるようになってきている。Therefore, aluminum nitride (AβN), which has high thermal conductivity, is stable, has high high-temperature strength, and has good electrical insulation, is being used as a highly thermally conductive substrate material to replace beryllium oxide.
窒化アルミニウム粉末は難焼結性であって、単味では焼
結し難いため、窒化アルミニウム原料粉末に焼結助剤を
添加して焼結体を製造することが行われており、適当な
焼結助剤としては、周期律表のUa族金属(アルカリ土
類金属)もしくは■a族金属(Yおよび希土類金属)の
化合物、例えば代表的にはY2O,やCaOなどを単独
で添加することが提案されている。(特開昭60−12
7267号公報、特開昭50−23411号公報)
〔発明が解決しようとする問題点〕
しかし乍ら、Y2O,単独添加では高熱伝導性を有する
窒化アルミニウム質焼結体は得られるが、原料が高価で
あると同時に焼成温度が約1850°C以上と高く大量
生産上不利である。一方、CaO単独添加では原料が安
価であると同時に焼成温度が約1750°C以下と低温
であり、大量生産上有利ではあるが熱伝導率が低し・と
いう問題があった。Aluminum nitride powder is difficult to sinter, and it is difficult to sinter it alone. Therefore, a sintered body is manufactured by adding a sintering aid to the aluminum nitride raw material powder. As a binder, compounds of group Ua metals (alkaline earth metals) or group A metals (Y and rare earth metals) of the periodic table, such as typically Y2O or CaO, can be added alone. Proposed. (Unexamined Japanese Patent Publication No. 60-12
(No. 7267, Japanese Unexamined Patent Publication No. 50-23411) [Problems to be solved by the invention] However, when Y2O is added alone, an aluminum nitride sintered body having high thermal conductivity can be obtained, but the raw material It is expensive and has a high firing temperature of about 1850° C. or higher, which is disadvantageous for mass production. On the other hand, when CaO is added alone, the raw material is inexpensive and the firing temperature is low at about 1750° C. or less, which is advantageous for mass production, but has the problem of low thermal conductivity.
[発明の目的]
本発明においては低温焼成が可能で熱伝導率が品く大量
生産に適した窒化アルミニウム質焼結体を提供すること
を目的とする。[Object of the Invention] An object of the present invention is to provide an aluminum nitride sintered body that can be fired at low temperatures, has good thermal conductivity, and is suitable for mass production.
本発明者は上記問題点に鑑み鋭意研究の結果、窒化アル
ミニウムを主体とし、これに助剤としてCa化合物及び
Y化合物を一定量複合添加し、焼成して得られた焼結体
であって、この焼結体中の酸素〒Si及びFe(Jが一
定量以下に制御した焼結体が熱伝導率が高く、高密度で
低温焼成が可能であることを知見した。In view of the above-mentioned problems, the present inventor has conducted extensive research and has found a sintered body made of aluminum nitride as a main ingredient, to which a certain amount of a Ca compound and a Y compound are added as auxiliary agents, and then fired. It has been found that a sintered body in which the oxygen (Si and Fe) (J) in the sintered body is controlled to a certain amount or less has a high thermal conductivity, and can be fired at a high density and at a low temperature.
本発明によれば、窒化アルミニウムを主体とする窒化ア
ルミニウム質焼結体において、助剤として少なくともC
a化合物とY化合物を用い、Ca化合物をCaOとして
0.005〜4重量%、Y化合物をY2O3として0.
2〜10重量%の割合で含有し、また、助剤中の酸素量
を焼結体の全酸素量から差し引いた残りの酸素量を3重
量%以下、Si含有量を0.7重量%以下、Fe含有量
を0.5重量%以下に制御することにより、上記目的が
達成される。According to the present invention, in an aluminum nitride sintered body mainly composed of aluminum nitride, at least C is used as an auxiliary agent.
Using compound a and compound Y, the Ca compound is 0.005 to 4% by weight as CaO, and the Y compound is 0.00% by weight as Y2O3.
Contained at a ratio of 2 to 10% by weight, and the remaining oxygen amount after subtracting the oxygen amount in the auxiliary agent from the total oxygen amount of the sintered body is 3% by weight or less, and the Si content is 0.7% by weight or less The above object is achieved by controlling the Fe content to 0.5% by weight or less.
以下、本発明を次の例で説明する。The invention will now be explained with the following examples.
