JPH0272934A - Preventing method for embossing crush - Google Patents

Preventing method for embossing crush

Info

Publication number
JPH0272934A
JPH0272934A JP22420088A JP22420088A JPH0272934A JP H0272934 A JPH0272934 A JP H0272934A JP 22420088 A JP22420088 A JP 22420088A JP 22420088 A JP22420088 A JP 22420088A JP H0272934 A JPH0272934 A JP H0272934A
Authority
JP
Japan
Prior art keywords
layer
adhesive
intermediate layer
embossing
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22420088A
Other languages
Japanese (ja)
Other versions
JP2605822B2 (en
Inventor
Yukio Osabe
長部 幸夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Plastics Inc
Original Assignee
Mitsubishi Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Plastics Inc filed Critical Mitsubishi Plastics Inc
Priority to JP22420088A priority Critical patent/JP2605822B2/en
Publication of JPH0272934A publication Critical patent/JPH0272934A/en
Application granted granted Critical
Publication of JP2605822B2 publication Critical patent/JP2605822B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To prevent occurrence of embossing crush by putting the adhesive layered surface of a laminated protection film made up of a base material layer, an intermediate layer and an adhesive layer on the embossing worked surface of a panel body, and heat-pressing them at the temperature of melting temperature or higher of the resin employed for the intermediate layer. CONSTITUTION:Upon laminating integrally a panel body having a PVC layer 5 worked by embossing 6 on its surface on a core material 7 via an adhesive agent 8, the surface of an adhesive layer 4 of a protection film 1, which comprises an intermediate layer 3 of lower melting temperature than that of PVC layer 5 and the adhesive layer 4, is laid on the surface of PVC layer 5 worked by embossing 6, and heat press-fixed then. The temperature condition in the heat pressing, the temperature may preferably be the melting temperature or higher of the resin employed for the intermediate layer 3, and the temperature of 160 deg.C or lower. The thickness of base material layer 2 and intermediate layer 3 of the protection layer 1 is required by 30mu and 10mu respectively, and the adhesive layer 4 is required by 1-25mu. Besides the adhesive strength between the base material layer 2 and the intermediate layer 3, and between the intermediate layer 3 and the adhesive layer 4 is required being stronger than the adhesive strength between the PVC layer 5 and the adhesive layer 4.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は熱可塑性樹脂層の表面に付与したエンボスの潰
れ防止方法に係り、更に詳しくは装飾のためエンボス加
工を施した熱可塑性樹脂層を有する板状体に、他のハニ
カムやプラスチック発泡体などを裏打ち積層し、加熱プ
レスして建材用パネルを製造する際に、エンボス潰れの
発生と防止するための方法に関するものである。
Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for preventing collapse of embossments applied to the surface of a thermoplastic resin layer, and more specifically relates to a method for preventing collapse of embossing applied to the surface of a thermoplastic resin layer. The present invention relates to a method for preventing the occurrence of emboss collapse when manufacturing panels for building materials by backing and laminating other honeycombs, plastic foams, etc. on a plate-like body having the present invention and heat-pressing the same.

(従来技術とその課題) 従来ドア、壁パネル、天井材などの建材ご製造する際、
芯材のハニカムやプラスチック発泡体の片面又は両面に
、ポリ塩化ビニル板やポリ塩化ビニルと金属板との積層
板を重ね合わせて加熱プレスして一体1造のものを製造
しているが、上記ポリ塩化ビニル板面に予めエンボス加
工が施されている場合には、この加熱プレス工程中に温
度と圧力とによってエンボスが潰れ、得られるパネル製
品の装飾効果が損われ、外観品質が低下するという問題
がhつな。
(Conventional technology and its issues) Conventionally, when manufacturing building materials such as doors, wall panels, and ceiling materials,
Polyvinyl chloride plates or laminates of polyvinyl chloride and metal plates are superimposed on one or both sides of the honeycomb or plastic foam core material and then hot pressed to produce a one-piece structure. If the surface of the PVC board is pre-embossed, the temperature and pressure during the hot pressing process will crush the embossment, damaging the decorative effect of the resulting panel product and reducing its appearance quality. The problem is h.

