JPH0270370U - - Google Patents
Info
- Publication number
- JPH0270370U JPH0270370U JP15021188U JP15021188U JPH0270370U JP H0270370 U JPH0270370 U JP H0270370U JP 15021188 U JP15021188 U JP 15021188U JP 15021188 U JP15021188 U JP 15021188U JP H0270370 U JPH0270370 U JP H0270370U
- Authority
- JP
- Japan
- Prior art keywords
- circuit component
- board
- soldered
- metal plate
- flat surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図ａ，ｂは本考案の一実施例を示す側面図
、正面図、第２図は第１図に示した回路部品挾着
用端子の一使用例を示す斜視図である。 １……回路部品挾着用端子、１Ａ……中央部、
１Ｂ，１Ｃ……袖部、２……ＩＣ基板、３……チ
ツプコンデサ、３Ａ，３Ｂ……電極。
、正面図、第２図は第１図に示した回路部品挾着
用端子の一使用例を示す斜視図である。 １……回路部品挾着用端子、１Ａ……中央部、
１Ｂ，１Ｃ……袖部、２……ＩＣ基板、３……チ
ツプコンデサ、３Ａ，３Ｂ……電極。
Claims (1)
- 弾性金属板材をコ字状に形成してなり、中央部
底面は基板の回路パターンに半田付け可能な平担
面をなし、両袖部はその対向面間に回路部品電極
を挾持可能な湾曲面をなすことを特徴とする回路
部品挾着用端子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15021188U JPH0270370U (ja) | 1988-11-17 | 1988-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15021188U JPH0270370U (ja) | 1988-11-17 | 1988-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270370U true JPH0270370U (ja) | 1990-05-29 |
Family
ID=31423148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15021188U Pending JPH0270370U (ja) | 1988-11-17 | 1988-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270370U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009170849A (ja) * | 2008-01-21 | 2009-07-30 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
| JP2013229207A (ja) * | 2012-04-26 | 2013-11-07 | Mitsubishi Electric Corp | 回路基板装置及びコネクタ |
-
1988
- 1988-11-17 JP JP15021188U patent/JPH0270370U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009170849A (ja) * | 2008-01-21 | 2009-07-30 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
| JP2013229207A (ja) * | 2012-04-26 | 2013-11-07 | Mitsubishi Electric Corp | 回路基板装置及びコネクタ |