JPH0267345A - Polyethylene resin composition and film - Google Patents
Polyethylene resin composition and filmInfo
- Publication number
- JPH0267345A JPH0267345A JP21943088A JP21943088A JPH0267345A JP H0267345 A JPH0267345 A JP H0267345A JP 21943088 A JP21943088 A JP 21943088A JP 21943088 A JP21943088 A JP 21943088A JP H0267345 A JPH0267345 A JP H0267345A
- Authority
- JP
- Japan
- Prior art keywords
- polyethylene resin
- density polyethylene
- resin
- density
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920013716 polyethylene resin Polymers 0.000 title claims description 15
- 239000011342 resin composition Substances 0.000 title claims description 15
- 239000011347 resin Substances 0.000 claims abstract description 58
- 229920005989 resin Polymers 0.000 claims abstract description 58
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 13
- 239000000194 fatty acid Substances 0.000 claims abstract description 13
- 229930195729 fatty acid Natural products 0.000 claims abstract description 13
- 150000004665 fatty acids Chemical class 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 150000003839 salts Chemical class 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000011574 phosphorus Substances 0.000 claims abstract description 11
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 11
- -1 2,4-di-tert-butylphenyl Chemical group 0.000 claims abstract description 10
- 239000000155 melt Substances 0.000 claims abstract description 7
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920001684 low density polyethylene Polymers 0.000 claims description 22
- 239000004702 low-density polyethylene Substances 0.000 claims description 22
- 229920001903 high density polyethylene Polymers 0.000 claims description 19
- 239000004700 high-density polyethylene Substances 0.000 claims description 19
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- AZSKHRTUXHLAHS-UHFFFAOYSA-N tris(2,4-di-tert-butylphenyl) phosphate Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(=O)(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C AZSKHRTUXHLAHS-UHFFFAOYSA-N 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- 239000007983 Tris buffer Substances 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 12
- 238000000465 moulding Methods 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 abstract description 3
- 238000013329 compounding Methods 0.000 abstract 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 2
- 230000000052 comparative effect Effects 0.000 description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- 239000005977 Ethylene Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000005022 packaging material Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 150000003018 phosphorus compounds Chemical class 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 2
- 239000012760 heat stabilizer Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- KIHBGTRZFAVZRV-UHFFFAOYSA-N 2-hydroxyoctadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)C(O)=O KIHBGTRZFAVZRV-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- 101100345332 Schizosaccharomyces pombe (strain 972 / ATCC 24843) mfr1 gene Proteins 0.000 description 1
- 239000011954 Ziegler–Natta catalyst Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 229920006262 high density polyethylene film Polymers 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229940114930 potassium stearate Drugs 0.000 description 1
- ANBFRLKBEIFNQU-UHFFFAOYSA-M potassium;octadecanoate Chemical compound [K+].CCCCCCCCCCCCCCCCCC([O-])=O ANBFRLKBEIFNQU-UHFFFAOYSA-M 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- 229940114926 stearate Drugs 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、空冷インフレーション法により容易に成形で
き、透明性、自動包装機等に容易に使用可能な剛性を有
するポリエチレン樹脂組成物およびそのフィルムに関す
る。Detailed Description of the Invention [Industrial Field of Application] The present invention provides a polyethylene resin composition that can be easily molded by an air-cooled inflation method, has transparency, and has a rigidity that can be easily used in automatic packaging machines, etc., and a film thereof. Regarding.
高圧法低密度ポリエチレンフィルムは空冷インフレーシ
ョン法により容易に成形でき、かつ柔軟で透明性の良い
フィルムが得られるため（ヘイズ６〜１３％程度）、包
装材料として使用されている。High-pressure low-density polyethylene film is used as a packaging material because it can be easily molded by air-cooled inflation and provides a flexible and transparent film (haze of about 6 to 13%).
ところが近年、包装機の自動化、高速化が進み、包装材
料として剛性を有するものが要求されているが、低密度
ポリエチレンフィルムは、その柔軟性のため、自動包装
機には使用できない。一方高密度ポリエチレンフィルム
は剛性があり、上記自動包装機に使用可能であるが、透
明性に劣るため（ヘイズ５０〜８０％程度）、内容物が
見えにくく、またフィルムに光沢がないため見栄えが悪
く、包装材料として不適当である。However, in recent years, packaging machines have become more automated and faster, and packaging materials that have rigidity are required, but low-density polyethylene film cannot be used in automatic packaging machines due to its flexibility. On the other hand, high-density polyethylene film is rigid and can be used in the automatic packaging machines mentioned above, but it has poor transparency (haze of about 50 to 80%), making it difficult to see the contents, and the film lacks gloss, making it difficult to see. It is bad and unsuitable as a packaging material.
そこで高密度ポリエチレン樹脂と低密度ポリエチレン樹
脂を配合することにより、透明で高剛性の空冷インフレ
ーションフィルムを得ることができるポリエチレン樹脂
組成物（特開昭５７−２３６４３号公報）が開示されて
いるが、透明性の点で自動包装用フィルムとして不十分
である。Therefore, a polyethylene resin composition (JP-A-57-23643) has been disclosed that can obtain a transparent and highly rigid air-cooled blown film by blending a high-density polyethylene resin and a low-density polyethylene resin. In terms of transparency, it is insufficient as an automatic packaging film.