(課題を解決するための手段) 本発明は上記課題を解決する方法であって、その要旨は
、表面にエンボス加工を施した熱可塑性樹脂層を有する
板状体を加熱プレスにより芯材に積層して一体構造にす
るに際し、基材層、上記熱可塑性樹脂より溶融温度が低
い樹脂の中間層及び粘着層よりなる積層保護フィルムの
粘着層面を、上記エンボス加工面に重ね合わせると共に
、上記中間層に用いた樹脂の溶融温度以上の温度で加熱
プレスすることを特徴とするエンホス潰れ防止方法であ
る。
(Means for Solving the Problems) The present invention is a method for solving the above problems, and the gist thereof is to laminate a plate-shaped body having a thermoplastic resin layer with an embossed surface onto a core material by hot pressing. When forming an integral structure, the adhesive layer side of the laminated protective film consisting of a base layer, an intermediate layer of a resin having a lower melting temperature than the thermoplastic resin, and an adhesive layer is superimposed on the embossed surface, and the adhesive layer side of the laminated protective film is overlapped with the embossed surface, This is a method for preventing Enphos from collapsing, which is characterized by hot pressing at a temperature higher than the melting temperature of the resin used in the process.

以下、本発明の実施例を図面により説明する。Embodiments of the present invention will be described below with reference to the drawings.

第1図は、エンボス6加工を施したポリ塩化ビニル層(
以下rPVC層」という)5を有する板状体上に、接着
剤8を介し芯材7へ積層すると共に、保護フィルム1を
重ね合わせ、加熱プレスする前の状態を示す拡大側断面
図、第2図は、加熱プレスの初期段階を示す拡大側断面
図、第3図は、加熱プレスの後期段階と示す拡大側断面
図、また第4図は、冷却プレスののち保護フィルム1を
剥離した状態を示す拡大側断面図である。
Figure 1 shows the polyvinyl chloride layer (
An enlarged side cross-sectional view showing a state before being laminated onto a core material 7 via an adhesive 8 and a protective film 1 overlaid on a plate-like body having an rPVC layer (hereinafter referred to as "rPVC layer") 5 and heat-pressed. The figure is an enlarged side sectional view showing the initial stage of hot pressing, FIG. 3 is an enlarged side sectional view showing the latter stage of hot pressing, and FIG. 4 shows the state in which the protective film 1 is peeled off after cooling pressing. It is an enlarged sectional side view shown.

本発明は、第1図に示す如く表面にエンホス6加工を施
した270層5を有する板状体を接着剤8を介して芯材
7に加熱プレスにて積層して一部楕遣にするに際し、該
270層5面に保護フィルム1を被せるものであるが、
この保護フィルム1は基材層2.270層5より溶融温
度が低い樹脂の中間層3及び粘@層4よりなる構造の保
護フィルム1の粘着層4面を、エンボス6加工を施した
270層5面に重ね合わせ、第2図、第3図に示すよう
に加熱プレス圧着する。
As shown in FIG. 1, a plate-like body having 270 layers 5 whose surface has been treated with Enphos 6 is laminated on a core material 7 via an adhesive 8 using a hot press to partially oval it. At this time, the protective film 1 is covered on the 5 sides of the 270 layer,
This protective film 1 has a base material layer 2.270 layer 5 has a structure consisting of an intermediate layer 3 of a resin whose melting temperature is lower than that of the 270 layer 5, and a viscous layer 4. The five sides are stacked one on top of the other, and hot press is applied as shown in FIGS. 2 and 3.

加熱プレス初期においては、第2図に示す如く270層
5のエンボス6加工面は一旦押し潰された状態となるが
、加熱プレス後期においては、第3図に示す如く、中間
層3の溶融と共にP V C層5の復元力によってエン
ボス6が復元し、次いでこのまま冷却してのち第4図に
示す如<pvc層5から保護フィルム1を剥離するとp
 VCJq 5面のエンボス6は、第1図に示す元のエ
ンボス6の状態に復起する。
In the early stage of hot pressing, the embossed surface 6 of the 270 layer 5 is in a crushed state as shown in FIG. 2, but in the late stage of hot pressing, as shown in FIG. The embossment 6 is restored by the restoring force of the PVC layer 5, and after being cooled, the protective film 1 is peeled off from the PVC layer 5 as shown in FIG.
The embossing 6 on the 5th side of VCJq returns to the original state of the embossing 6 shown in FIG.

上記加熱プレスにおける温度条件は、中間層5に用いる
樹脂の溶融温度以上であって、符号5がPVCの場合に
は160℃以下の温度かよい。
The temperature conditions in the hot press may be higher than the melting temperature of the resin used for the intermediate layer 5, and lower than 160° C. when the reference numeral 5 is PVC.

上記溶融温度以上或いは上記160°C以上では270
層5面のエンボス6か潰れ、製品の装飾効果を損う。
270℃ above the above melting temperature or above 160°C
Emboss 6 on layer 5 is crushed, damaging the decorative effect of the product.

