JPH0271271A - Formation of photosolder resist pattern - Google Patents
Formation of photosolder resist patternInfo
- Publication number
- JPH0271271A JPH0271271A JP22222988A JP22222988A JPH0271271A JP H0271271 A JPH0271271 A JP H0271271A JP 22222988 A JP22222988 A JP 22222988A JP 22222988 A JP22222988 A JP 22222988A JP H0271271 A JPH0271271 A JP H0271271A
- Authority
- JP
- Japan
- Prior art keywords
- water
- photosensitive resin
- heat
- alcohol
- resistant photosensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000015572 biosynthetic process Effects 0.000 title description 2
- 239000011347 resin Substances 0.000 claims abstract description 40
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 28
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000001035 drying Methods 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 15
- 239000012046 mixed solvent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 abstract description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 11
- 239000011248 coating agent Substances 0.000 abstract description 11
- 229910052760 oxygen Inorganic materials 0.000 abstract description 11
- 239000001301 oxygen Substances 0.000 abstract description 11
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 239000004925 Acrylic resin Substances 0.000 abstract description 3
- 229920000178 Acrylic resin Polymers 0.000 abstract description 3
- 239000011877 solvent mixture Substances 0.000 abstract 2
- 206010034972 Photosensitivity reaction Diseases 0.000 abstract 1
- 230000036211 photosensitivity Effects 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 description 8
- 150000002500 ions Chemical class 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000004641 Diallyl-phthalate Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005764 inhibitory process Effects 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000007127 saponification reaction Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- -1 ethylene, propylene, maleic anhydride Chemical class 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Abstract
Description
【発明の詳細な説明】
産業上の利用分舒
本発明は、感光性樹脂を用いてプリント配線板を製造す
る際のホトソルダーレジストパターンの形成方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION Industrial Application The present invention relates to a method for forming a photo solder resist pattern when manufacturing a printed wiring board using a photosensitive resin.
従来の技術
従来、プリント配線板の製造の際に、ソルダーレジスト
、エツチングレジスト及び耐めっきレジストとして、感
光性樹脂を用いることはよく知られている。BACKGROUND ART Conventionally, it is well known that photosensitive resins are used as solder resists, etching resists, and plating-resistant resists in the production of printed wiring boards.
そして、このような感光性樹脂としては、例えばエチレ
ン性不飽和結合を有するフェノールノボラック型又はタ
レゾールノボラック型エポキシ樹脂、光重合開始剤及び
アミン系硬化剤より成る耐熱性感光性樹脂組成物（特開
昭６０−２０８３７７号公報）、ジアリルフタレートプ
レポリマー、光重合性単量体及び光重合開始剤を含有す
る耐熱性感光性樹脂組成物（特開昭５８−１９９３４１
号公報）などが提案されている。Examples of such photosensitive resins include heat-resistant photosensitive resin compositions (specially JP-A No. 60-208377), a heat-resistant photosensitive resin composition containing a diallyl phthalate prepolymer, a photopolymerizable monomer, and a photopolymerization initiator (JP-A No. 58-199341)
Publication No. 2), etc. have been proposed.
通常、これらの耐熱性感光性樹脂組成物は、回路が形成
され、スルーホールが設けられたプリント配線板の両面
にロールコータ、カーテンフローコータなどの塗装具に
よって施され、このものは乾燥したのち、ネガマスクを
介して活性光線を照射し、現像液で未露光部の樹脂を除
去することにより、ホトソルダーレジストパターンを形
成させ、次いでフラックスを塗布し、溶融はんだ中に浸
漬するという過程を経てプリント配線板の製造に用いら
れている。Usually, these heat-resistant photosensitive resin compositions are applied to both sides of a printed wiring board, on which circuits are formed and through holes are provided, using a coating tool such as a roll coater or curtain flow coater, and after drying. , a photo solder resist pattern is formed by irradiating actinic rays through a negative mask and removing the resin in unexposed areas with a developer, then applying flux and immersing it in molten solder. Used in manufacturing wiring boards.
