JPH0272627A - Processor - Google Patents

Abstract

PURPOSE:To enable breakdown prevention of a means which detects unreacted gas and maintenance of safety by providing a means which sets an unreacted gas detection means in noncontact with gas according to the kind of gas to be used in a treatment room. CONSTITUTION:Steam generated in an outside combustion mechanism 9 is supplied into a reaction tube 1 through a gas introduction tube 8, and an exhaust tube 10 is connected to the lower part of the reaction tube 1. And in an exhaust tube 9 is provided a means which detects specified unreacted gas, for example, a hydrogen detector 11. Further, a means which puts the hydrogen detector 11 in noncontact with gas according to the kind of gas used in a treatment part 2, for example, a protective mechanism 12 which isolates the hydrogen detector 11 from the space in which gas is flowing so as to protect the hydrogen detector 11 is provided. Hereby, breakdown of the hydrogen detector 11 can be prevented, and the operation of the device can be performed in the condition that the safety is maintained.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a processing device.

(Prior Art) In heat treatment of objects to be processed, such as semiconductor wafers, such as oxidation processes, heat treatment apparatuses equipped with processing chambers, that is, reaction tubes are used. This heat treatment equipment involves inserting a boat carrying multiple wafers in an array into a quartz reaction tube wrapped with a heater wire that can generate heat from the open end of the reaction tube, and placing it at a predetermined position inside the reaction tube. After setting, the opening end is sealed with a lid, and while the wafer is heated by heat generated by the heater wire, water vapor or the like is introduced to perform oxidation treatment. Examples of such oxidation treatment techniques include Japanese Patent Publications No. 58-182 and Japanese Patent Publication No. 62-6342.

It is disclosed in Japanese Patent Publication No. 63-28496, Japanese Unexamined Patent Publication No. 55-90405, etc.

In this type of oxidation treatment, an oxide film is formed on the wafer surface by water vapor generated by burning oxygen gas and hydrogen gas, but if the hydrogen gas flows through the reaction tube without reacting or burning, it will explode. Because of the danger, incomplete combustion of hydrogen gas is monitored by providing means for detecting unreacted gas, such as the hydrogen gas detector described above, in the exhaust section.

(Problem to be Solved by the Invention) However, in the above-mentioned conventional technology, the reaction tube is cleaned periodically, or hydrogen chloride (H(J) + oxygen gas is used as a substitute for hydrogen gas + oxygen gas, which is the oxidation processing gas). When used, the sensing part of the hydrogen detector used in the exhaust part is oxidized by the above H(14).

There was a problem in that the hydrogen detector was damaged due to corrosion. If this hydrogen detector is damaged and the hydrogen gas + oxygen gas oxidation process is performed and the hydrogen gas is incompletely combusted, it will not be able to detect this and there is a risk that the above explosion will occur. There was a problem in that safety and normal operation of the equipment could not be maintained.

The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide a processing device that can prevent damage to the means for detecting unreacted gas and maintain safety.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a processing apparatus for processing an object to be processed in a processing chamber equipped with a means for detecting a predetermined unreacted gas. The present invention provides a processing apparatus characterized in that means is provided for setting the unreacted gas detection means to be in non-contact with the gas depending on the type.

(Operation and Effect) That is, the present invention provides means for making the unreacted gas detection means non-contact with the gas, depending on the type of gas used in the processing chamber, so that the unreacted gas detection means can be Damage can be prevented and the device can be operated while maintaining safety.

(Example) Hereinafter, an example in which the apparatus of the present invention is applied to an oxidation step in a semiconductor manufacturing process will be described with reference to the drawings.

First, the configuration of the oxidizer will be explained.

This device is, for example, a vertical reactor as shown in Figure 1.
A processing section (2) consisting of a reaction tube (0) whose axis is vertical, and a plurality of objects to be processed, such as semiconductor wafers (3), to be carried in and out of this processing section (2) in the vertical direction, for example, 100 to 15
Supports loaded at a predetermined interval of about 0 sheets, for example, boat 0), and this boat (a) are transported from the transfer position 0 to the reaction tube (υ
It consists of a transport mechanism (0) that loads and unloads the machine.

