JPH0267673U - - Google Patents

Info

Publication number
JPH0267673U
JPH0267673U JP1988147067U JP14706788U JPH0267673U JP H0267673 U JPH0267673 U JP H0267673U JP 1988147067 U JP1988147067 U JP 1988147067U JP 14706788 U JP14706788 U JP 14706788U JP H0267673 U JPH0267673 U JP H0267673U
Authority
JP
Japan
Prior art keywords
substrate
wiring board
integrated circuit
hybrid integrated
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988147067U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988147067U priority Critical patent/JPH0267673U/ja
Publication of JPH0267673U publication Critical patent/JPH0267673U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1988147067U 1988-11-10 1988-11-10 Pending JPH0267673U (ca)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988147067U JPH0267673U (ca) 1988-11-10 1988-11-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988147067U JPH0267673U (ca) 1988-11-10 1988-11-10

Publications (1)

Publication Number Publication Date
JPH0267673U true JPH0267673U (ca) 1990-05-22

Family

ID=31417136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988147067U Pending JPH0267673U (ca) 1988-11-10 1988-11-10

Country Status (1)

Country Link
JP (1) JPH0267673U (ca)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006071292A (ja) * 2004-08-31 2006-03-16 Sanyo Electric Co Ltd 回路装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006071292A (ja) * 2004-08-31 2006-03-16 Sanyo Electric Co Ltd 回路装置の製造方法

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