JPH0273759U - - Google Patents

Info

Publication number

JPH0273759U

JPH0273759U JP15360988U JP15360988U JPH0273759U JP H0273759 U JPH0273759 U JP H0273759U JP 15360988 U JP15360988 U JP 15360988U JP 15360988 U JP15360988 U JP 15360988U JP H0273759 U JPH0273759 U JP H0273759U

Authority

JP

Japan

Prior art keywords

resin layer

heat dissipation

metal plate

dissipation metal

circuit board

Prior art date

1988-11-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011347 resin Substances 0.000 claims description 4
• 229920005989 resin Polymers 0.000 claims description 4
• 230000017525 heat dissipation Effects 0.000 claims description 3
• 239000002184 metal Substances 0.000 claims description 3
• 238000005476 soldering Methods 0.000 description 1