JPH027127B2 - - Google Patents
Info
- Publication number
- JPH027127B2 JPH027127B2 JP57110455A JP11045582A JPH027127B2 JP H027127 B2 JPH027127 B2 JP H027127B2 JP 57110455 A JP57110455 A JP 57110455A JP 11045582 A JP11045582 A JP 11045582A JP H027127 B2 JPH027127 B2 JP H027127B2
- Authority
- JP
- Japan
- Prior art keywords
- key
- lead
- leads
- key wiring
- wiring section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000005041 Mylar™ Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Input From Keyboards Or The Like (AREA)
- Manufacture Of Switches (AREA)
- Rotary Switch, Piano Key Switch, And Lever Switch (AREA)
Description
【発明の詳細な説明】
本発明は、製造工程を著しく簡素化した薄型キ
ーの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a thin key that significantly simplifies the manufacturing process.
近時、電卓、ワードプロセツサ等種々の電子機
器の入力部としてキーが使用されており、しかも
これら電子機器においては、構成各部の小型軽量
化及び簡素化が要求されている。 2. Description of the Related Art Recently, keys have been used as input units for various electronic devices such as calculators and word processors, and each component of these electronic devices is required to be smaller, lighter, and simpler.
従つて、キーについても小型軽量化及び簡素化
することが要求されている。 Therefore, keys are also required to be smaller, lighter, and simpler.
従来汎用されているキーは、第４図に示すよう
に、キー配線Ｃの下位に、所定間隔毎に透孔を穿
設したスペーサＤを設け、更にスペーサＤの下位
にカーボン電極Ｅを配設してキー配線部Ｇを形成
するとともに、キーゴムＢの所定位置上面に文
字、数字等Ａを印刷し、更に文字、数字等Ａの印
刷部下面を垂下させてキー配線押圧部A′を設け
ることによつてキートツプＦを形成して成る。 As shown in Fig. 4, conventional general-purpose keys have spacers D with through holes drilled at predetermined intervals below the key wiring C, and carbon electrodes E below the spacers D. At the same time, letters, numbers, etc. A are printed on the upper surface of the key rubber B at a predetermined position, and the lower surface of the printed letters, numbers, etc. A is made to hang down to form a key wiring pressing portion A'. The key top F is formed by
即ち、キートツプＦとキー配線部Ｇとを別体に
構成するとともに、キートツプＦをキー配線部Ｇ
の上位に定設することによりキーを構成して成
る。 That is, the key top F and the key wiring part G are configured separately, and the key top F is configured separately from the key wiring part G.
The key is configured by setting above the .
従つて、キートツプＦの所望の文字、数字等印
刷部を押圧すれば、キー配線Ｃをカーボン電極Ｅ
に接触させることができ、以て所望の文字、数字
等に対応する信号を入力することができるのであ
る。 Therefore, by pressing the desired characters, numbers, etc. printed portion of the key top F, the key wiring C is connected to the carbon electrode E.
With this, it is possible to input signals corresponding to desired characters, numbers, etc.
しかし、このような構成とすれば、キー配線部
Ｇがキー配線Ｃとカーボン電極Ｅとの重ね構造で
あり、しかもキー配線部Ｇの上面にキートツプＦ
を有することとなるので、全体として肉厚状とな
るのみならず、キー配線部Ｇの製造工程、キート
ツプＦの製造工程及びキートツプＦとキー配線部
Ｇとを互に位置決めして組み立てる組み立て工程
とを必要とするので製造コストが嵩む等の欠点が
ある。 However, if such a configuration is adopted, the key wiring part G has an overlapping structure of the key wiring C and the carbon electrode E, and the key top F is placed on the upper surface of the key wiring part G.
Therefore, not only is the wall thick as a whole, but also the manufacturing process of the key wiring part G, the manufacturing process of the key top F, and the assembly process of mutually positioning and assembling the key top F and the key wiring part G. This has disadvantages such as increased manufacturing cost.
本発明は、操作キーとリードとからなる上位キ
ー配線部と、キー接点とリードとからなる下位キ
ー配線部とをフレーム内の所定位置に形成すると
共に、該上位キー配線部と該下位キー配線部とを
絶縁板の上面と下面に接着することにより上記欠
点を解消したものであり、以下実施例を示す添付
図面によつて詳細に説明する。 The present invention forms an upper key wiring section consisting of an operation key and a lead, and a lower key wiring section consisting of a key contact and a lead at a predetermined position in a frame, and furthermore, the upper key wiring section and the lower key wiring section are formed at predetermined positions in a frame. The above-mentioned drawbacks are solved by bonding the parts to the upper and lower surfaces of the insulating plate, and will be described in detail below with reference to the accompanying drawings showing examples.
第１図は、本発明に係るキーの平面図、第２図
は第１図の−断面図であり、上位キー配線部
１と、下位キー配線部２と、両キー配線部間に介
挿した絶縁部３とから構成されている。 FIG. 1 is a plan view of the key according to the present invention, and FIG. 2 is a cross-sectional view taken from FIG. and an insulating section 3.
