JPH0270861U - - Google Patents
Info
- Publication number
- JPH0270861U JPH0270861U JP14693088U JP14693088U JPH0270861U JP H0270861 U JPH0270861 U JP H0270861U JP 14693088 U JP14693088 U JP 14693088U JP 14693088 U JP14693088 U JP 14693088U JP H0270861 U JPH0270861 U JP H0270861U
- Authority
- JP
- Japan
- Prior art keywords
- board
- solder
- soldering device
- jet nozzle
- curved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 3
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14693088U JPH0270861U (xx) | 1988-11-09 | 1988-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14693088U JPH0270861U (xx) | 1988-11-09 | 1988-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270861U true JPH0270861U (xx) | 1990-05-30 |
Family
ID=31416878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14693088U Pending JPH0270861U (xx) | 1988-11-09 | 1988-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270861U (xx) |
-
1988
- 1988-11-09 JP JP14693088U patent/JPH0270861U/ja active Pending