しかしながら、このような耐熱性感光性樹脂組成物は、
露光時に空気中に多量に存在する酸素により光重合が阻
害され、十分な硬化が行われない傾向がある。特に空気
と直接に接触する表面部分は、酸素濃度が高いため、こ
の傾向が著しく、感度の低下を生じたり、水溶性フラッ
クス塗布後のはんだ処理の際に、表面部分が水溶性フラ
ックスによって浸され、外観をそこなう原因となったり
、あるいは水溶性フラックス中に含まれる酸成分がホト
ソルダーレジストパターンに浸透し、プリント配線板の
使用中に腐食を生じるという不都合があった。However, such a heat-resistant photosensitive resin composition,
Photopolymerization is inhibited by large amounts of oxygen present in the air during exposure, and there is a tendency for sufficient curing to occur. In particular, the surface area that comes into direct contact with air has a high oxygen concentration, so this tendency is remarkable, resulting in a decrease in sensitivity, or when the surface area is immersed in water-soluble flux during soldering after application of water-soluble flux. However, there are disadvantages in that the appearance of the printed wiring board may be damaged, or that the acid component contained in the water-soluble flux penetrates into the photo solder resist pattern, causing corrosion during use of the printed wiring board.
このような感光性樹脂の酸素による重合阻害を防止する
方法としては、スクリーン印刷版や凸版印刷版の製造技
術に関し、感光性樹脂層上にポリビニルアルコール被覆
を施し、酸素を遮断する方法が知られている（特公昭６
２．−６１１３７号公報）。As a method for preventing such polymerization inhibition of photosensitive resins caused by oxygen, there is a known method for blocking oxygen by coating the photosensitive resin layer with polyvinyl alcohol, which is used in the manufacturing technology of screen printing plates and letterpress printing plates. (Tokuko Showa 6)
2. -61137).
ところで、このポリビニルアルコール被覆の形成には、
ポリビニルアルコールを水に溶解して塗布することが行
われているか、プリント配線板のホトソルダーレジスト
パターンの形成に際しては、エポキシ樹脂、アクリル樹
脂のような耐熱性、耐薬品性成分を含む耐熱性感光性樹
脂が使用され、これがはっ水性を示すため、前記の方法
をそのまま適用することはできないという問題がある。By the way, to form this polyvinyl alcohol coating,
Polyvinyl alcohol is dissolved in water and applied, or when forming photo solder resist patterns for printed wiring boards, heat-resistant photosensitive materials containing heat-resistant and chemical-resistant components such as epoxy resins and acrylic resins are used. There is a problem in that the above method cannot be applied as is because a plastic resin is used and exhibits water repellency.
発明が解決しようとする課題
本発明は、プリント配線板のホトソルダーレジストパタ
ーンを形成する際に、酸素により光重合が阻害され、硬
化が不十分なことに起因する種々のトラブルを防止し、
優れた品質のプリント配線板を与えうる、ホトソルダー
レジストパターンの形成方法を提供することを目的とす
るものである。Problems to be Solved by the Invention The present invention prevents various troubles caused by insufficient curing due to inhibition of photopolymerization by oxygen when forming a photo solder resist pattern for a printed wiring board.
The object of the present invention is to provide a method for forming a photo solder resist pattern that can provide a printed wiring board of excellent quality.
課題を解決するための手段
本発明者らは、プリント配線板の製造における、ホトソ
ルダーレジストパターンの形成に際し、使用する耐熱性
感光性樹脂が酸素により光重合阻害を起こし、種々のト
ラブルが発生するのを防止する方法について鋭意研究を
重ねた結果、上記耐熱性感光性樹脂の表面に、水溶性ポ
リビニルアルコールを水とアルコールとの混合溶媒に溶
解して施すことにより、その目的を達成しうろことを見
出し、この知見に基づいて本発明をなすに至った。Means for Solving the Problems The present inventors have discovered that when forming a photo solder resist pattern in the production of printed wiring boards, the heat-resistant photosensitive resin used is inhibited by photopolymerization due to oxygen, causing various troubles. As a result of extensive research into ways to prevent this, we have found that this objective can be achieved by applying water-soluble polyvinyl alcohol dissolved in a mixed solvent of water and alcohol to the surface of the heat-resistant photosensitive resin. The present invention was made based on this finding.