The reaction tube ω of the processing section (2) is made of a material that is heat resistant and does not easily react with the processing gas, such as quartz, and has its upper surface sealed. A cylindrical heating mechanism, for example, a heater ω wound in a coil shape, is provided so as to coaxially surround this reaction tube (2), and this heater (2) maintains the inside of the area where the wafer (3) is placed at a desired temperature, for example. It is provided so as to uniformly heat the temperature to 600-1400°C.

Further, at the upper part of the reaction tube ω, a gas introduction tube (8
) is connected, and this gas introduction pipe (8) is connected to the external combustion mechanism 0. Although not shown, the external combustion mechanism 0 includes a heating means that independently introduces predetermined amounts of oxygen gas and hydrogen gas and heats them to a temperature above the ignition point, and a combustion combination of the oxygen gas and hydrogen gas. This external combustion mechanism 0)
The water vapor generated can be supplied into the reaction tube ω via the gas introduction pipe (8). An exhaust pipe (10) is connected to the lower part of the reaction tube (2).

The exhaust pipe (9) is equipped with a means for detecting a predetermined unreacted gas, such as a hydrogen detector (11) shown in FIG. means for making the hydrogen detector (11) non-contact with the gas, such as a protection mechanism that protects the hydrogen detector (11) by isolating the hydrogen detector (11) from a space in which the gas flows; 12) is provided.

This protection mechanism (12) is provided with a lid (14) that is movable by being connected to a -axis drive mechanism, such as an air cylinder (13). The lid body (14) has a semicircular shape, for example, and when the hydrogen detector (11) is inserted therein, the opening end of the lid body (14) comes into contact with the inner wall surface of the protection mechanism (12). It is configured to protect the hydrogen detector (11). At this time, an O-ring (15) is provided at the open end of the lid (14), so that when the lid (14) comes into contact with the inner wall surface of the protection mechanism (12),
14) The interior can be made airtight.

A lid (16) is detachably provided so as to keep the inside of the reaction tube ω configured as described above airtight.

A boat (A) loaded with the wafers (3) is provided above the lid (16). This boat (A) is made of a material with excellent heat resistance, such as quartz, and is set at a predetermined height position within the reaction tube (1). ) inside the boat (a) and the lid body (
16).

The lid body (16) is supported by a conveyance mechanism (6) consisting of, for example, a ball screw and a motor, so that the bow 1-K can be moved in the vertical axis direction.

The operation of the oxidizing device having the above-described configuration is controlled by a control section (not shown). The oxidizing device is configured in this way.

Next, the operation of the above-mentioned oxidation device will be explained.

First, a boat (A) loaded with wafers (3) is gripped by a handler (18) and placed on a heat-insulating cylinder (17) set at the transfer position (2) by a transfer device (not shown). Then, the boat (A) is raised by a predetermined amount using the transport mechanism (0) and carried to a predetermined position in the reaction tube (2) without contacting the inner wall of the reaction tube (2). By bringing the lower end of the tube (υ) into contact with the lid (16), the wafer (3) is automatically positioned and the inside of the reaction tube ■ is made airtight. is heated by the heater (1), which has been heated to a predetermined temperature in advance.The heater ω is heated to a predetermined temperature, for example, about 850°C, while controlling the temperature using, for example, a thermocouple.In this heating state, , water vapor is introduced into the reaction tube (1) to oxidize the wafer (2).The introduced water vapor is
It is generated within the external combustion mechanism (9). That is, hydrogen gas and oxygen gas are supplied into the combustion chamber of the external combustion mechanism (9) at a predetermined supply ratio. Note that the ratio of hydrogen gas and oxygen gas required for combustion to generate steam is a predetermined ratio, but by supplying a large amount of oxygen gas, oxygen gas that is not used for combustion is transferred to steam into the reaction tube (1). It can be used as a carrier gas when supplying. It goes without saying that this oxygen gas is also used to form an oxide film.

Here, the hydrogen gas and oxygen gas just before being supplied into the combustion chamber are heated by a heating means (not shown) to a temperature higher than the ignition point of the hydrogen gas, for example, to provide the energy necessary for combustion. . Then, at the moment this hydrogen gas is supplied to the combustion chamber, this hydrogen gas comes into contact with oxygen gas, ignites, and starts combustion. Note that since there is no oxygen gas or air before the hydrogen gas is supplied to the combustion chamber, it goes without saying that there is no risk of the hydrogen gas igniting during the flow of the hydrogen gas.

