JPH0273508A - Positioning and fixing method for magnetic head - Google Patents

Positioning and fixing method for magnetic head

Info

Publication number
JPH0273508A
JPH0273508A JP22559888A JP22559888A JPH0273508A JP H0273508 A JPH0273508 A JP H0273508A JP 22559888 A JP22559888 A JP 22559888A JP 22559888 A JP22559888 A JP 22559888A JP H0273508 A JPH0273508 A JP H0273508A
Authority
JP
Japan
Prior art keywords
core chip
adhesive
chip
positioning
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22559888A
Other languages
Japanese (ja)
Inventor
Tokuo Itonaga
糸永 徳雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP22559888A priority Critical patent/JPH0273508A/en
Publication of JPH0273508A publication Critical patent/JPH0273508A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve the accuracy of the position of a chip and the strength of adhesion by holding, by an attracting means, the chip for which a positioning reference height and an adhesive injection clearance are ensured, injecting an adhesive and fixing it. CONSTITUTION:A prescribed positioning reference height H0 is ensured between an edge g0 of the magnetic gap of a core chip 2 and a joint reference face 15a of a head base 15. An adhesive injection clearance C is ensured between the joint reference face 15a and the facing face of the core chip 2. The chip 2 in this state is attracted and held by a permanent magnet which is an attracting and holding device 17, the reference height H0 and the injection clearance C are positioned by a microscope 18, an adhesive 16 is injected and the chip is fixed. Consequently, the lowering of the accuracy by the unevenness of the thickness of the core chip 2 and the imperfect flatness of the joint face can be prevented and the strength of the adhesion can be improved by the suitable injection clearance.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は磁気ヘッドの位置決め固着方法に関するもので
あり、詳しくはVTR装置等に使用されるバルク型磁気
ヘッドの構成部材たるコアチップをヘッドベース上に寸
法精度良く位置決め固着する方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for positioning and fixing a magnetic head. Specifically, the present invention relates to a method for positioning and fixing a magnetic head. Specifically, the present invention relates to a method for positioning and fixing a magnetic head. The present invention relates to a method for positioning and fixing with high dimensional accuracy.

〔従来の技術〕[Conventional technology]

VTR装置等に使用されるバルク型磁気ヘッドの具体例
を第5図を参照しながら説明する。
A specific example of a bulk type magnetic head used in a VTR device or the like will be explained with reference to FIG.

同図に示す磁気ヘッド(1)において、(2)はフェラ
イト等の強磁性体からなる一対のコア(2a)  (2
b)をStO2等の非磁性体薄膜(3)を介在させて接
合一体化したコアチップで、頂端面(2c)には所定の
トラック幅(Tw)で磁気ギャップgが形成されている
−  (4)  (4a)(4a)は上記コア(2a)
  (2b)を一体構造に接合するための低融点ガラス
である。上記コアチップ(2)には、コア(2a)  
(2b)の外側面に形成した巻線係止溝(5a)  (
5b)と、コア(2a)(2b)を一体化することによ
り形成された巻線掃通穴(6)を利用して絶縁被覆処理
が施こされた線材(7)を所定ターン数巻回する。
In the magnetic head (1) shown in the figure, (2) is a pair of cores (2a) (2) made of a ferromagnetic material such as ferrite.
b) is a core chip that is integrated by bonding with a non-magnetic thin film (3) such as StO2 interposed, and a magnetic gap g with a predetermined track width (Tw) is formed on the top end surface (2c) - (4 ) (4a) (4a) is the above core (2a)
(2b) is a low melting point glass for joining into an integral structure. The core chip (2) has a core (2a)
Winding locking groove (5a) formed on the outer surface of (2b) (
5b) and the winding sweep hole (6) formed by integrating the cores (2a) and (2b), the wire rod (7) coated with insulation is wound a predetermined number of turns. do.

