JPH0270858U - - Google Patents
Info
- Publication number
- JPH0270858U JPH0270858U JP14868988U JP14868988U JPH0270858U JP H0270858 U JPH0270858 U JP H0270858U JP 14868988 U JP14868988 U JP 14868988U JP 14868988 U JP14868988 U JP 14868988U JP H0270858 U JPH0270858 U JP H0270858U
- Authority
- JP
- Japan
- Prior art keywords
- heating section
- temperature
- circuit board
- printed circuit
- preheating mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14868988U JPH0270858U (en, 2012) | 1988-11-15 | 1988-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14868988U JPH0270858U (en, 2012) | 1988-11-15 | 1988-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270858U true JPH0270858U (en, 2012) | 1990-05-30 |
Family
ID=31420234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14868988U Pending JPH0270858U (en, 2012) | 1988-11-15 | 1988-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270858U (en, 2012) |
-
1988
- 1988-11-15 JP JP14868988U patent/JPH0270858U/ja active Pending