JPH0270522U - - Google Patents

Info

Publication number

JPH0270522U

JPH0270522U JP14849088U JP14849088U JPH0270522U JP H0270522 U JPH0270522 U JP H0270522U JP 14849088 U JP14849088 U JP 14849088U JP 14849088 U JP14849088 U JP 14849088U JP H0270522 U JPH0270522 U JP H0270522U

Authority

JP

Japan

Prior art keywords

chip

package

acoustic wave

surface acoustic

wave device

Prior art date

1988-11-16

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000002184 metal Substances 0.000 claims description 4
• 239000000853 adhesive Substances 0.000 claims description 2
• 230000001070 adhesive effect Effects 0.000 claims description 2
• 238000010897 surface acoustic wave method Methods 0.000 claims 2
• 238000002788 crimping Methods 0.000 claims 1
• 239000000758 substrate Substances 0.000 claims 1