上記磁気ヘッド(1)の製造方法の従来例を第6図乃至
第13図を参照しながら以下説明する。先ず、第6図に
示すように鏡面仕上げを施こした長尺な直方体形状の第
1コアブロツク(10)、第2コアブロツク(11)を
用意する0次に第7図に示すように上記第1コアブロツ
ク(10)の内側面にその長手方向に沿って巻線部用溝
(10a)を形成し、また、その外側面にその長手方向
に沿って巻線部用溝(10b )を切削加工する。また
、第2のコアブロック(11)の内側面にその長手方向
に沿って接合部用溝(lla)を形成し、更にその外側
面に長手方向に沿ってS線部用溝(10b )を切削加
工する0次に、上記第1、第2コアブロツク(10) 
 (11)の接合内方エツジ部分に、その短毛方向に沿
って所定のトラック幅(Tw)を残して複数のトランク
溝(12)  (12)−・を切削加工する。そして、
第8図に示すように上記トランク溝(12)  (12
)−・・および接合部用溝(Ila)に低融点ガラス(
13)(13)・・を充填し、第1、第2コアブロツク
(10)  (11)をモールドし、上記第1、第2コ
アブロツク(10)  (11)の接合面となる内側面
に鏡面加工を施こし、その内側面上部近傍にSi02等
の非磁性体薄膜(図示せず)を被着形成する。この後、
第9図に示すように第1、第2コアブロフク(10) 
 (11)の内側面同士を突合わせて加熱・溶着し一体
化する。そして、第10図に示すように上記第1、第2
コアブロツク(10)  (11)の頂端面(14)を
、所定のギヤ。
A conventional method for manufacturing the magnetic head (1) will be described below with reference to FIGS. 6 to 13. First, as shown in FIG. 6, a first core block (10) and a second core block (11) in the shape of an elongated rectangular parallelepiped with a mirror finish are prepared. Next, as shown in FIG. A winding groove (10a) is formed along the longitudinal direction on the inner surface of the core block (10), and a winding groove (10b) is cut along the longitudinal direction on the outer surface of the core block (10). . Furthermore, a joint groove (lla) is formed along the longitudinal direction on the inner surface of the second core block (11), and an S-line groove (10b) is formed along the longitudinal direction on the outer surface of the second core block (11). Next, the first and second core blocks (10) to be cut.
A plurality of trunk grooves (12) (12) are cut in the joint inner edge portion of (11), leaving a predetermined track width (Tw) along the short hair direction. and,
As shown in FIG. 8, the trunk groove (12) (12
)-...and low melting point glass (
13) (13)... is filled, the first and second core blocks (10) (11) are molded, and the inner surface that becomes the joint surface of the first and second core blocks (10) (11) is mirror-finished. A non-magnetic thin film (not shown) such as Si02 is deposited near the top of the inner surface. After this,
As shown in Figure 9, the first and second core blocks (10)
The inner surfaces of (11) are butted together and heated and welded to integrate. Then, as shown in FIG.
The top end surfaces (14) of the core blocks (10) and (11) are connected to a predetermined gear.

プデプスdになるように曲面研磨加工し、次いで第11
図に示すように第1、第2コアブロツクの接合体をその
短毛方向に沿った一点鎖線(k)(k)−・・に対して
所定のアジマス角度θだけ傾斜した一点鎖線C1>  
C1>−で示す方向に沿って所定の幅寸法(H)にスラ
イスしてコアチップ(2)  (2)−・・を得る。
The curved surface is polished so that the depth is d, and then the 11th
As shown in the figure, the joined body of the first and second core blocks is inclined by a predetermined azimuth angle θ with respect to the dashed-dotted line (k) (k)-- along the direction of the short hair.
Core chips (2) (2) are obtained by slicing into a predetermined width dimension (H) along the direction indicated by C1>-.

この後、第12図に示すようにヘッドベース(15)の
下面と対向する上記コアチップ(2)の側端面に接着剤
(16)を塗布し、この接着剤塗布面をヘッドベース(
15)に密着させることによってコアチップ(2)をヘ
ッドベース(15)と一体構造に接合する。最後に、へ
、7ドベース(15)上に位置決め固着されたコアチッ
プ(2)に線材(7)を所定ターン数巻回し、第5図に
示すような磁気ヘッド(1)を製造する。
After that, as shown in FIG. 12, adhesive (16) is applied to the side end surface of the core chip (2) facing the lower surface of the head base (15), and this adhesive-applied surface is applied to the head base (15).
15), the core chip (2) is integrally joined to the head base (15). Finally, the wire (7) is wound a predetermined number of turns around the core chip (2) positioned and fixed on the base (15) to produce a magnetic head (1) as shown in FIG.

