JPH0267671U - - Google Patents

Info

Publication number

JPH0267671U

JPH0267671U JP14696488U JP14696488U JPH0267671U JP H0267671 U JPH0267671 U JP H0267671U JP 14696488 U JP14696488 U JP 14696488U JP 14696488 U JP14696488 U JP 14696488U JP H0267671 U JPH0267671 U JP H0267671U

Authority

JP

Japan

Prior art keywords

lead

electronic component

component

mounting

surface mount

Prior art date

1988-11-09

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 230000037431 insertion Effects 0.000 claims description 2
• 238000003780 insertion Methods 0.000 claims description 2
• 239000010410 layer Substances 0.000 claims description 2
• 239000002344 surface layer Substances 0.000 claims description 2
• 238000005476 soldering Methods 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 1