（発明が解決しようとする課題〕
本発明の目的は、空冷インフレーション法により容易に
成形でき、自動包装機に容易に使用可能な剛性および低
密度ポリエチレン樹脂フィルムと実質的に同等の透明性
を有するフィルムを得ることができるポリエチレン樹脂
組成物およびフィルムを提供することである。(Problems to be Solved by the Invention) The object of the present invention is to have a rigidity that can be easily molded by an air-cooled inflation method, that can be easily used in automatic packaging machines, and a transparency that is substantially equivalent to that of a low-density polyethylene resin film. An object of the present invention is to provide a polyethylene resin composition and a film from which a film can be obtained.
本発明は次のポリエチレン樹脂組成物およびフィルムで
ある。The present invention is the following polyethylene resin composition and film.
（１）（Ａ）（ｉ）密度０．９５０〜０．９６２ｇ／ｃ
ｃ、 ＭＦＲ１９０℃０．５１〜１．０ｇ７１０分、に
工２゜／Ｍ１．１０〜４０の高密度ポリエチレン樹脂、
および
（ｉ）密度０．９１５〜０．９３０ｇ／ｃｃ’、ＭＦＲ
１９０℃０．１〜２．０ｇ７１０分、融点１０６〜１１
５℃、溶融張力５ｇ以上の低密度ポリエチレン樹脂を、
高密度ポリエチレン樹脂／低密度ポリエチレン樹脂の重
量比で６０／４０〜８０／２０の割合で含む樹脂成分に
対して、
（Ｂ）脂肪酸金属塩０．４〜２重量％、ならびに（Ｃ）
テトラキス（２，４−ジターシャリブチルフェニル）−
４，４−ビフェニレンジフォスフォナイトおよびトリス
（２，４−ジターシャリブチルフェニル）フォスフエイ
トから選ばれるリン化合物０．０３〜０．３重量％
を配合したことを特徴とするポリエチレン樹脂組成物。(1) (A) (i) Density 0.950-0.962g/c
c. High-density polyethylene resin with MFR190℃0.51~1.0g710 minutes, Ni 2゜/M1.10~40,
and (i) density 0.915-0.930g/cc', MFR
190℃0.1-2.0g710 minutes, melting point 106-11
(B) Fatty acid metal salt for a resin component containing low density polyethylene resin with a melt tension of 5 g or more at 5°C in a weight ratio of high density polyethylene resin/low density polyethylene resin of 60/40 to 80/20. 0.4-2% by weight, and (C)
Tetrakis(2,4-ditertiarybutylphenyl)-
A polyethylene resin composition comprising 0.03 to 0.3% by weight of a phosphorus compound selected from 4,4-biphenylene diphosphonite and tris(2,4-ditertibutylphenyl) phosphate.
（２） （Ａ） （ｉ）密度０．９５０〜０．９６２ｇ
／ｅｃ、 ＭＦＲ，、、。(2) (A) (i) Density 0.950-0.962g
/ec, MFR,,.
０．５１〜１．０ｇ／１０分、ＭＩ、。／ＭＩ、 １０
〜４０の高密度ポリエチレン樹脂、および
（ｉ）密度０．９１５〜０．９３０ｇ／ｅｃ、 ＭＦＲ
，、、、０，１〜２．０ｇ７１０分、融点１０６〜１１
５℃、溶融張力５ｇ以上の低密度ポリエチレン樹脂を、
高密度ポリエチレン樹脂／低密度ポリエチレン樹脂の重
量比で６０／４０〜８０／２０の割合で含む樹脂成分に
対して。0.51-1.0 g/10 min, MI. /MI, 10
~40 high density polyethylene resin, and (i) density 0.915~0.930 g/ec, MFR
,,,,0.1-2.0g710 minutes, melting point 106-11
For a resin component containing low-density polyethylene resin with a melt tension of 5 g or more at 5°C in a weight ratio of high-density polyethylene resin/low-density polyethylene resin of 60/40 to 80/20.
ＣＢ）脂肪酸金属塩０．４〜２重量％、ならびに（Ｃ）
テトラキス（２，４−ジターシャリブチルフェニル）−
４，４−ビフェニレンジフォスフォナイトおよびトリス
（２，４−ジターシャリブチルフェニル）フォスフエイ
トから選ばれるリン化合物０．０３〜０．３重量％
を配合した樹脂組成物を空冷インフレーション法により
成形させて得られるポリエチレン樹脂フィルム。CB) fatty acid metal salt 0.4-2% by weight, and (C)
Tetrakis(2,4-ditertiarybutylphenyl)-
A resin composition containing 0.03 to 0.3% by weight of a phosphorus compound selected from 4,4-biphenylene diphosphonite and tris(2,4-ditertiarybutylphenyl) phosphate is molded by an air-cooled inflation method. The resulting polyethylene resin film.