第13図は従来のコアチップ(2)の位置決め固着方法
の説明図である。同図に示すようにヘッドベース(15
)を上下反転し、その基準面上に絶対高さ(H)を具え
たコアチップ(2)を位置決め固着する。このとき、コ
アチップ(2)の厚みである絶対高さ(H)は、頂端面
(14)上に形成された前記磁気ギャップgの下端から
ヘッドベース(15)の基準面(15a)迄の鉛直距離
として表示される位置決め基準高さ(Ha)が一定にな
るように選定する必要がある。
FIG. 13 is an explanatory diagram of a conventional method for positioning and fixing the core chip (2). As shown in the figure, the head base (15
) is turned upside down, and a core chip (2) having an absolute height (H) is positioned and fixed on the reference surface. At this time, the absolute height (H), which is the thickness of the core chip (2), is the vertical distance from the lower end of the magnetic gap g formed on the top end surface (14) to the reference surface (15a) of the head base (15). It is necessary to select so that the positioning reference height (Ha) displayed as a distance is constant.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところで従来方法では、第13図に矢印(A)で示すよ
うに加圧バネや重り等の加圧手段を利用して、ヘッドベ
ース(15)の基準面(15a)上に、接着剤(16)
の注入層を介して絶対高さ(H)を具えたコアチップ(
2)を押し付けることによってコアチップ(2)の位置
決め基準高さ(Ho)を決めているため、第11図に示
すアジマス角度形成下のスライス加工に際して、コアチ
ップ(2)の絶対高さ(H)が不揃になると、ヘッドベ
ース(15)上でのコアチップ(2)の位置決め精度が
低下し、これに起因して例えばダブルアジマス型の磁気
ヘッドを具えたVTR装置においてクロストーク等の障
害が発生する。このような問題は、ヘッドベース(15
)やコアチップ(2)の接合面の平坦度が不足している
場合にも発生する。
By the way, in the conventional method, as shown by the arrow (A) in FIG. 13, the adhesive (16 )
The core chip (with absolute height (H) through the injection layer of
2) determines the positioning reference height (Ho) of the core chip (2), so when slicing under the azimuth angle formation shown in Fig. 11, the absolute height (H) of the core chip (2) is If they are not aligned, the positioning accuracy of the core chip (2) on the head base (15) will be reduced, and this will cause problems such as crosstalk in, for example, a VTR device equipped with a double azimuth type magnetic head. . Such problems can be solved by head base (15
) or when the flatness of the joint surface of the core chip (2) is insufficient.

また、上記コアチップ(2)の絶対高さ(H)の偏差が
許容範囲の上限を越えると、位置決め高さ(Ho)の偏
差も増大し、ヘッドベース(15)の基準面(15a)
とコアチップ(2)の下端面との間に接着剤(16)の
介在スペースを確保することも不可能になる。
Furthermore, when the deviation in the absolute height (H) of the core chip (2) exceeds the upper limit of the allowable range, the deviation in the positioning height (Ho) also increases, and the reference plane (15a) of the head base (15)
It also becomes impossible to secure an intervening space for the adhesive (16) between the core chip (2) and the lower end surface of the core chip (2).

本発明の主要な目的は、上記従来のコアチップの位置決
め固着方法で問題になっていたコアチップの絶対高さの
偏差もしくは接合面の平坦度不良に起因するコアチップ
の位置決め精度低下の防止手段を提供することにある。
A main object of the present invention is to provide a means for preventing a decrease in core chip positioning accuracy due to deviations in the absolute height of the core chip or poor flatness of the joint surface, which are problems in the conventional core chip positioning and fixing methods. There is a particular thing.