すなわち、本発明は、プリント配線用基板上に配線を施
したのち、耐熱性感光性樹脂層を設け、像形成露光後、
現像処理してホトソルダーレジストパターンを形成させ
る際に、上記耐熱性感光性樹脂層表面に、水溶性ポリビ
ニルアルコールを水とアルコールとの混合溶媒に溶解し
て塗布し、乾燥後像形成露光することを特徴とするホト
ソルダーレジストパターンの形成方法を提供するもので
ある。That is, in the present invention, after wiring is provided on a printed wiring board, a heat-resistant photosensitive resin layer is provided, and after image forming exposure,
When developing and forming a photo solder resist pattern, water-soluble polyvinyl alcohol is dissolved in a mixed solvent of water and alcohol and applied to the surface of the heat-resistant photosensitive resin layer, and after drying, image formation is performed. The present invention provides a method for forming a photo solder resist pattern characterized by the following.
本発明方法における耐熱性感光性樹脂としては、プリン
ト配線板のホトソルダーレジストパターンの形成に通常
使用されている感光性樹脂の中から任意に選ぶことがで
きる。これらの耐熱性感光性樹脂に対しては、これより
得られるホトソルダレジストパターンが、約２４０〜２
６０°Ｃの溶融はんだ浴に耐えるだけの耐熱性と、永久
マスクとしての利用を確実にする耐薬品性を有すること
が要求される。The heat-resistant photosensitive resin used in the method of the present invention can be arbitrarily selected from photosensitive resins commonly used for forming photo-solder resist patterns for printed wiring boards. For these heat-resistant photosensitive resins, the photo solder resist pattern obtained from them is approximately 240 to 2
It is required to have heat resistance sufficient to withstand a 60°C molten solder bath and chemical resistance to ensure use as a permanent mask.
このような耐熱性感光性樹脂としては、例えばアクリル
系樹脂、エポキシ系樹脂、ジアリルフタレート樹脂など
の耐熱性、耐薬品性樹脂と光重合性単量体と光重合開始
剤を主成分とする組成物や、光重合可能なエチレン性不
飽和結合を有するエポキシ樹脂と光重合開始剤を主成分
とする組成物などがあるが、本発明方法においては、現
像処理の際に、同時にポリビニルアルコール被覆の除去
が行われるように、弱アルカリ溶液で現像可能なアルカ
リ現像型の耐熱性感光性樹脂を用いるのが有利である。Such heat-resistant photosensitive resins include, for example, compositions whose main components are heat-resistant and chemical-resistant resins such as acrylic resins, epoxy resins, and diallyl phthalate resins, photopolymerizable monomers, and photopolymerization initiators. There are compositions containing as main components an epoxy resin having a photopolymerizable ethylenically unsaturated bond and a photopolymerization initiator. In order to effect the removal, it is advantageous to use an alkaline-developable, heat-resistant photosensitive resin that can be developed with a weakly alkaline solution.
この好適な耐熱性感光性樹脂の具体的な例としては、ソ
ルダレックスａ−１０００（東洋インキ製造（株）製、
アクリル系感光性樹脂の商品名） 、ＰＳＲ−４００〔
太陽インキ製造（株）製、エポキシ系感光性樹脂の商品
名） 、０ＰＳＲ−５５００（東京応化工業（株）製、
アクリル系感光性樹脂の商品名〕などを挙げることがで
きる。Specific examples of this suitable heat-resistant photosensitive resin include Soldarex a-1000 (manufactured by Toyo Ink Manufacturing Co., Ltd.),
(Product name of acrylic photosensitive resin), PSR-400 [
Taiyo Ink Manufacturing Co., Ltd. (Product name of epoxy photosensitive resin), 0PSR-5500 (Tokyo Ohka Kogyo Co., Ltd.)
