JPH0267663U - - Google Patents

Info

Publication number
JPH0267663U
JPH0267663U JP14648388U JP14648388U JPH0267663U JP H0267663 U JPH0267663 U JP H0267663U JP 14648388 U JP14648388 U JP 14648388U JP 14648388 U JP14648388 U JP 14648388U JP H0267663 U JPH0267663 U JP H0267663U
Authority
JP
Japan
Prior art keywords
reflector
led chip
main
light
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14648388U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14648388U priority Critical patent/JPH0267663U/ja
Publication of JPH0267663U publication Critical patent/JPH0267663U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP14648388U 1988-11-09 1988-11-09 Pending JPH0267663U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14648388U JPH0267663U (fr) 1988-11-09 1988-11-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14648388U JPH0267663U (fr) 1988-11-09 1988-11-09

Publications (1)

Publication Number Publication Date
JPH0267663U true JPH0267663U (fr) 1990-05-22

Family

ID=31416016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14648388U Pending JPH0267663U (fr) 1988-11-09 1988-11-09

Country Status (1)

Country Link
JP (1) JPH0267663U (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508884B1 (fr) * 1970-07-13 1975-04-08
JPS59224185A (ja) * 1983-06-03 1984-12-17 Nec Corp 半導体発光装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508884B1 (fr) * 1970-07-13 1975-04-08
JPS59224185A (ja) * 1983-06-03 1984-12-17 Nec Corp 半導体発光装置

Similar Documents

Publication Publication Date Title
JPS634009U (fr)
JPH0267663U (fr)
JPH01160864U (fr)
JPS61183005U (fr)
JPH01167065U (fr)
JPS6320464U (fr)
JPH036937Y2 (fr)
JPH022854U (fr)
JPH0367461U (fr)
JPH0225110U (fr)
JPH0440554U (fr)
JPH0399451U (fr)
JPS587364U (ja) 発光ダイオ−ドランプ
JPH0381652U (fr)
JPS6240854U (fr)
JPH0224564U (fr)
JPS6088571U (ja) 発光ダイオ−ドランプ
JPH0330450U (fr)
JPH0425260U (fr)
JPH0359653U (fr)
JPS6230363U (fr)
JPS6291459U (fr)
JPH0367463U (fr)
JPH0367460U (fr)
JPS5963452U (ja) 発光ダイオ−ドランプ