〔課題を解決するための手段〕[Means to solve the problem]

上記課題の解決手段として本発明は、コアチップをヘッ
ドベース上に接着剤で位置決め固着するに際し、コアチ
ップの磁気ギャップの端とヘッドベースの接合基準面と
の間に、所定の位置決め基準高さが確保され、かつ、ヘ
ッドベースの接合基準面とコアチップのその対向面との
間に、接着剤の注入間隙が確保されるように設定したコ
アチップを、吸着保持手段で吸着保持し前記ヘッドベー
ス上で浮上支持させた状態で位置決めし接着剤により固
着するようにした磁気へノドの位置決め固着方法を提供
するものである。
As a means of solving the above problems, the present invention ensures a predetermined positioning reference height between the end of the magnetic gap of the core chip and the joining reference surface of the head base when positioning and fixing the core chip on the head base with an adhesive. The core chip, which is set so that an adhesive injection gap is secured between the bonding reference surface of the head base and the opposing surface of the core chip, is held by suction and holding means and floats on the head base. The present invention provides a method for positioning and fixing a magnetic nod in which the magnetic nod is positioned in a supported state and fixed using an adhesive.

〔作用〕[Effect]

コアチップをヘッドベース上に浮上支持することによっ
て、コアチップの厚みの不揃とへ7ドベースまたはコア
チップの接合面の平坦度不良に起因する位置決め精度の
低下を防止し、また、ヘッドベースの接合基準面とコア
チップの下端面の間への接着剤の注入を容易にする。
By floating and supporting the core chip on the head base, it is possible to prevent a decrease in positioning accuracy due to uneven thickness of the core chip and poor flatness of the joint surface of the head base or core chip, and also to prevent the positioning accuracy from decreasing due to uneven thickness of the core chip and poor flatness of the joint surface of the head base or the joint reference surface of the head base. and the lower end surface of the core chip.

〔実施例〕〔Example〕

第1図は本発明によるコアチップの厚みの設定方法を従
来方法と比較するコアチップの頂端面の正面図、第2図
は接着剤の塗布厚みと接着強度の関係を定性的に表示す
る線図、第3図はコアチップの浮上支持状態を説明する
構体の側面図、第4図はその構体の正面図である。
FIG. 1 is a front view of the top end surface of the core chip comparing the method of setting the thickness of the core chip according to the present invention with the conventional method, and FIG. 2 is a diagram qualitatively showing the relationship between the adhesive coating thickness and adhesive strength. FIG. 3 is a side view of the structure for explaining the floating and supporting state of the core chip, and FIG. 4 is a front view of the structure.

なお、以下の記述において従来技術を説明する第5図乃
至第13図と同一の構成部材は同一の参照符号で表示し
、重複する事項に関しては説明を省略する。
In the following description, the same constituent members as those in FIGS. 5 to 13 for explaining the prior art are indicated by the same reference numerals, and the explanation of the overlapping items will be omitted.

これらの図面において、hはコアチップ(2)の厚みで
ある絶対高さ、Cは最大強度Pに対応する接着剤(16
)の塗布厚み、(15a)はヘッドベース(15)の接
合基準面、(17)はコアチップ(2)の吸着保持装置
、(18)はコアチップ(2)の位置決め基準高さを読
取るための顕微鏡を示す。
In these drawings, h is the absolute height, which is the thickness of the core chip (2), and C is the adhesive (16
), (15a) is the bonding reference surface of the head base (15), (17) is the suction holding device for the core chip (2), and (18) is a microscope for reading the positioning reference height of the core chip (2). shows.

本発明においては第1図に示すように、コアチップ(2
)の浮上支持に備えて、そのスライス幅りを、従来のコ
アチップ(2)の厚みである絶対高さ(【()に比較し
て幾分小さく設定する。
In the present invention, as shown in FIG.
), the slice width is set somewhat smaller than the absolute height ([()), which is the thickness of the conventional core chip (2).