[trade name of acrylic photosensitive resin], etc.
また、本発明方法においては、有機溶媒例えば１．１．
１−トリクロロエタンにより現像可能な耐熱性感光性樹
脂を用いることも可能である。この場合は、像形成露光
後、先ず水によってポリビニルアルコール被覆を溶解除
去したのち、現像処理を行う。In addition, in the method of the present invention, organic solvents such as 1.1.
It is also possible to use a heat-resistant photosensitive resin that can be developed with 1-trichloroethane. In this case, after image-forming exposure, the polyvinyl alcohol coating is first dissolved and removed with water, and then development processing is performed.
このような有機溶媒により現像する耐熱性感光性樹脂の
具体的な例としては、０ＰＳＲ−８０００（東京応化工
業（株）製、ジアリルフタレート系感光性樹脂の商品名
） 、ＰＳＲ−１０００（太陽インキ製造（株）製、エ
ポキシ系感光性樹脂の商品名〕、プロピマー５２〔日本
チバガイギー（株）製、エポキシ系感光性樹脂の商品名
〕などを挙げることができる。Specific examples of heat-resistant photosensitive resins developed with such organic solvents include 0PSR-8000 (manufactured by Tokyo Ohka Kogyo Co., Ltd., trade name of diallyl phthalate photosensitive resin), PSR-1000 (Taiyo Ink), Propimer 52 (manufactured by Nippon Ciba-Geigy Co., Ltd., trade name of epoxy-based photosensitive resin) and Propimer 52 (manufactured by Nippon Ciba-Geigy Co., Ltd., trade name of epoxy-based photosensitive resin) can be mentioned.
本発明方法における水溶性ポリビニルアルコールとして
は、水又は弱アルカリ性水溶液で溶解されるものであれ
ばよく、完全けん化物や部分けん化物の他、共重合体で
も差し支えないが、けん化度が低すぎると酸素不透過性
が低下するので、けん化度が７０％以上であるものが好
ましく、また、重合度が３００〜２０００の範囲内にあ
るものが好ましい。The water-soluble polyvinyl alcohol used in the method of the present invention may be any alcohol that can be dissolved in water or a weakly alkaline aqueous solution, and in addition to completely saponified products and partially saponified products, copolymers may also be used. However, if the degree of saponification is too low, Since the oxygen impermeability decreases, the degree of saponification is preferably 70% or more, and the degree of polymerization is preferably within the range of 300 to 2,000.
前記共重合体は、ポリビニルアルコールとの共重合反応
の際のコモノマーとして酢酸ビニルを必須とし、共重合
反応後酢酸エステル部を加水分解することによって製造
される。前記共重合反応には酢酸ビニル以外に他のコモ
ノマーを使用してもよく、このようなコモノマーとして
は、例えばアクリルアミド、メタクリルアミド、Ｎ−メ
チロールアクリルアミド、スチレン、エチレン、プロピ
レン、無水マレイン酸、アクリロニトリル、アクリル酸
あるいはメタクリル酸又はそれらのエステルなどを挙げ
ることができる。酢酸ビニル以外のコモノマーはコモノ
マーの総量に対して４０重量％以下であるのが好ましい
。この範囲を超えると酸素不透過性の低下を免れない。The copolymer requires vinyl acetate as a comonomer in the copolymerization reaction with polyvinyl alcohol, and is produced by hydrolyzing the acetate ester moiety after the copolymerization reaction. Other comonomers besides vinyl acetate may be used in the copolymerization reaction, and examples of such comonomers include acrylamide, methacrylamide, N-methylolacrylamide, styrene, ethylene, propylene, maleic anhydride, acrylonitrile, Examples include acrylic acid, methacrylic acid, and esters thereof. The amount of comonomers other than vinyl acetate is preferably 40% by weight or less based on the total amount of comonomers. If this range is exceeded, oxygen impermeability will inevitably decrease.
