JPH0267673U - - Google Patents
Info
- Publication number
- JPH0267673U JPH0267673U JP14706788U JP14706788U JPH0267673U JP H0267673 U JPH0267673 U JP H0267673U JP 14706788 U JP14706788 U JP 14706788U JP 14706788 U JP14706788 U JP 14706788U JP H0267673 U JPH0267673 U JP H0267673U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wiring board
- integrated circuit
- hybrid integrated
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14706788U JPH0267673U (ko) | 1988-11-10 | 1988-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14706788U JPH0267673U (ko) | 1988-11-10 | 1988-11-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267673U true JPH0267673U (ko) | 1990-05-22 |
Family
ID=31417136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14706788U Pending JPH0267673U (ko) | 1988-11-10 | 1988-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267673U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006071292A (ja) * | 2004-08-31 | 2006-03-16 | Sanyo Electric Co Ltd | 回路装置の製造方法 |
-
1988
- 1988-11-10 JP JP14706788U patent/JPH0267673U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006071292A (ja) * | 2004-08-31 | 2006-03-16 | Sanyo Electric Co Ltd | 回路装置の製造方法 |