JPH0272200U - - Google Patents
Info
- Publication number
- JPH0272200U JPH0272200U JP15190888U JP15190888U JPH0272200U JP H0272200 U JPH0272200 U JP H0272200U JP 15190888 U JP15190888 U JP 15190888U JP 15190888 U JP15190888 U JP 15190888U JP H0272200 U JPH0272200 U JP H0272200U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- control member
- heat
- conductive mesh
- dissipation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15190888U JPH0272200U (xx) | 1988-11-22 | 1988-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15190888U JPH0272200U (xx) | 1988-11-22 | 1988-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0272200U true JPH0272200U (xx) | 1990-06-01 |
Family
ID=31426367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15190888U Pending JPH0272200U (xx) | 1988-11-22 | 1988-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0272200U (xx) |
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1988
- 1988-11-22 JP JP15190888U patent/JPH0272200U/ja active Pending