本発明方法においては、水溶性ポリビニルアルコールを
水とアルコールとの混合溶媒に溶解させて用いる。この
際に、水溶性ポリビニルアルコールの混合溶媒中の濃度
は、１〜５０重量％、好ましくは２〜ＩＯ重量％の範囲
にするのがよい。この濃度が１重量％未満であると、耐
熱性感光性樹脂層表面上に均一な膜が形成されないし、
また５０重量％を超えるとポリビニルアルコールの混合
溶媒への溶解性が不十分となるため均一溶液が得られな
い。In the method of the present invention, water-soluble polyvinyl alcohol is used after being dissolved in a mixed solvent of water and alcohol. At this time, the concentration of the water-soluble polyvinyl alcohol in the mixed solvent is preferably in the range of 1 to 50% by weight, preferably 2 to IO% by weight. If this concentration is less than 1% by weight, a uniform film will not be formed on the surface of the heat-resistant photosensitive resin layer,
Moreover, if it exceeds 50% by weight, the solubility of polyvinyl alcohol in the mixed solvent becomes insufficient, making it impossible to obtain a homogeneous solution.
また、塗布方法に応じて適宜濃度を調整するのが有利で
ある。Further, it is advantageous to adjust the concentration as appropriate depending on the coating method.
前記のアルコールとしては、メタノール、エタノーノ呟
イングロバノール等が好ましい。As the alcohol, methanol, ethanol, alcohol, etc. are preferable.
前記混合溶媒において、水とアルコールの好ましい混合
比は重量比で９５＝５ないし４０：６０の範囲であり、
さらに好ましくは８０：１０ないし６０ ： ４０の範
囲である。。アルコールの割合がこれよりも少なすぎる
と耐熱性感光性樹脂表面のはっ水性によるはじきが生じ
るので好ましくないし、またこれよりも多すぎると水溶
性ポリビニルアルコールの溶解性が不十分となるのを免
れない。In the mixed solvent, a preferable mixing ratio of water and alcohol is in the range of 95=5 to 40:60 by weight,
More preferably, the ratio is in the range of 80:10 to 60:40. . If the proportion of alcohol is too small, it is undesirable because repellency will occur due to the water repellency of the surface of the heat-resistant photosensitive resin, and if it is too large, the solubility of the water-soluble polyvinyl alcohol will be insufficient. do not have.
また、水溶性ポリビニルアルコールの被膜と耐熱性感光
性樹脂層との熱収縮率の差がありすぎると、ひび割れや
クラッタなとが生じゃすくなるので、このような場合に
は適当な可塑剤を水溶性ポリビニルアルコールに配合し
て用いるのが有利である。In addition, if there is too much of a difference in thermal shrinkage between the water-soluble polyvinyl alcohol coating and the heat-resistant photosensitive resin layer, cracks and clutter are likely to occur, so in such cases, an appropriate plasticizer may be used. It is advantageous to use it in combination with water-soluble polyvinyl alcohol.
さらにその他、消泡剤や着色剤などの添加剤を加えるこ
ともできる。Furthermore, other additives such as antifoaming agents and colorants can also be added.
次に本発明方法の好適な実施態様を示すと、先ずスルー
ホールを有し、回路が形成されたプリント配線板の両面
に、耐熱性感光性樹脂組成物をコルコータ、カーテン７
０−コータ等でコーティングし、乾燥する。次に水溶性
ポリビニルアルコルの水−アルコール溶液をデイツプコ
ータ、ロールコータ、カーテン７０−コータ・バーコー
タ等で塗布し、乾燥する。この際の膜厚は１〜３０μｍ
であるのが好ましい。膜厚かこれより小さすぎると酸素
の遮断効果に乏しいし、またこれよりも大きすぎるとポ
リビニルアルコール被膜中の乱反射により焼きボケが生
じるため、得られるホトソルダーレジストパターンはネ
ガマスクに忠実とならない。Next, to show a preferred embodiment of the method of the present invention, first, a heat-resistant photosensitive resin composition is applied to both sides of a printed wiring board having through holes and a circuit formed thereon using a corcoater and a curtain 7.