上位キー配線部１は、導電性金属薄板から成る
３本のリード１１，１１，１１を主体として構成
されており、各リードの所定位置に夫々３個宛の
円板状の操作キー１２，１２，１２を設け、更に
各リードの所定位置にリード引き出し部１３，１
３，１３を設けている。 The upper key wiring section 1 is mainly composed of three leads 11, 11, 11 made of conductive thin metal plates, and three disk-shaped operation keys 12, 12 are provided at predetermined positions on each lead. , 12, and lead extraction portions 13, 1 at predetermined positions of each lead.
3 and 13 are provided.
尚、１４は操作キー１２の中央部を凹設させて
形成した文字、数字等のパターンである。 Note that 14 is a pattern of letters, numbers, etc. formed by recessing the center portion of the operation key 12.
下位キー配線部２は、導電性金属薄板から成る
３本のリード２１，２１，２１を主体として構成
されており、各リード２１，２１，２１を前記３
本のリード１１，１１，１１と直角方向に向くよ
う並設し、各リードの所定位置に、各操作キーの
直下に位置させて夫々３個宛の方形のキー接点２
２，２２，２２を設け、更に各リードの所定位置
にリード引き出し部２３，２３，２３を設けてい
る。 The lower key wiring section 2 is mainly composed of three leads 21, 21, 21 made of a conductive metal thin plate, and each lead 21, 21, 21 is connected to the three leads 21, 21, 21.
The rectangular key contacts 2 are arranged so as to face perpendicularly to the leads 11, 11, 11 of the book, and are located at a predetermined position on each lead, directly below each operation key, and are respectively addressed to three keys.
2, 22, 22 are provided, and lead extraction portions 23, 23, 23 are further provided at predetermined positions of each lead.
尚、リード引き出し部２３，２３，２３を前記
リード引き出し部１３，１３，１３と平行に、か
つ近接させて設けることにより、図示しないコネ
クタへの接続を容易に行ない得るようにしてい
る。 Incidentally, by providing the lead-out portions 23, 23, 23 parallel to and close to the lead-out portions 13, 13, 13, connection to a connector (not shown) can be easily made.
絶縁部３は、例えばマイラー板を主体として構
成されており、操作キーとキー接点とに正対する
位置に操作キーより大径の透孔３１，３１…を穿
設し、更に上面及び下面にホツトメルト剤から成
る接着剤層３２，３３を設けている。 The insulating part 3 is mainly composed of, for example, a mylar plate, and has through holes 31, 31, . Adhesive layers 32 and 33 made of adhesive are provided.
尚、マイラー板の厚みは、操作キーを押圧した
とき、該操作キーとキー接点とが接触して所定の
電子回路を導通させ、操作キーの文字、数字等に
対応する信号を電子機器本体に読み込ませるよう
にしている。 The thickness of the Mylar board is such that when an operation key is pressed, the operation key and the key contacts come into contact and conduct a predetermined electronic circuit, sending signals corresponding to the letters, numbers, etc. on the operation key to the electronic device body. I'm trying to load it.
第３図は、１枚の導電性金属薄板にプレス加工
を施こすことにより、上位キー配線部１と下位キ
ー配線部２とを打ち抜き形成した状態を示す平面
図であり、周縁部に方形のフレーム１５を有する
とともに、前記リード１１，１１，１１，２１，
２１，２１とフレーム１５との間及びリード引き
出し部１３，１３，１３，２３，２３，２３とフ
レーム１５との間に夫々連結部１６，１６…を設
けている。尚、１７，１７は中心孔、１８，１８
…は位置合わせ孔である。 FIG. 3 is a plan view showing a state in which the upper key wiring section 1 and the lower key wiring section 2 are punched out by pressing a single conductive metal thin plate, and a rectangular shape is formed on the periphery. It has a frame 15 and the leads 11, 11, 11, 21,
Connection portions 16, 16, . . . are provided between the lead lead-out portions 13, 13, 13, 23, 23, 23 and the frame 15, respectively. In addition, 17, 17 is the center hole, 18, 18
... are alignment holes.
従つて、方形のフレーム１５を、中心孔１７，
１７を結ぶ直線を中心として折り返し、上位キー
配線部１と下位キー配線部２との間に、上下面に
接着剤層３２，３３を有する絶縁部３を挟持させ
ることによりキーを作製することができる。その
後、連結部１６，１６…を切除してフレーム１５
を取り外す。 Therefore, the rectangular frame 15 is inserted into the center hole 17,
17 and sandwiching the insulating part 3 having adhesive layers 32 and 33 on the upper and lower surfaces between the upper key wiring part 1 and the lower key wiring part 2. can. After that, the connecting parts 16, 16... are cut out and the frame 15
Remove.