また上記保護フィルム1の基材層2、中間層3の厚みは
少くとも各々30μ、10μ以上必要であり、また粘着
層4は1〜25μ必要である。
Further, the thickness of the base layer 2 and the intermediate layer 3 of the protective film 1 must be at least 30 μm and 10 μm or more, respectively, and the adhesive layer 4 must have a thickness of 1 to 25 μm.

なお、上記基材層2と中間層、3との間及び中間層3と
粘着層4との間の接着力は、PVC屑5と粘着R4との
間の接着力より大きいことか必要である。
In addition, it is necessary that the adhesive force between the base material layer 2 and the intermediate layer 3 and between the intermediate layer 3 and the adhesive layer 4 be greater than the adhesive force between the PVC scrap 5 and the adhesive R4. .

上記本発明で用いる保護フィルム1を構成する基材層2
は、剛性を有するポリプロピレンよりなり、また中間層
3はポリエチレンまたはエチレン−酢酸ビニル共重合体
であり、さらに粘着層4は天然ゴム、ポリイソブチレン
、スチレン−イソブチレン−スチレン共重合体、スチレ
ン−ブチレン−スチレン共重合体、スチレン−エチレン
−ブチレン−スチレン共重合体、アクリル系ゴム、弗素
系ゴムなどの何れかを主成分とする感圧接着剤である。
Base material layer 2 constituting the protective film 1 used in the present invention
is made of polypropylene having rigidity, the intermediate layer 3 is made of polyethylene or ethylene-vinyl acetate copolymer, and the adhesive layer 4 is made of natural rubber, polyisobutylene, styrene-isobutylene-styrene copolymer, styrene-butylene- It is a pressure-sensitive adhesive whose main component is styrene copolymer, styrene-ethylene-butylene-styrene copolymer, acrylic rubber, fluorine rubber, or the like.

上記中間層3に用いるポリエチレンの融点は105〜1
25℃であり、#酸ビニル共重合体の融点は略60’C
である。
The melting point of the polyethylene used for the intermediate layer 3 is 105 to 1
The temperature is 25°C, and the melting point of the #acid vinyl copolymer is approximately 60'C.
It is.

一方、上記保護フィルム1により保護される板状体を構
成するPVC屑5は単板であっても、接着剤を介して金
属板などと積層一体止したものであってもよい。
On the other hand, the PVC scraps 5 constituting the plate-shaped body protected by the protective film 1 may be a single plate or may be laminated and fixed to a metal plate or the like via an adhesive.

(実施例) 表面に最大高さ30μ、平均厚さ(Ra)5μのエンボ
ス加工を施してなる厚み0.2mmのPVC屑を厚み1
1IuI+の鋼板に積層接着し、得られた厚み1.2關
のPVC積層鋼板に厚み30mmの芯材を接着剤を介し
、積層加熱プレスするに当り、ポリプロピレンよりなる
厚み40μの基材層、融点105℃の低密度ポリエチレ
ンよりなる厚み30μの中間層及びポリイソブチレン系
ゴムを主成分とする感圧接着剤よりなる厚み20μの粘
着層を具えた総厚み90μの保護フィルムを用い、該保
護フィルムの粘着層面を上記270層のエンボス加工面
に重ね合わせて温度140℃、圧力5に1(/−1時間
5分の条件で加熱プレスし、次いで冷却ののち厚み31
Mの積層品を取出し保護フィルムを剥離した結果、得ら
れた製品の270層の面のエンボスは元の形態を維持し
ており、装飾効果は損われていなかった。
(Example) PVC scraps with a thickness of 0.2 mm and embossed on the surface with a maximum height of 30 μ and an average thickness (Ra) of 5 μ
A 40μ thick base material layer made of polypropylene with a melting point Using a protective film with a total thickness of 90μ, which includes an intermediate layer with a thickness of 30μ made of low-density polyethylene at 105°C and an adhesive layer with a thickness of 20μ made of a pressure-sensitive adhesive mainly composed of polyisobutylene rubber, the protective film is The adhesive layer surface was superimposed on the embossed surface of the above 270 layers and hot pressed at a temperature of 140°C and a pressure of 5:1 (/-1 hour and 5 minutes), and then after cooling, the thickness was 31
As a result of taking out the M laminate and peeling off the protective film, the embossing on the surface of the 270 layers of the obtained product maintained its original form, and the decorative effect was not impaired.

一方、上記保護フィルムを用いずに上記PVC槓J′f
!鋼板に芯材を積層し、上記粂件で加熱プレスした結果
、得られた製品の270層面のエンホスは元の形態を維
持せず、押し潰された状態であった。
On the other hand, without using the protective film, the PVC tower J′f
! As a result of laminating a core material on a steel plate and hot pressing with the above-mentioned condition, the Enphos on the 270 layer surface of the obtained product did not maintain its original shape and was in a crushed state.