Coat with a 0-coater or the like and dry. Next, a water-alcohol solution of water-soluble polyvinyl alcohol is applied using a dip coater, roll coater, curtain coater, bar coater, etc., and dried. The film thickness at this time is 1 to 30 μm
It is preferable that If the film thickness is too small, the oxygen blocking effect will be poor, and if it is too large, the resulting photo solder resist pattern will not be faithful to the negative mask because the diffused reflection in the polyvinyl alcohol film will cause blurring.
次にポリビニルアルコはル被膜にネガマスクを密着させ
て紫外線を選択的に照射したのち、弱アルカリ性水溶液
、例えば炭酸ナトリウム水溶液などで処理することによ
り、未露光部の樹脂、を除去するとともに、同時に水溶
性ポリビニルアルコール被膜も溶解除去してホトソルダ
ーレジストパターンを形成させることができる。さらに
必要に応じて加熱硬化を行うことにより、ホトソルダー
レジストパターンの硬度をさらに高めることができる。Next, polyvinyl alcohol is made by applying a negative mask to the resin film and selectively irradiating it with ultraviolet rays, and then treating it with a weakly alkaline aqueous solution, such as a sodium carbonate aqueous solution, to remove the resin in the unexposed areas and at the same time dissolve the water-soluble resin. The polyvinyl alcohol coating can also be dissolved and removed to form a photo solder resist pattern. Furthermore, by performing heat curing as necessary, the hardness of the photo solder resist pattern can be further increased.
発明の効果
本発明方法によれば、プリント配線板のホトソルダーレ
ジストパターンを形成する際に、酸素により光重合が阻
害されて硬化が不十分となることに起因する種々のトラ
ブルを防止し、感度の向上などの優れた品質のプリント
配線板を形成させることができるという顕著な効果を奏
する。Effects of the Invention According to the method of the present invention, when forming a photo solder resist pattern for a printed wiring board, various troubles caused by insufficient curing due to inhibition of photopolymerization by oxygen can be prevented, and sensitivity can be improved. This has the remarkable effect that it is possible to form a printed wiring board of excellent quality, such as improved quality.
実施例 次に実施例によって本発明をさらに詳細に説明する。Example Next, the present invention will be explained in more detail with reference to Examples.
実施例１
耐熱性感光性樹脂組成物として０ＰＳＲ−５５００Ｃ東
京応化工業（株）製〕を使用し、これをロールコータに
よりスルーホールを有するプリント配線板の片面上にコ
ーティングし、８０°Ｃで１５分間乾燥し、次いで同様
にして反対面にコーティングし、８０℃で３０分間乾燥
した。水溶性ポリビニルアルコールとして、けん化度８
０、重合度５００のクラレボバール４０５〔クラレ（株
）製〕を用い、水とメタノールの重量比が７：３の混合
溶媒に溶解して、３重量％ポリビニルアルコール溶液を
調製した。Example 1 0PSR-5500C manufactured by Tokyo Ohka Kogyo Co., Ltd.] was used as a heat-resistant photosensitive resin composition, and this was coated on one side of a printed wiring board having through holes using a roll coater, and heated at 80°C for 15 minutes. It was dried for 30 minutes, then coated on the other side in the same way and dried at 80° C. for 30 minutes. Saponification degree 8 as water-soluble polyvinyl alcohol
Using Kuraray Bobal 405 (manufactured by Kuraray Co., Ltd.) having a polymerization degree of 0.0 and a polymerization degree of 500, it was dissolved in a mixed solvent of water and methanol at a weight ratio of 7:3 to prepare a 3% by weight polyvinyl alcohol solution.
