JPH0271550A - Memory cartridge - Google Patents

Abstract

PURPOSE:To contrive the improvement of the reliability of connection and an increase the longevity of a memory cartridge by a method wherein outer leads are housed in one site of a resin constituting the memory cartridge and at the same time, the memory cartridge is provided with the group of narrow groove parts opened toward both surfaces of the surfaces and rears of the outer leads in a comb-teeth form. CONSTITUTION:In a lead frame 2, on which an LSI chip 1 is placed and the connection between the chip and the lead frame is finished, the frame 2 and the chip 1 are molded 9 with a molding resin and a package main body 10 of a memory cartridge is formed. At this time, the group of outer leads 6 of the frame 2 is resin-molded in a state that surface parts 11a and rear parts 11b, which serve as connection-contact faces with connectors of an external apparatus, are locally exposed from the molded resin part 9. In such a way, the group of the outer leads 6 is formed into a structure that both surfaces of each electrode are exposed in the group of groove parts 13a and 13b, which are formed from the side of the main surface of the same package main body 10 and the side of the surface reverse to the main surface and constitute the molded resin part 9. Accordingly, the electrode parts are prevented from being touched directly at the time of handling of the memory cartridge and the LSI chip can be protected from electrostatic breakdown.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a memory card or a memory cartridge in which a semiconductor chip such as a memo IJ-LSI is used as an information recording element.

2. Description of the Related Art A portable information recording medium using a memory semiconductor element, commonly referred to as a memory card or memory cartridge (hereinafter referred to as a memory cartridge in this application), is a recording medium using a conventional magnetic disk or magnetic tape. Compared to media, it is less affected by external environmental conditions and is highly reliable, and there are no moving parts, making it easy to handle.
Furthermore, because it can be easily miniaturized, it has attracted attention as a new information recording medium and is used in many fields such as portable electronic devices and game devices such as video games.

The structure of this memory cartridge consists of memory LSIs (static RAM, mask ROM, KPROM) housed in a small package such as a flat package or more.
, KKPROM, etc.) on a wiring board such as a printed circuit board, or directly mount the memo IJ-LSI on the wiring board, and then connect the wiring board and external equipment (for example, the above-mentioned portable electronic equipment). together with connection terminals and backup batteries (in the case of static RAM), the size is usually called the IC card size (85,
The structure is such that it is housed in a cartridge body case of 6ffg x 64H1 thickness (approximately 3ff).

The terminal for connection to the external device described above is electrically connected to the input electrode portion of the LSI chip inside the cartridge main body case. Therefore, in order to prevent electrostatic damage to the LSI chip that occurs when the connection terminal comes into contact with a charged object such as a human body, a protective shutter mechanism is installed to prevent the electrode terminal from being exposed when not in use. Countermeasures have been taken, such as adopting a connector with non-exposed electrode contacts, called a two-piece connector.

Problems to be Solved by the InventionMemory Car) In order to increase the storage capacity of U-judges, a configuration is generally adopted in which a plurality of memory LSIs are housed in a memory cartridge.

On the other hand, with the progress of technological development of memo IJ-LSI chips,
As the capacity of Memo IJ-LSI continues to increase, there are many requests for memory cartridges with a 1-chip or Vi1 package configuration using Memo LS Ii, and their uses are also expanding.

Furthermore, as mentioned above, a memory cartridge used as a static RAM recording element necessarily requires an auxiliary power source such as a memory storage battery due to its functionality.
Although it must be installed in the IJ, memory cartridges such as mask ROMs that use memory cards as recording media do not require auxiliary parts such as batteries, and the quality performance required for these memory cartridges is low cost and reliable. It is highly portable, and has a compact and easy-to-shoot structure.

However, what is the basic structure of conventional memory cartridges?

(1) Note 1.1-L on the wiring board such as a printed circuit board
Install and implement SI.

(Threshold: An external connection terminal is formed at one end of the wiring board.

(3) Mount the above wiring board on the main body case.

The structure consists of

Furthermore, if the external connection terminal is made to have an anti-static structure as a countermeasure against static electricity, the number of parts and manufacturing man-hours will increase, and this also imposes restrictions on miniaturization of the memory cartridge itself.

Furthermore, one of the challenges was to improve the connection reliability between the above-mentioned external connection terminal and the connection contact electrode of an external device.

Means for Solving the Problems The memory cartridge of the present invention has a non-tentacle type anti-static structure in the connection terminal portion, and also has a double-sided contact structure with a large contact area and contact points, thereby improving connection reliability. We aim to improve the performance and extend the lifespan.