本発明における1つの特徴は助剤としてCa化合物とy
化合物とを同時に用いる点にある。Ca化合物はCaO
として0.005〜4重量%、Y化合物はY2O3とし
て0.2〜10重世%の割合で、好ましくはCa00.
01〜2.7重里%、y2o、 2.0〜8.5重量%
のSす合で含有する。これにより、各々単独添加に比し
て両者の相乗的効果により高い熱伝五性が達成されると
ともに、低温焼成が可能となるが、Ca化化合物化化合
物いずれかが上記範囲を逸脱しても高熱伝導性は得られ
ない。One feature of the present invention is that Ca compound and y
The point is that the compound is used at the same time. Ca compound is CaO
The proportion of Y compound is 0.2 to 10% by weight as Y2O3, preferably Ca00.
01-2.7 Shigesato%, y2o, 2.0-8.5% by weight
Contains S in total. As a result, higher heat conductivity is achieved due to the synergistic effect of both than when each is added alone, and low-temperature firing is possible. However, even if either of the Ca compounds exceeds the above range, High thermal conductivity cannot be obtained.
また、本発明の他の特徴は焼結体に存在する全酸素量か
ら、助剤成分から混入する酸素量を差し引いた残りの酸
素■(以下、単に過剰酸素量と言う)が3重量%以下、
特に2,6重量%以下である点にある。この過剰酸素は
主として窒化アルミニウム原料等から、不純物や吸着酸
素として混入したり、製造工程中の粉砕等の処理時に混
入するもので、この過剰酸素が熱伝導率に大きく寄与し
、過剰酸素量が3重量%を超えると熱伝導率が大きく低
下する。Another feature of the present invention is that the amount of oxygen remaining after subtracting the amount of oxygen mixed in from the auxiliary component from the total amount of oxygen present in the sintered body (hereinafter simply referred to as excess oxygen amount) is 3% by weight or less. ,
In particular, it is 2.6% by weight or less. This excess oxygen is mainly mixed in as impurities and adsorbed oxygen from aluminum nitride raw materials, etc., or mixed in during processing such as crushing during the manufacturing process.This excess oxygen greatly contributes to thermal conductivity, and the amount of excess oxygen increases. If it exceeds 3% by weight, the thermal conductivity will decrease significantly.
さらに本発明の他の特徴は、焼結体中に混入する陽イオ
ン不純物のうち、特にSi含有量とFe含有量を同時に
特定量以下に制限することにある。これらも原料粉末あ
るいは粉砕工程中から混入し易いものであるが、本発明
によれば、Si含有量を0゜7重量%以下、特に0.2
重量%以下、Fe含有量を0.5重量%以下、特に0.
2重量%以下に制御することによって高熱伝導性が達成
される。Furthermore, another feature of the present invention is that among the cationic impurities mixed into the sintered body, particularly the Si content and the Fe content are simultaneously limited to a specific amount or less. These are also easily mixed in from the raw material powder or during the grinding process, but according to the present invention, the Si content is reduced to 0.7% by weight or less, especially 0.2% by weight.
% by weight or less, Fe content is 0.5% by weight or less, especially 0.5% by weight or less.
High thermal conductivity can be achieved by controlling the content to 2% by weight or less.
本発明に従い、窒化アルミニウム質焼結体において、C
a化合物量、Y化合物量、過剰酸素量、Si含有量、F
e含有量を前記した範囲に設定することにより、熱導電
率100w/m″′に以上が達成される。According to the present invention, in the aluminum nitride sintered body, C
A compound amount, Y compound amount, excess oxygen amount, Si content, F
By setting the e content within the above-mentioned range, a thermal conductivity of 100 w/m'' or more can be achieved.
本発明の窒化アルミニウム質焼結体の製造に際し、助剤
として用いられるCa化合物としてはCab。The Ca compound used as an auxiliary agent in producing the aluminum nitride sintered body of the present invention is Cab.
CaF 21 CaC2l CaB6 、CaCl z
1CaCO31CaCNz 、CaJ z 、Y化合
物としてはY2O2、YF3.YN、YHz、YC,Y
B6等が挙げられ、それぞれCaO換算で0.005〜
4重量%、Y2O3換算で0.2〜10重量%の割合で
窒化アルミニウム粉末と混合される。CaF 21 CaC2l CaB6 , CaCl z
1CaCO31CaCNz, CaJz, Y compounds include Y2O2, YF3. YN, YHz, YC, Y
Examples include B6, each with a CaO conversion of 0.005~
It is mixed with aluminum nitride powder at a ratio of 4% by weight, or 0.2 to 10% by weight in terms of Y2O3.
