JPH0268474U - - Google Patents

Info

Publication number

JPH0268474U

JPH0268474U JP14916988U JP14916988U JPH0268474U JP H0268474 U JPH0268474 U JP H0268474U JP 14916988 U JP14916988 U JP 14916988U JP 14916988 U JP14916988 U JP 14916988U JP H0268474 U JPH0268474 U JP H0268474U

Authority

JP

Japan

Prior art keywords

pad

wiring board

printed wiring

solder resist

outer peripheral

Prior art date

1988-11-15

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 2
• 239000011248 coating agent Substances 0.000 claims 1
• 238000000576 coating method Methods 0.000 claims 1
• 230000002093 peripheral effect Effects 0.000 claims 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 238000000034 method Methods 0.000 description 1

Cited By (3)