コアチップ(2) をヘッドベース(15)の接合基準
面(15a )の上方に浮上するための吸着保持装置i
! (17)としては、永久磁石や電磁石のほかに真空
吸着装置を使用することも可能である。前記コアチップ
(2)の絶対高さhは、当該コアチップの磁気ギャップ
gの下端(go)とへノドベース(15)の接合基準面
(15a)との間に、所定の位置決め基準高さ(Ho)
が確保され、かつ、接着剤(16)が塗布されるコアチ
ップ(2)の下端面(2d)とヘッドベース(15)の
接合基準面(15a )との間に、前記接着剤(16)
の最大強度(第2図にPで表示)に対応する接着剤(1
6)の注入間隙Cが確保されるように設定する。上記絶
対高さhを具えたコアチップ(2)は、吸着保持装置(
17) 、例えば永久磁石に吸着保持された状態でヘッ
ドベース(15)の接合基準面(15a)の上方に浮上
支持され、顕微&! (1B)による拡大目視観測によ
って前記位置決め基準高さ(Ho)および接着剤(16
)の注入間隙Cを設定した状態に位置決めされ、この後
、この注入間隙Cに接着剤(16)を注入することによ
って、ヘッドベース(15)の接合基準面(15a )
上に固着される。
Suction holding device i for floating the core chip (2) above the bonding reference surface (15a) of the head base (15)
! As for (17), it is also possible to use a vacuum suction device in addition to permanent magnets and electromagnets. The absolute height h of the core chip (2) is set at a predetermined positioning reference height (Ho) between the lower end (go) of the magnetic gap g of the core chip and the joining reference surface (15a) of the henode base (15).
is secured and the adhesive (16) is applied between the lower end surface (2d) of the core chip (2) to which the adhesive (16) is applied and the bonding reference surface (15a) of the head base (15).
Adhesive (1
6) is set so that the injection gap C is ensured. The core chip (2) with the above absolute height h is attached to the suction holding device (
17) For example, the microscope &! (1B), the positioning reference height (Ho) and the adhesive (16
), and then, by injecting the adhesive (16) into the injection gap C, the bonding reference surface (15a) of the head base (15) is fixed.
fixed on top.

接着剤(16)の注入間隙Cは、接着剤(16)の種類
に応じて適宜選択されるが、第2図に例示するように接
着剤の塗布厚みtoが!&通値を越えると接着強度は急
激に減少するため、注入間隙Cの大きさは、−船釣には
15μ以下、更に好ましくは10μ以下に設定すること
が望ましい。
The injection gap C of the adhesive (16) is appropriately selected depending on the type of adhesive (16), but as illustrated in FIG. 2, the adhesive application thickness to! If the adhesive strength exceeds the normal value, the adhesive strength decreases rapidly, so the size of the injection gap C is desirably set to -15μ or less for boat fishing, more preferably 10μ or less.

なお、上記実施例では単一のコアチップをヘッドベース
上に位置決め固着する態様が説明されているが、本発明
の権利範囲はこれによって限定解釈されるべきものでは
なく、2個のコアチップをヘッドベース上に固着してな
るダブルアジマス型磁気ヘッドの製造手段としても利用
することができる。
In addition, although the embodiment described above describes a mode in which a single core chip is positioned and fixed on the head base, the scope of the present invention should not be construed as being limited by this, and two core chips are mounted on the head base. It can also be used as a means of manufacturing a double azimuth type magnetic head fixedly attached to the top.