混合された粉末は、所望によりバインダーを添加し、周
知の成形手段で成形する。具体的には一軸プレス、ラバ
ープレス、ドクターブレード成形、鋳込成形等が採用さ
れ得る。A binder may be added to the mixed powder if desired, and the mixture may be molded using a known molding method. Specifically, uniaxial press, rubber press, doctor blade molding, casting molding, etc. may be employed.
成形体は次に焼成されるが、焼成は前述した組成にする
ことによって1600〜1850℃での焼成が可能とな
る。焼成中の雰囲気は窒素、水素、Ar、Ile又はこ
れらの混合ガス等の非酸化性雰囲気中で行われ、焼成手
段としては、常圧焼成、ホットプレス焼成、窒素ガス圧
力焼成等が採用されるが、量産性の点から常圧焼成が好
ましい。The molded body is then fired, and by using the composition described above, firing can be performed at 1600 to 1850°C. The atmosphere during firing is a non-oxidizing atmosphere such as nitrogen, hydrogen, Ar, Hele, or a mixture thereof, and the firing means include normal pressure firing, hot press firing, nitrogen gas pressure firing, etc. However, from the viewpoint of mass production, normal pressure firing is preferable.
このようにして得られる窒化アルミニウム質焼結体は相
対密度95に以上の高緻密体であるが、本発明によれば
、高熱伝導率を得るために、過剰酸素量、Si含有量、
Fe含有量を所定量以下に制御することが必要である。The aluminum nitride sintered body thus obtained is a highly dense body with a relative density of 95 or more, but according to the present invention, in order to obtain high thermal conductivity, the amount of excess oxygen, Si content,
It is necessary to control the Fe content to a predetermined amount or less.
そのためには、まず窒化アルミニウム原料粉末として酸
素量3重量%以下、Si含有量0.7重量%以下、Fe
含有量0.5重量%以下のものを用いることが必要であ
り、且つ粉砕時の混入を避けるこめに粉砕機の内張り、
或いは粉砕メディアを例えば高純度なアルミナ、プラス
千ツク(樹脂)、耐摩耗性窒化珪素、炭化珪素又はhc
にしたり、湿式混合を行う際は、スラリーの粘度をでき
るだけ高くしたり、時間を短くしたりする等の工夫をす
ることが必要である。To do this, first, aluminum nitride raw material powder must have an oxygen content of 3% by weight or less, a Si content of 0.7% by weight or less, and a Fe
It is necessary to use a material with a content of 0.5% by weight or less, and to avoid contamination during grinding, the lining of the grinder,
Alternatively, the grinding media may be made of, for example, high-purity alumina, plastic (resin), wear-resistant silicon nitride, silicon carbide, or hc.
When mixing or wet mixing, it is necessary to take measures such as increasing the viscosity of the slurry as much as possible and shortening the time.
以下、本発明を次の例で説明する。The invention will now be explained with the following examples.
〔実施例
平均粒径0.5〜3μm、酸素含有量2.8重量%以下
、Si含有量0.6重量%以下、Fe含有量4.5重量
%以下の各種窒化アルミニウム粉末に第1表に示すよう
なCa化合物、Y化合物を添加配合し、これをボールミ
ルでメタノール中で湿式混合した。[Example Table 1] Various aluminum nitride powders with an average particle size of 0.5 to 3 μm, an oxygen content of 2.8% by weight or less, a Si content of 0.6% by weight or less, and an Fe content of 4.5% by weight or less A Ca compound and a Y compound as shown in the following were added and blended, and the mixture was wet-mixed in methanol using a ball mill.
これにパラフィンワックスとステアリン酸及び若干量の
バインダーを加えて混合したものを成形圧1000Kg
/cm2でプレス成形した。Paraffin wax, stearic acid, and a small amount of binder were added to this and mixed at a molding pressure of 1000 kg.
/cm2.
次に得られた成形体を常法により300℃で2時間脱バ
インダー処理後、窒化雰囲気で第1表の焼成条件で焼成
した。Next, the obtained molded body was subjected to a binder removal treatment at 300° C. for 2 hours by a conventional method, and then fired under the firing conditions shown in Table 1 in a nitriding atmosphere.