この溶液を前記耐熱性感光性樹脂層を設けたプリント配
線板の両面にバーコータで塗布し、室温で放置したのち
、４０°Ｃで１０分間乾燥した。このようにして得たポ
リビニルアルコール被膜の膜厚は約ｌＯμｍであった。This solution was applied with a bar coater to both sides of the printed wiring board provided with the heat-resistant photosensitive resin layer, left to stand at room temperature, and then dried at 40°C for 10 minutes. The thickness of the polyvinyl alcohol film thus obtained was about 10 μm.
次に、ネガマスクを介して４００ｍＪ／ｃｍ”の紫外線
を照射したのち、３０℃の１．５％炭酸ナトリウム水溶
液を用いて１００秒間かけて未露光部の樹脂を除去する
とともに、ポリビニルアルコール被膜も溶解除去した。Next, after irradiating 400 mJ/cm'' of ultraviolet light through a negative mask, the resin in the unexposed areas was removed for 100 seconds using a 1.5% sodium carbonate aqueous solution at 30°C, and the polyvinyl alcohol coating was also dissolved. Removed.
さらに１４０°Ｃで６０分間加熱硬化を行って所定のホ
トソルダーレジストパターンの形成されたプリント配線
板を得た。この際の感度を表に示す。Furthermore, heat curing was performed at 140° C. for 60 minutes to obtain a printed wiring board on which a predetermined photo solder resist pattern was formed. The sensitivity at this time is shown in the table.
得られた基板にｐＨ２の水溶性７ラツクスを塗布したの
ち、２６０°Ｃの溶融はんだ中に１分間浸漬したが、基
板上のホトソルダーレジストパターン表面には何の変化
も認められなかった。さらにＭＩＬ−Ｐ−５５１１０Ｄ
に従って、得られたプリント配線板のイオンによる汚染
度を調べた。すなわち、インプロパツール７５％と純水
２５％の混合溶媒で洗浄し、溶媒によって抽出されたイ
オンを、オメガメータ〔ケンコーアロイ（株）製、イオ
ン定量分析装置の商品名〕により測定し、プリント配線
板１平方インチ当りのイオン量を塩化ナトリウムに換算
して求めたところ、４．８μｇ／１ｎｃｈ”であった。After coating the obtained substrate with water-soluble 7LAX having a pH of 2, it was immersed in molten solder at 260°C for 1 minute, but no change was observed on the surface of the photo solder resist pattern on the substrate. Furthermore, MIL-P-55110D
Accordingly, the degree of contamination by ions of the obtained printed wiring board was investigated. That is, it is washed with a mixed solvent of 75% Improper Tool and 25% pure water, and the ions extracted by the solvent are measured with an Omegameter (trade name of an ion quantitative analyzer manufactured by Kenko Alloy Co., Ltd.) and printed. When the amount of ions per square inch of the wiring board was calculated in terms of sodium chloride, it was found to be 4.8 μg/1 inch.
実施例２
ネガマスクを介して６００ｍＪ／ ｃｍ”の紫外線を照
射した以外は、実施例１と同様にして同様のプリント配
線板を得た。この際の感度を表に示す。さらに実施例１
と同様にしてイオンによる汚染度を調べたところ４．１
μｇ／１ｎｃｈ２であった。Example 2 A similar printed wiring board was obtained in the same manner as in Example 1, except that ultraviolet rays of 600 mJ/cm'' were irradiated through a negative mask.The sensitivity at this time is shown in the table.Furthermore, Example 1
The degree of contamination by ions was investigated in the same manner as 4.1.
It was μg/1nch2.
比較例１
水溶性ポリビニルアルコール被膜を設けなかった以外は
、実施例１と全く同様の処理を行ったところ、ホトソル
ダーレジストパターン表面に白く変色している部分が見
られた。感度を表に示す。Comparative Example 1 When the same treatment as in Example 1 was performed except that no water-soluble polyvinyl alcohol film was provided, white discoloration was observed on the surface of the photo solder resist pattern. The sensitivity is shown in the table.