When the hydrogen gas and oxygen gas are burned in this way, water vapor is generated, and this water vapor enters the reaction tube (υ) through the gas introduction pipe (8), where the oxidation treatment of the wafer (2) is performed. During the oxidation treatment and when the airtightness inside the reaction tube (υ
0) as appropriate.

During such oxidation treatment, the hydrogen gas used to generate water vapor in the combustion chamber does not combust, and if it is incompletely combusted and the hydrogen gas is supplied into the reaction tube (υ), it will explode. Therefore, safety measures are taken by interposing a means for detecting unreacted gas, such as a hydrogen detector (11) for detecting the incompletely combusted hydrogen gas, in the middle of the exhaust pipe (10). This hydrogen detector (11
) is used, but the sensing part of this hydrogen detector (11) is usually made of a material that is easily oxidized and corroded. Therefore, when using hydrogen chloride (HCR) decaoxygen gas instead of the above-mentioned oxidation treatment using hydrogen gas + oxygen gas, or when using HCQ for periodically cleaning the inside of the reaction tube (g), it is natural that The above exhaust pipe (
10) also flows H(4. Then, this H
Due to CQ, the sensing part of the hydrogen detector (11) is oxidized.
Due to corrosion, the hydrogen detector (11) was damaged.
Normal operation will no longer occur. Therefore, it is necessary to take measures to prevent the sensing portion of the hydrogen detector (11) from being damaged, that is, from oxidation and corrosion. There are two ways to take this measure; one is to take measures against oxidation and corrosion of the sensing portion of the hydrogen detector (11). The other is to connect at least the sense part of the hydrogen detector (11) to the O
It is intended to be in a non-contact state with CR. In the former method,
The sensing portion of the hydrogen detector (11) needs to be made of a material that is oxidation-resistant, corrosion-resistant, and has the above-mentioned hydrogen detection ability, making it expensive. Therefore, by applying the latter means, it is possible to obtain an inexpensive and easy structure, and to have good safety and durability. That is, the above hydrogen detector (
11) out of contact with the exhausted gas, such as a protection mechanism (12) that isolates the hydrogen detector (11) from the space through which the gas flows and protects the sensing portion of the hydrogen detector (11); It is carried out by A sensor for detecting a predetermined oxidizing/corrosive gas, such as HCR, is provided, for example, on the upstream side of the protection mechanism (12) of the exhaust pipe (10), and when this sensor detects the HCR, the air cylinder ( 13) to drive this air cylinder (
The above-mentioned hydrogen detector (
11) to make this hydrogen detector (11) non-contact with the HCQ. Then, the HCR has the protection mechanism (1
2) Even if it passes through the inside, it does not come into contact with the hydrogen detector (11), and damage to the hydrogen detector (11) can be prevented.

In the above embodiment, the protection mechanism (12) that makes the hydrogen detector (11) non-contact with oxidizing and corrosive gas is connected to the exhaust pipe (10).
Although we have described an example in which the operation is performed based on the output of a sensor installed in the
A similar effect can be obtained by configuring the protection mechanism (12) to be operated as appropriate, such as when performing cleaning with ICR+O, oxidation treatment with ICR+O, or the like.

Furthermore, in the above embodiments, semiconductor wafers were used as an example of the object to be processed, but the object is not limited to this; for example, LCDs used in screen display devices such as liquid crystal TVs, etc.
Similar effects can be obtained when applied to substrates, printed circuit boards, etc.

As described above, according to this embodiment, the unreacted gas detection means, for example, the hydrogen detection means, is provided with means for making it non-contact with the gas, depending on the type of gas used in the processing chamber. Damage to the reactive gas detection means can be prevented, and the device can be operated while maintaining safety.

[Brief explanation of the drawing]

FIG. 1 is a block diagram of an oxidizing device for explaining one embodiment of the device of the present invention, and FIG. 2 is an explanatory diagram of the protection mechanism of FIG. 1. 1... Reaction tube, lO... Exhaust pipe, 11...
Hydrogen detector, 12...protection mechanism, 13...air cylinder, 14...lid body.

Claims (1)

[Claims] In a processing apparatus that processes an object to be processed in a processing chamber equipped with a means for detecting a predetermined unreacted gas, the unreacted gas detection means may be used in accordance with the type of gas used in the processing chamber. 1. A processing device characterized by being provided with means for setting the device in a non-contact manner with a gas.