得られた焼結体に対し、アルキメデス法に従い相対密度
を、レーザーフラッシュ法で熱伝導率を測定した。The relative density of the obtained sintered body was measured according to the Archimedes method, and the thermal conductivity was measured using the laser flash method.
また、過剰酸素量はLECO社の酸素窒素同時分析装置
により全酸素量を測定し助剤として酸化物、炭酸化物等
を用いたものに対し、化学量論的に結合している酸素量
を全酸素量から差し引いて算出した。さらに、焼結体中
のSi含有量、Fe含有量をICP法によって定量した
。In addition, the amount of excess oxygen is determined by measuring the total amount of oxygen using LECO's simultaneous oxygen and nitrogen analyzer. It was calculated by subtracting it from the amount of oxygen. Furthermore, the Si content and Fe content in the sintered body were determined by ICP method.
また、比較例として過剰酸素量、Si含有量、Fe含有
量の異なる窒化アルミニウム原料粉末を用いたり、粉砕
時のボールあるいは粉砕時間を変える以外は前述の方法
と同様にして製造し、過剰酸素量、Si含有量、Fe含
有量の異なる数種の焼結体を得、前述と同様な方法で特
性を測定した。In addition, as a comparative example, aluminum nitride raw material powders with different amounts of excess oxygen, Si content, and Fe content were used, and the production was performed in the same manner as described above except for changing the grinding balls or grinding time. , Si content, and Fe content were obtained, and their properties were measured in the same manner as described above.
第1表の結果によれば、Ca化合物量、Y化合物量、過
剰酸素量、Si含有量、Fe含有量のいずれかが本発明
の範囲から逸脱した11k116〜23の試料はいずれ
も熱伝専度が低いもので、特にCa化合物の量が少ない
場合(N119,23 )は焼成温度を高く設定する必
要がある。According to the results in Table 1, all of the samples 11k116-23 in which any of the Ca compound amount, Y compound amount, excess oxygen amount, Si content, and Fe content deviated from the range of the present invention were heat transfer only. When the temperature is low, especially when the amount of Ca compound is small (N119,23), it is necessary to set the firing temperature high.
これに対し、本発明の試料階1〜15はいずれも185
0℃以下での焼成により98%以上の相対密度を有し、
且つ熱伝導率100W/m ’ k以上の焼結体が得ら
れた。その中でも助剤成分の含量が4重世%以上のもの
(階l 〜7.9〜12.15)では125w/m ’
k以上が達成され、さらに助剤成分の合量が8重量%
以下で且つ、(yzo3/cao)重量比が10以上の
もの(lhl 〜4.9〜11)は145 w/m ’
k以上が達成された。In contrast, sample floors 1 to 15 of the present invention all have 185
It has a relative density of 98% or more by firing at 0°C or less,
Moreover, a sintered body with a thermal conductivity of 100 W/m'k or more was obtained. Among them, those with an auxiliary component content of 4% or more (floor l ~7.9~12.15) are 125w/m'
K or more was achieved, and the total amount of auxiliary components was 8% by weight.
145 w/m' for those with a (yzo3/cao) weight ratio of 10 or more (lhl ~4.9-11)
More than k was achieved.
以上、詳述した通り、本発明の窒化アルミニウム質焼結
体は熱伝導率100w/m ’ k以上の優れた特性を
示すもので且つ、常圧焼成としての焼結性に優れ、高密
度の焼結体が得られることから、量産性にも優れるもの
で、高熱伝導性が要求される半導体素子実装用基板をは
じめサイリスク用放熱基板等の基板材料として特に有効
である。As detailed above, the aluminum nitride sintered body of the present invention exhibits excellent properties such as a thermal conductivity of 100 w/m'k or more, has excellent sinterability when fired under normal pressure, and has a high density. Since a sintered body can be obtained, it is excellent in mass production, and is particularly effective as a substrate material for semiconductor element mounting substrates that require high thermal conductivity, as well as heat dissipation substrates for cyrisks.