さらに実施例１と同様にしてイオンによる汚染度を調べ
たところ１０．３μｇ／１ｎｃｈ２であった。Further, the degree of contamination by ions was examined in the same manner as in Example 1, and it was found to be 10.3 μg/1 nch2.
比較例２
ネガマスクを介して６００ｍＪ／ｃｒＡ”の紫外線を照
射した以外は、比較例１と全く同様の処理を行ったとこ
ろ、ホトソルダーレジストパターン表面に部分的に白く
変色している部分が見られた。感度を表に示す。さらに
実施例１と同様にしてイオンによる汚染度を調べたとこ
ろ９．１μｇ／１ｎｃｈ”でアラた。Comparative Example 2 When the same process as Comparative Example 1 was performed except that 600 mJ/crA'' ultraviolet rays were irradiated through a negative mask, some parts of the photo solder resist pattern surface were partially discolored to white. The sensitivity is shown in the table.Furthermore, the degree of contamination by ions was examined in the same manner as in Example 1, and it was found to be 9.1 μg/1 nch''.
感度はイーストマン・コダック社の２１段ステップタブ
レットを使用して現像後の残存被膜が示す段数で示した
。この段数が大きいほど感度が高いことを示す。The sensitivity was expressed by the number of steps indicated by the remaining film after development using a 21-step step tablet manufactured by Eastman Kodak. The larger the number of stages, the higher the sensitivity.
Claims (1)
感光性樹脂層を設け、像形成露光後、現像処理してホト
ソルダーレジストパターンを形成させる際に、上記耐熱
性感光性樹脂層表面に、水溶性ポリビニルアルコールを
水とアルコールとの混合溶媒に溶解して塗布し、乾燥後
像形成露光することを特徴とするホトソルダーレジスト
パターンの形成方法。 ２ 水とアルコールとの混合溶媒が、水とアルコールの
重量比で９５：５ないし４０：６０の範囲のものである
請求項１記載の方法。[Claims] 1. After wiring is formed on a printed wiring board, a heat-resistant photosensitive resin layer is provided, and after image-forming exposure, development processing is performed to form a photo-solder resist pattern. A method for forming a photo solder resist pattern, which comprises applying water-soluble polyvinyl alcohol dissolved in a mixed solvent of water and alcohol to the surface of a photosensitive resin layer, drying and then exposing to form an image. 2. The method according to claim 1, wherein the mixed solvent of water and alcohol has a weight ratio of water to alcohol in the range of 95:5 to 40:60.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63222229A JP2642686B2 (en) | 1988-09-07 | 1988-09-07 | Method of forming photo solder resist pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63222229A JP2642686B2 (en) | 1988-09-07 | 1988-09-07 | Method of forming photo solder resist pattern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0271271A true JPH0271271A (en) | 1990-03-09 |
| JP2642686B2 JP2642686B2 (en) | 1997-08-20 |
Family
ID=16779141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63222229A Expired - Fee Related JP2642686B2 (en) | 1988-09-07 | 1988-09-07 | Method of forming photo solder resist pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2642686B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2534418A (en) * | 2015-01-26 | 2016-07-27 | Ping Lai Chung | Solder mask and method of manufacturing thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS635345A (en) * | 1986-06-25 | 1988-01-11 | Nippon Foil Mfg Co Ltd | Production of photosensitive lithographic printing plate |
-
1988
- 1988-09-07 JP JP63222229A patent/JP2642686B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS635345A (en) * | 1986-06-25 | 1988-01-11 | Nippon Foil Mfg Co Ltd | Production of photosensitive lithographic printing plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2534418A (en) * | 2015-01-26 | 2016-07-27 | Ping Lai Chung | Solder mask and method of manufacturing thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2642686B2 (en) | 1997-08-20 |
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