以上の構成になるキーにおいて、例えば“１”
の操作キー１２1を押圧すれば、リード１１1とリ
ード２１1とが導通し、“２”の操作キー１２2を
押圧すれば、リード１１2とリード２１1とが導通
し、以下同様に、何れかの操作キーを押圧すれ
ば、該操作キー及び正対するキー接点により定ま
るリード同士が導通する。従つて、操作キーと対
応する信号が電子機器において選択され、入力さ
れる。 In the key configured as above, for example, “1”
When the operation key 12 1 of "2" is pressed, the lead 11 1 and the lead 21 1 are brought into conduction, and when the operation key 12 2 of "2" is pressed, the lead 11 2 and the lead 21 1 are brought into conduction, and so on. , when any operation key is pressed, the leads defined by the operation key and the key contacts directly facing each other are electrically connected. Therefore, the signal corresponding to the operation key is selected and input in the electronic device.
また、操作キーの数を多くする必要がある場合
には、例えばリードを多数本とすればよい。 Further, if it is necessary to increase the number of operation keys, for example, a large number of leads may be used.
また、接着剤としてホツトメルト剤を使用した
のは、常温で接着性がなく、作業能率を向上させ
得るからであるが、他の材質製の接着剤を使用す
ることもできる。 Further, a hot melt agent is used as the adhesive because it has no adhesive property at room temperature and can improve work efficiency, but adhesives made of other materials may also be used.
以上のように本発明は、キー全体として薄くす
ることができるので、電子機器全体として、嵩低
くすることができ、また、上位キー配線部にてキ
ートツプを兼ね、更に、該上位キー配線部と下位
キー配線部は、同一のフレーム内に形成され、該
フレームを折り返すことにより、絶縁板の上下の
規定位置に接着されるので、製造工程を簡素化
し、コストダウンを図り得る等特有の効果を奏す
る。 As described above, the present invention allows the key to be made thin as a whole, thereby making it possible to reduce the bulk of the electronic device as a whole.Furthermore, the upper key wiring portion also serves as the key top, and the upper key wiring portion also serves as the key top. The lower key wiring section is formed within the same frame, and by folding back the frame, it is glued to the specified positions on the top and bottom of the insulating plate, which has unique effects such as simplifying the manufacturing process and reducing costs. play.
第１図は本発明キーの平面図、第２図は第１図
の−断面図、第３図はプレス加工にて上位キ
ー配線部及び下位キー配線部を形成した状態を示
す平面図、第４図は従来のキーを示す縦断面図。
１……上位キー配線部、２……下位キー配線
部、３……絶縁部、１１，２１……リード、１２
……操作キー、２２……キー接点、３１……透
孔、３２……接着剤層。
FIG. 1 is a plan view of the key of the present invention, FIG. 2 is a cross-sectional view taken from FIG. FIG. 4 is a vertical sectional view showing a conventional key. 1... Upper key wiring section, 2... Lower key wiring section, 3... Insulating section, 11, 21... Lead, 12
...Operation key, 22...Key contact, 31...Through hole, 32...Adhesive layer.
Claims (1)
作キーとリードとから成る上位キー配線部と、複
数のキー接点とリードとから成る下位キー配線部
とを連結部を介して連続形成した方形のフレーム
を折り返し、該上位キー配線部と該下位キー配線
部とを、所定位置に透孔を穿設した絶縁板の上面
と下面に、該透孔を介して上記操作キーと上記キ
ー接点が正対し、且つ上下のリードが交叉するよ
うに夫々接着した後、上記連結部を切除するよう
にしたことを特徴とする薄型キーの製造方法。1. A rectangular shape made by punching out a conductive metal thin plate and continuously forming an upper key wiring part consisting of a plurality of operation keys and leads and a lower key wiring part consisting of a plurality of key contacts and leads through a connecting part. The frame is folded back, and the upper key wiring section and the lower key wiring section are connected to the upper and lower surfaces of an insulating plate with through holes drilled at predetermined positions, so that the operation keys and the key contacts are connected to each other through the through holes. On the other hand, a method for manufacturing a thin key is characterized in that after the upper and lower leads are bonded so as to intersect, the connecting portion is cut off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57110455A JPS59816A (en) | 1982-06-26 | 1982-06-26 | Key structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57110455A JPS59816A (en) | 1982-06-26 | 1982-06-26 | Key structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59816A JPS59816A (en) | 1984-01-06 |
| JPH027127B2 true JPH027127B2 (en) | 1990-02-15 |
Family
ID=14536141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57110455A Granted JPS59816A (en) | 1982-06-26 | 1982-06-26 | Key structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59816A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4833365A (en) * | 1971-09-01 | 1973-05-09 | ||
| JPS5177035A (en) * | 1974-11-29 | 1976-07-03 | Texas Instruments Inc | |
| JPS5222428A (en) * | 1975-08-11 | 1977-02-19 | Ibm | Keyboard |
| JPS5520520A (en) * | 1978-07-28 | 1980-02-14 | Toshiba Corp | Data input unit |
-
1982
- 1982-06-26 JP JP57110455A patent/JPS59816A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4833365A (en) * | 1971-09-01 | 1973-05-09 | ||
| JPS5177035A (en) * | 1974-11-29 | 1976-07-03 | Texas Instruments Inc | |
| JPS5222428A (en) * | 1975-08-11 | 1977-02-19 | Ibm | Keyboard |
| JPS5520520A (en) * | 1978-07-28 | 1980-02-14 | Toshiba Corp | Data input unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59816A (en) | 1984-01-06 |
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