That is, the memo IJ-L S
A semiconductor chip such as I is mounted, electrical connections are made between the electrodes of the semiconductor chip and the lead frame, the semiconductor chip and the lead frame are embedded in resin, and the aligned outer lead portions of the lead frame are placed. is disposed in a groove having openings toward both the front and back surfaces of the resin, and is exposed on the front and back surfaces within the groove.

Function The memory cartridge of the present invention accommodates an outer lead (electrode terminal for external connection) in a part of the resin constituting the memory cartridge, and has a group of narrow grooves in a comb-like shape that are open toward both the front and back sides. be.

Therefore, since the outer leads are located in the same groove, even if this memory cartridge is handled directly with bare hands, direct contact with the outer lead group is prevented, and the outer leads are not connected to the same terminal group. Electrostatic damage caused by the tentacles of semiconductor chips can be prevented.

In addition, the outer lead group has a structure in which both sides are exposed within the groove, so the contact electrodes of external device connectors can be contacted from both the top and bottom sides, improving connection reliability and extending life. .

Furthermore, the memory cartridge itself is small in size, has a simple structure, and the manufacturing process is roughly the same as the assembly manufacturing process for normal ICs and LSIs, making it easy to automate the manufacturing process. It becomes easy to provide a memory cartridge with a high and robust structure.

Embodiment Figure 1 is a perspective view illustrating the overall structure and local internal structure of the IJ (memory car of the present invention), and Figure 2 is the memory car according to the present invention.
Figure 3 is an enlarged perspective view of the main parts explaining the structure of the external connection electrode terminal part, Figure 3 is a front view explaining the external connection electrode terminal part, and Figure 4 is an example of the structure of the lead frame of this memory cartridge. FIG.

Note that each drawing is shown at an arbitrary dimensional ratio for convenience of explanation.

Embodiments of the memory cartridge of the present invention will be described in detail below with reference to the drawings.

As shown in each figure, the memory cartridge of the present invention differs from the conventional memory car 1-ridge configuration in that it has an LS
This structure uses a lead frame that basically has the same structure as the lead frame used for assembling and mounting ICs.

That is, as shown in FIGS. 1 and 4, the inner lead portion 3 of the lead frame 2 has a die pad 3b on which a memory LSI chip (hereinafter referred to simply as an LSI chip) 1 is placed, and an electrode pad of the LSI chip 1 (see FIG. An inner lead 3 is provided for electrical connection to the LSI chip 1 (not shown), and a connection wire 6 or the like is used to interconnect the electrodes with the power supply terminal 4 of the LSI chip 1.

As shown in the figure, the other end of the lead frame 2 has a structure in which electrode leads for external connection, that is, outer leads 6, are arranged substantially parallel in one direction. , a cutting allowance 8 is provided for cutting away from the lead frame frame 7.

Note that in the drawings for this explanation, the connection between the electrode terminals of the LSI chip 1 and the inner leads 3 is shown as an example of connection by a wire bonding method using the connection wire 6, but the connection is not limited to the example shown. Instead, a protruding electrode is formed on the electrode of the LSI chip 1 in advance, and the protruding electrode is directly connected to the inner lead of the lead frame 2. Alternatively, the electrode terminal of the LSI chip 1 and the lead frame are connected by a direct bonding method. The connection may be made by interposing a conductive material (for example, anisotropically conductive rubber) between the inner leads of the LSI chip 1 and fixing the LSI chip 1 to the inner leads to connect the electrode terminals.

Lead frame 2 with LSI chip 1 mounted and connections completed
As shown in the perspective view of FIG.
A package body 1o (hereinafter simply referred to as a package body 1o) is formed.

At this time, the outer lead 6 portion of the lead frame 2
As shown in FIGS. 3 and 3, a front surface portion 111L and a back surface portion 11 serve as a connection contact surface with a connector (not shown) of an external device.
b is resin-molded in a shape that is locally exposed from the resin molding 9 part. That is, in the outer lead 6 portion at the same location, the main surface 12 of the puff cage main body 1o
Surface 1 of outer lead 6 from the side 12b opposite to IL
12L and the back surface 11b as the bottom surfaces, the portion including the two side surfaces of the side surface 110. It is embedded in the resin molding 9 and resin molding with a groove type structure is performed.

The package body 10 molded as described above is cut from the lead frame frame 7 with a cutting allowance of 8 parts, and is then separated from the lead frame frame 7.