Claims (1)
及びY化合物を含有する焼結体であって、前記Ca化合
物をCaOとして0.005〜4重量%、Y化合物をY
_2O_3として0.2〜10重量%の割合で含有し、
助剤中の酸素量を焼結体の全酸素量から差し引いた残り
の酸素量が3重量%以下であり、Si含有量が0.7重
量%以下、Fe含有量が0.5重量%以下であることを
特徴とする窒化アルミニウム質焼結体。A sintered body mainly composed of aluminum nitride and containing a Ca compound and a Y compound as auxiliaries, wherein the Ca compound is 0.005 to 4% by weight as CaO, and the Y compound is Y
Contained in a proportion of 0.2 to 10% by weight as _2O_3,
The amount of oxygen remaining after subtracting the amount of oxygen in the auxiliary agent from the total amount of oxygen in the sintered body is 3% by weight or less, the Si content is 0.7% by weight or less, and the Fe content is 0.5% by weight or less. An aluminum nitride sintered body characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63227878A JPH0717457B2 (en) | 1988-09-12 | 1988-09-12 | Aluminum nitride sintered body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63227878A JPH0717457B2 (en) | 1988-09-12 | 1988-09-12 | Aluminum nitride sintered body |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0274565A true JPH0274565A (en) | 1990-03-14 |
JPH0717457B2 JPH0717457B2 (en) | 1995-03-01 |
Family
ID=16867762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63227878A Expired - Lifetime JPH0717457B2 (en) | 1988-09-12 | 1988-09-12 | Aluminum nitride sintered body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0717457B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140066287A1 (en) * | 2012-08-31 | 2014-03-06 | CMC Laboratories, Inc. | Low Cost Manufacture of High Reflectivity Aluminum Nitride Substrates |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6071575A (en) * | 1983-09-26 | 1985-04-23 | 株式会社トクヤマ | Aluminum nitride sintered body |
JPS61201668A (en) * | 1985-03-01 | 1986-09-06 | 住友電気工業株式会社 | High heat conducting aluminum nitride sintered body and manufacture |
JPS6241766A (en) * | 1985-08-13 | 1987-02-23 | 株式会社トクヤマ | Aluminum nitride sintered body and manufacture |
JPS6252180A (en) * | 1985-08-30 | 1987-03-06 | 株式会社トクヤマ | Aluminum nitride composition |
JPS62105960A (en) * | 1985-10-30 | 1987-05-16 | 株式会社トクヤマ | Manufacture of aluminum nitride sintered body |
JPS62108775A (en) * | 1985-11-08 | 1987-05-20 | 株式会社トクヤマ | Manufacture of aluminum nitride sintered body |
JPS62138363A (en) * | 1985-12-07 | 1987-06-22 | 株式会社トクヤマ | Aluminum nitride composition |
JPS62153172A (en) * | 1985-12-26 | 1987-07-08 | 株式会社トクヤマ | Manufacture of aluminum nitride sintered body |
JPS6325278A (en) * | 1986-07-18 | 1988-02-02 | 株式会社トクヤマ | Manufacture of aluminum nitride sintered body |
JPS63195175A (en) * | 1987-02-09 | 1988-08-12 | 川崎製鉄株式会社 | Composition for sintering aluminum nitride |
JPS63222074A (en) * | 1987-03-12 | 1988-09-14 | 新日本化学工業株式会社 | Manufacture of aluminum nitride sintered body |
JPS63236765A (en) * | 1987-03-26 | 1988-10-03 | 品川白煉瓦株式会社 | Aluminum nitride sintered body |
JPS6456370A (en) * | 1987-08-28 | 1989-03-03 | Sumitomo Electric Industries | Highly heat-conductive aluminum nitride sintered body |
JPH0269362A (en) * | 1988-09-06 | 1990-03-08 | Asahi Chem Ind Co Ltd | Production of aluminum nitride sintered compact |
-
1988
- 1988-09-12 JP JP63227878A patent/JPH0717457B2/en not_active Expired - Lifetime
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6071575A (en) * | 1983-09-26 | 1985-04-23 | 株式会社トクヤマ | Aluminum nitride sintered body |
JPS61201668A (en) * | 1985-03-01 | 1986-09-06 | 住友電気工業株式会社 | High heat conducting aluminum nitride sintered body and manufacture |
JPS6241766A (en) * | 1985-08-13 | 1987-02-23 | 株式会社トクヤマ | Aluminum nitride sintered body and manufacture |
JPS6252180A (en) * | 1985-08-30 | 1987-03-06 | 株式会社トクヤマ | Aluminum nitride composition |
JPS62105960A (en) * | 1985-10-30 | 1987-05-16 | 株式会社トクヤマ | Manufacture of aluminum nitride sintered body |