〔発明の効果〕〔Effect of the invention〕

本発明方法によれば、浮上支持方式の採用により位置決
め基準高さの設定が容易になり、コアチップの位置決め
精度が向上する。更にコアチップの下端面とへソドベー
スの接合基準面との間に接着剤の適正な注入間隙を形成
することが可能になる。このため、コアチップの接着強
度が従来方法に比較して大幅に増大する。このように本
発明は、コアチップの位置決め精度ならびに接着強度の
向上に対して従来技術の水準を大幅に上進る効果を発揮
することができる。
According to the method of the present invention, by adopting the floating support method, it becomes easy to set the positioning reference height, and the positioning accuracy of the core chip is improved. Furthermore, it becomes possible to form an appropriate adhesive injection gap between the lower end surface of the core chip and the joining reference surface of the hemlock base. Therefore, the adhesive strength of the core chip is significantly increased compared to the conventional method. As described above, the present invention can exhibit effects that are significantly superior to the level of the prior art in terms of improving core chip positioning accuracy and bonding strength.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明によるコアチップの厚みの設定方法を従
来方法と比較するコアチップの頂端面の正面図、第2図
は接着剤の塗布厚みと接着強度の関係を定性的に表示す
る線図、第3図はコアチップの浮上支持状態を説明する
構体の側面図、第4図はその構体の正面図である。第5
図はバルク型磁気ヘッドの具体例を示す斜視図、第6図
乃至第13図は従来のコアチップの製造方法と位置決め
方法を例示する説明図である。 (2) −・コアチップ、 (15) −・・ヘッドベ
ース、(16)・−・接着剤、   (17)・−・吸
着保持装置、(15a ) −・接合基準面、 (h)−・・コアチップの厚み、 (go)・・・・磁気ギャップの端、 (Ho)・−・位置決め基準高さ、 (2d) −コアチップの対向面、 <c)−・接着剤の注入間隙。 第1図
FIG. 1 is a front view of the top end surface of the core chip comparing the method of setting the thickness of the core chip according to the present invention with the conventional method, and FIG. 2 is a diagram qualitatively showing the relationship between the adhesive coating thickness and adhesive strength. FIG. 3 is a side view of the structure for explaining the floating and supporting state of the core chip, and FIG. 4 is a front view of the structure. Fifth
The figure is a perspective view showing a specific example of a bulk type magnetic head, and FIGS. 6 to 13 are explanatory diagrams illustrating a conventional method for manufacturing and positioning a core chip. (2) --- Core chip, (15) --- Head base, (16) --- Adhesive, (17) --- Adsorption holding device, (15a) --- Joining reference surface, (h) --- Thickness of the core chip, (go) --- End of the magnetic gap, (Ho) --- Positioning reference height, (2d) --- Opposing surface of the core chip, <c) --- Adhesive injection gap. Figure 1

Claims (1)

【特許請求の範囲】[Claims] (1)コアチップをヘッドベース上に接着剤で位置決め
固着するに際し、 コアチップの磁気ギャップの端とヘッドベースの接合基
準面との間に、所定の位置決め基準高さが確保され、か
つ、ヘッドベースの接合基準面とコアチップのその対向
面との間に、接着剤の注入間隙が確保されるように設定
したコアチップを、吸着保持手段で吸着保持し、前記ヘ
ッドベース上で浮上支持させた状態で位置決めし、接着
剤により固着するようにしたことを特徴とする磁気ヘッ
ドの位置決め固着方法。
(1) When positioning and fixing the core chip on the head base with adhesive, a predetermined positioning reference height is secured between the end of the magnetic gap of the core chip and the joining reference surface of the head base, and The core chip, which is set so that an adhesive injection gap is ensured between the bonding reference surface and the opposing surface of the core chip, is held by suction and holding means, and positioned while floating and supported on the head base. A method for positioning and fixing a magnetic head, characterized in that the magnetic head is fixed using an adhesive.
JP22559888A 1988-09-08 1988-09-08 Positioning and fixing method for magnetic head Pending JPH0273508A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22559888A JPH0273508A (en) 1988-09-08 1988-09-08 Positioning and fixing method for magnetic head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22559888A JPH0273508A (en) 1988-09-08 1988-09-08 Positioning and fixing method for magnetic head

Publications (1)

Publication Number Publication Date
JPH0273508A true JPH0273508A (en) 1990-03-13

Family

ID=16831837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22559888A Pending JPH0273508A (en) 1988-09-08 1988-09-08 Positioning and fixing method for magnetic head

Country Status (1)

Country Link
JP (1) JPH0273508A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05320584A (en) * 1991-05-21 1993-12-03 Alps Electric Co Ltd Bonded structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4870518A (en) * 1971-12-22 1973-09-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4870518A (en) * 1971-12-22 1973-09-25

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05320584A (en) * 1991-05-21 1993-12-03 Alps Electric Co Ltd Bonded structure

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