JPH0249162U - - Google Patents

Info

Publication number
JPH0249162U
JPH0249162U JP12714088U JP12714088U JPH0249162U JP H0249162 U JPH0249162 U JP H0249162U JP 12714088 U JP12714088 U JP 12714088U JP 12714088 U JP12714088 U JP 12714088U JP H0249162 U JPH0249162 U JP H0249162U
Authority
JP
Japan
Prior art keywords
dividing
printed wiring
wiring board
shaped groove
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12714088U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12714088U priority Critical patent/JPH0249162U/ja
Publication of JPH0249162U publication Critical patent/JPH0249162U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
JP12714088U 1988-09-30 1988-09-30 Pending JPH0249162U (xx)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12714088U JPH0249162U (xx) 1988-09-30 1988-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12714088U JPH0249162U (xx) 1988-09-30 1988-09-30

Publications (1)

Publication Number Publication Date
JPH0249162U true JPH0249162U (xx) 1990-04-05

Family

ID=31379296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12714088U Pending JPH0249162U (xx) 1988-09-30 1988-09-30

Country Status (1)

Country Link
JP (1) JPH0249162U (xx)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258251A (ja) * 2009-04-27 2010-11-11 Keihin Corp 集合基板
JP2013157432A (ja) * 2012-01-30 2013-08-15 Seiko Epson Corp 基板集合体、電子デバイス、及び基板集合体の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258251A (ja) * 2009-04-27 2010-11-11 Keihin Corp 集合基板
JP2013157432A (ja) * 2012-01-30 2013-08-15 Seiko Epson Corp 基板集合体、電子デバイス、及び基板集合体の製造方法

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