At this time, it is preferable to cut the outer lead 6 so that the cut surface of the outer lead 6, that is, the tip end face 1115 of the lead is set back from the end face 14 of the package body 10, as shown in FIG.

With the above configuration, the LSI chip 1 is embedded in a part of the resin molding 9 constituting the package body 1o, and the group of outer leads 6, which is the other end of the lead frame 2 connected to the LSI chip 1, Same package body 1
The memory cartridge can have a structure in which both sides of the electrode are exposed in the group of grooves 132L and 13b formed by the resin molding 9 formed from the main surface side and the opposite side of the memory cartridge.

In addition, in the above embodiment, as shown in FIG. 3, the opening width of the groove 131 on the main surface 411112a of the package body 10 and the opening width B of the groove 13b on the opposite surface side 12b are the same size. The opening width of the groove 13a on the main surface side and the opening width B of the groove 13b on the opposite side are different, that is, the width of the 9 parts of the comb-shaped resin molded product forming the same groove.
If either the main surface side 12a or the opposite surface side 12b is made thicker, the mechanical strength of the same portion becomes stronger, and
By taking advantage of the different cross-sectional shapes, it can also be used to prevent reverse insertion into the connector.

In addition, in the drawings for explaining the embodiment shown in FIGS. 1 to 3, the main surface of the package body 10 of the memo IJ-LSI chip 1 part is compared to the main surface part of the package body 10 of the outer lead 6 part. Although the shape is such that the main surface 12& is formed at a low position, the shape is not limited to the shape shown in the figure.
The position of 2& and the main surface of the package body 10 of the memo IJ-LSI chip 1 portion may be formed on the same plane.

Effects of the Invention As described in the embodiments, the memory cartridge of the present invention has a simple structure and can be easily made small and lightweight.It also has a strong structure in which a semiconductor chip is embedded in resin, and it is easy to connect with external equipment. The structure in which the outer lead part for connection is provided inside the groove prevents direct contact with the electrode part when handling this memory car (IJ).
It can protect LSI chips from electrostatic damage.

In addition, the electrode terminals are exposed on both the main and opposite sides of the IJ (memory card), so when connecting to an external device connector, the connector's contact electrodes can be installed from both sides. This makes it possible to reduce the contact area with the electrode,
It is possible to provide a highly reliable and high quality memory cartridge with an increased number of contact areas.

Therefore, the memory cartridge of the present invention is small and lightweight, has a robust and highly reliable structure, and can be used as an information recording medium for portable translators, dictionaries, etc. or portable information terminal devices. Portable electronic devices can be made smaller and lighter.

Another feature of the memory car of the present invention is its simple configuration. +Judge has a simpler structure than conventional ones, which reduces manufacturing costs and requires lower costs for information recording media. If it is used as an information recording medium for electronic devices, for example game devices such as video games, it is possible to reduce the cost of these electronic devices.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway perspective view showing a memory cartridge according to an embodiment of the present invention, FIG. 2 is an enlarged perspective view of main parts showing the terminal portion, and FIG. 3 is a front view showing the front shape of the terminal portion. FIG. 4 is a plan view illustrating an example of the shape of the lead frame. 1...Memory LSI chip, 2...
Lead frame, 3... Inner lead part, 3
b... Die pad, 4... LSI chip electrode terminal, 6... Connection wire e...
... Outer lead, 7 ... Lead frame frame body, 8 ... Lead frame cutting allowance, 9 ...
...Resin molded product, 10...Package body, 11&...Surface part of outer lead, 11b...Back part of outer lead, 11C
111d...Side surface of outer lead, 11el
...Tip surface of outer lead, 121L...
... Main surface of the package body, 12b... Opposite surface of the package body, 131L, 13b...
...Groove formed by molded resin, 14...
・The end face of the package body. Figure No. 1, 5I Nazugu Figure

Claims (3)

[Claims] (1) A semiconductor chip such as a memory LSI is placed on one surface of a lead frame that has a plurality of outer lead portions arranged approximately in parallel, and electrical connections are made between the electrodes of this semiconductor chip and the lead frame. A semiconductor chip and a lead frame are embedded in a resin, and the aligned outer lead portions of this lead frame are placed in a groove that has openings toward both the front and back sides of the resin, and Memory cartridge exposed on the back. (2) The memory cartridge according to claim 1, wherein the tip of the outer lead portion is arranged at a position set back from the tip surface of the groove. (3) The memory cartridge according to claim 1 or 2, wherein the opening width of the groove portion formed in the outer lead portion is made different between one side and the opposite side.