JPH0270370U - - Google Patents
Info
- Publication number
- JPH0270370U JPH0270370U JP15021188U JP15021188U JPH0270370U JP H0270370 U JPH0270370 U JP H0270370U JP 15021188 U JP15021188 U JP 15021188U JP 15021188 U JP15021188 U JP 15021188U JP H0270370 U JPH0270370 U JP H0270370U
- Authority
- JP
- Japan
- Prior art keywords
- circuit component
- board
- soldered
- metal plate
- flat surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15021188U JPH0270370U (OSRAM) | 1988-11-17 | 1988-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15021188U JPH0270370U (OSRAM) | 1988-11-17 | 1988-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270370U true JPH0270370U (OSRAM) | 1990-05-29 |
Family
ID=31423148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15021188U Pending JPH0270370U (OSRAM) | 1988-11-17 | 1988-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270370U (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009170849A (ja) * | 2008-01-21 | 2009-07-30 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
| JP2013229207A (ja) * | 2012-04-26 | 2013-11-07 | Mitsubishi Electric Corp | 回路基板装置及びコネクタ |
-
1988
- 1988-11-17 JP JP15021188U patent/JPH0270370U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009170849A (ja) * | 2008-01-21 | 2009-07-30 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
| JP2013229207A (ja) * | 2012-04-26 | 2013-11-07 | Mitsubishi Electric Corp | 回路基板装置及びコネクタ |