(発明の作用及び効果〉 本発明方法において、エンボス加工を施したPVC層を
有する板状体と芯材とを積層加熱プレスして建材を製造
する際に用いる保護フィルムは、基材層と中間層と粘着
層とからなり、このうち中間層に用いるポリエチレン又
はエチレン−酢酸ビニル共重合体は、160°Cより低
い温度で溶融するので、該中間層の溶融温度以上でかつ
160°C以下の温度で加熱プレスすれば、エンボスの
凹凸か粘着層と共に溶融した中間層へ陥入した状態で固
定される。 そしてエンボスの各層間の接着強度がP 
V C層と粘着層との接着強度より強いことと基材層の
剛性と相俟って、PVC層のエンホス加工面と粘@層と
の界面で容易に剥離することができるので、元のエンボ
スを維持した装飾効果の優れた外観良好な建材が得られ
る。
(Operations and Effects of the Invention) In the method of the present invention, the protective film used when manufacturing a building material by laminating and hot pressing a plate-like body having an embossed PVC layer and a core material is a base material layer and an intermediate layer. The polyethylene or ethylene-vinyl acetate copolymer used for the intermediate layer melts at a temperature lower than 160°C. If heated and pressed at a high temperature, the unevenness of the embossing will be fixed in the melted intermediate layer together with the adhesive layer.Then, the adhesive strength between each layer of the embossing will be P
The adhesive strength is stronger than that between the VC layer and the adhesive layer, combined with the rigidity of the base layer, and it can be easily peeled off at the interface between the enhanced surface of the PVC layer and the adhesive layer, so the original A building material with an excellent decorative effect and a good appearance while maintaining the embossment can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明において加熱プレスする前の状態を示す
拡大側断面図であ、第2図は加熱プレスの初期段階を示
す拡大側断面図であり、第3図は加熱プレスの後期段階
を示す拡大側断面図であり、第4図は冷却プレスののち
保護イルムを剥離した状態を示す拡大側断面図である。
FIG. 1 is an enlarged side sectional view showing the state before hot pressing in the present invention, FIG. 2 is an enlarged side sectional view showing the initial stage of hot pressing, and FIG. 3 is an enlarged side sectional view showing the latter stage of hot pressing. FIG. 4 is an enlarged side sectional view showing a state in which the protective film is peeled off after cooling press.

Claims (1)

【特許請求の範囲】[Claims]  表面にエンボス加工を施した熱可塑性樹脂層を有する
板状体を加熱プレスにより芯材に積層して一体構造にす
るに際し、基材層、上記熱可塑性樹脂より溶融温度が低
い樹脂の中間層及び粘着層よりなる積層保護フィルムの
粘着層面を、上記エンボス加工面に重ね合わせると共に
、上記中間層に用いた樹脂の溶融温度以上の温度で加熱
プレスすることを特徴とするエンボス潰れ防止方法。
When a plate-shaped body having a thermoplastic resin layer with an embossed surface is laminated onto a core material by hot pressing to form an integral structure, a base material layer, an intermediate layer of resin having a melting temperature lower than that of the thermoplastic resin, and A method for preventing emboss collapse, which comprises superimposing the adhesive layer surface of a laminated protective film comprising an adhesive layer on the embossed surface and hot pressing at a temperature equal to or higher than the melting temperature of the resin used for the intermediate layer.
JP22420088A 1988-09-07 1988-09-07 Emboss collapse prevention method Expired - Fee Related JP2605822B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22420088A JP2605822B2 (en) 1988-09-07 1988-09-07 Emboss collapse prevention method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22420088A JP2605822B2 (en) 1988-09-07 1988-09-07 Emboss collapse prevention method

Publications (2)

Publication Number Publication Date
JPH0272934A true JPH0272934A (en) 1990-03-13
JP2605822B2 JP2605822B2 (en) 1997-04-30

Family

ID=16810093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22420088A Expired - Fee Related JP2605822B2 (en) 1988-09-07 1988-09-07 Emboss collapse prevention method

Country Status (1)

Country Link
JP (1) JP2605822B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008190954A (en) * 2007-02-02 2008-08-21 Shinko Electric Co Ltd Method and apparatus for attaching liquid level sensor in tank

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008190954A (en) * 2007-02-02 2008-08-21 Shinko Electric Co Ltd Method and apparatus for attaching liquid level sensor in tank

Also Published As

Publication number Publication date
JP2605822B2 (en) 1997-04-30

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