JPH0272559U - - Google Patents
Info
- Publication number
- JPH0272559U JPH0272559U JP15271588U JP15271588U JPH0272559U JP H0272559 U JPH0272559 U JP H0272559U JP 15271588 U JP15271588 U JP 15271588U JP 15271588 U JP15271588 U JP 15271588U JP H0272559 U JPH0272559 U JP H0272559U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semicircular recess
- flatpack
- tip
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15271588U JPH0272559U (cs) | 1988-11-22 | 1988-11-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15271588U JPH0272559U (cs) | 1988-11-22 | 1988-11-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0272559U true JPH0272559U (cs) | 1990-06-01 |
Family
ID=31427891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15271588U Pending JPH0272559U (cs) | 1988-11-22 | 1988-11-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0272559U (cs) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2024065885A (ja) * | 2022-10-31 | 2024-05-15 | 矢崎総業株式会社 | 配線基板 |
-
1988
- 1988-11-22 JP JP15271588U patent/JPH0272559U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2024065885A (ja) * | 2022-10-31 | 2024-05-15 | 矢崎総業株式会社 | 配線基板 |