JPS62108775A (en) * | 1985-11-08 | 1987-05-20 | 株式会社トクヤマ | Manufacture of aluminum nitride sintered body |
JPS62138363A (en) * | 1985-12-07 | 1987-06-22 | 株式会社トクヤマ | Aluminum nitride composition |
JPS62153172A (en) * | 1985-12-26 | 1987-07-08 | 株式会社トクヤマ | Manufacture of aluminum nitride sintered body |
JPS6325278A (en) * | 1986-07-18 | 1988-02-02 | 株式会社トクヤマ | Manufacture of aluminum nitride sintered body |
JPS63195175A (en) * | 1987-02-09 | 1988-08-12 | 川崎製鉄株式会社 | Composition for sintering aluminum nitride |
JPS63222074A (en) * | 1987-03-12 | 1988-09-14 | 新日本化学工業株式会社 | Manufacture of aluminum nitride sintered body |
JPS63236765A (en) * | 1987-03-26 | 1988-10-03 | 品川白煉瓦株式会社 | Aluminum nitride sintered body |
JPS6456370A (en) * | 1987-08-28 | 1989-03-03 | Sumitomo Electric Industries | Highly heat-conductive aluminum nitride sintered body |
JPH0269362A (en) * | 1988-09-06 | 1990-03-08 | Asahi Chem Ind Co Ltd | Production of aluminum nitride sintered compact |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140066287A1 (en) * | 2012-08-31 | 2014-03-06 | CMC Laboratories, Inc. | Low Cost Manufacture of High Reflectivity Aluminum Nitride Substrates |
Also Published As
Publication number | Publication date |
---|---|
JPH0717457B2 (en) | 1995-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0963966B1 (en) | High thermal conductive silicon nitride sintered body and method of producing the same | |
JP2001080964A (en) | POLYCRYSTAL SiC SINTERED COMPACT PRODUCTION OF THE SAME AND PRODUCT OBTAINED BY APPLYING THE SAME | |
KR20170061755A (en) | Alumina complex ceramics composition and manufacturing method thereof | |
JPS63190761A (en) | Aluminum nitride-base sintered body | |
CN108863395B (en) | High-thermal-conductivity and high-strength silicon nitride ceramic material and preparation method thereof | |
US6143677A (en) | Silicon nitride sinter having high thermal conductivity and process for preparing the same | |
JP2871410B2 (en) | High thermal conductive silicon nitride sintered body and method for producing the same | |
JPH0274565A (en) | Aluminum nitride based calcined compact | |
KR102555662B1 (en) | Method for Preparing Silicon Nitride Sintered Body and The Silicon Nitride Sintered Body Prepared by The Same | |
JP3561153B2 (en) | Silicon nitride heat dissipation member and method of manufacturing the same | |
JP2690571B2 (en) | Zirconia cutting tool and its manufacturing method | |
JP2008156142A (en) | Aluminum nitride sintered compact and method for manufacturing the same | |
KR102536630B1 (en) | AlN-MgO based sintered body for electrostatic chuck with high specific resistance at high temperature, and method for manufacturing the same | |
JPH01252584A (en) | Sintered composite ceramic compact and production thereof | |
JP3303729B2 (en) | Aluminum nitride based sintered body and method for producing the same | |
JP3121996B2 (en) | Alumina sintered body | |
JPH0442861A (en) | Preparation of highly strong aluminum nitride sintered product | |
JPH0753256A (en) | Aluminous composite sintered compact and its production | |
JPS6317210A (en) | Production of aluminum nitride powder | |
JP5289184B2 (en) | Method for producing high thermal conductivity silicon nitride sintered body | |
JP3682344B2 (en) | Jig for manufacturing semiconductor and electronic parts and method for manufacturing the same | |
JPH10316469A (en) | Powdery magnesium silicide nitride and its production | |
Dongxu et al. | Preparation and Performance Study of Silicon Nitride Ceramic Substrate with High Thermal Conductivity | |
JPS63147867A (en) | Manufacture of silicon nitride sintered body | |
JPH11180774A (en) | Silicon nitride-base heat radiating member and its production |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090301 Year of fee payment: 14 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090301 Year of fee payment: 14 |