本発明に使用されるポリエチレン樹脂成分（Ａ）の一方
の高密度ポリエチレン樹脂（ｉ）は、密度０．９５０〜
０．９６２ｇ／ｃｃ、好ましくは０．９５５〜０．９６
０ｇ／ｃｃ、ＭＦＲ工、。、（溶融流れ指数： ＡＳＴ
Ｍ Ｄ １２３８． （Ｅ）） ０．５１〜１．０ｇ／
１０分、ＭＩ、。／ＭＬ（分子量分布指数： ２１．６
ｋｇ荷量のＭＦＲ１□、と２．１６ｋｇ荷重の畦ＲＬ！
。、の比）１０〜４０、好ましくは１５〜３５のエチレ
ンの単独重合体、またはエチレンと炭素数３〜２０のα
−オレフィン５０モル％以下との共重合体である。この
ような高密度ポリエチレン樹脂は例えばチーグラー・ナ
ッタ触媒等による低圧法または中圧法により製造される
。The high-density polyethylene resin (i), one of the polyethylene resin components (A) used in the present invention, has a density of 0.950 to
0.962g/cc, preferably 0.955-0.96
0g/cc, MFR engineering. , (melt flow index: AST
MD 1238. (E)) 0.51-1.0g/
10 minutes, MI. /ML (molecular weight distribution index: 21.6
MFR1□ with kg load and ridge RL with 2.16 kg load!
. , a homopolymer of ethylene with a ratio of 10 to 40, preferably 15 to 35, or an ethylene homopolymer with a carbon number of 3 to 20
- It is a copolymer with 50 mol% or less of olefin. Such high-density polyethylene resins are produced, for example, by a low-pressure method or a medium-pressure method using a Ziegler-Natta catalyst.
他方の低密度ポリエチレン樹脂（ｉｔ）は、密度０．９
１５〜０．９３０ｇ／ｃｃ、好ましくは０．９１８〜０
．９２５ｇ／ｃｃ 。The other low density polyethylene resin (it) has a density of 0.9
15-0.930g/cc, preferably 0.918-0
．． 925g/cc.
ＭＦＲ１９０℃、０．１〜２．０ｇ／１０分、好ましく
は０．２〜１ 、０ｇ／ｌＯ分、融点１０６〜１１５℃
、好ましくは１０８〜１１２℃、溶融張力５ｇ以上、好
ましくは７ｇ以上のエチレンの単独重合体、またはエチ
レンと炭素数３〜２０のα−オレフィン５０モル％以下
との共重合体である。このような低密度ポリエチレン樹
脂は例えばエチレンモノマーに酸素を添加し、高圧、高
温にてラジカル重合させる方法等一般的な方法により製
造される。MFR 190°C, 0.1-2.0 g/10 min, preferably 0.2-1, 0 g/lO min, melting point 106-115°C
, preferably a homopolymer of ethylene having a temperature of 108 to 112°C and a melt tension of 5 g or more, preferably 7 g or more, or a copolymer of ethylene and 50 mol% or less of an α-olefin having 3 to 20 carbon atoms. Such a low-density polyethylene resin is produced by a general method such as, for example, adding oxygen to ethylene monomer and carrying out radical polymerization at high pressure and high temperature.
このときの樹脂成分（Ａ）を構成する高密度ポリエチレ
ン樹脂（ｊ）／低密度ポリエチレン樹脂（…）の重量比
は６０／４０〜８０／２０、好ましくは６５／３５〜７
５／２５である。At this time, the weight ratio of high density polyethylene resin (j)/low density polyethylene resin (...) constituting the resin component (A) is 60/40 to 80/20, preferably 65/35 to 7.
It is 5/25.
脂肪酸金属塩（Ｂ）としては、ステアリン酸ナトリウム
、ステアリン酸カルシウム、ステアリン酸カリウム、１
，２−ヒドロキシステアリン酸カルシウム等の高級脂肪
酸の金属塩であり、これらは１種単独で、または２種以
上を混合して使用することができる。このときの配合量
は樹脂成分（Ａ）に対して０．４〜２．０重量％、好ま
しくは０．５〜１．０重量％である。As the fatty acid metal salt (B), sodium stearate, calcium stearate, potassium stearate, 1
, 2-hydroxycalcium stearate, and other higher fatty acid metal salts, and these can be used singly or in a mixture of two or more. The blending amount at this time is 0.4 to 2.0% by weight, preferably 0.5 to 1.0% by weight based on the resin component (A).
リン化合物（Ｃ）としては、テトラキス（２，４−ジタ
ーシャリブチルフェニル）−４，４−ビフェニレンジフ
ォスフォナイトおよびトリス（２，４−ジターシャリブ
チルフェニル）フォスフエイトから選ばれる１種または
２種のものが使用でき、樹脂成分（Ａ）に対して０．０
３〜０．３重量％、好ましくは０．０５〜０．２重量％
配合する。これらのリン化合物は耐熱安定剤として利用
されるものであるが、本発明の他の成分と組合せて使用
することにより優れた透明性と剛性が得られ、このよう
な特性は他の一般的な耐熱安定剤では得られない。The phosphorus compound (C) is one or two selected from tetrakis(2,4-ditertiarybutylphenyl)-4,4-biphenylene diphosphonite and tris(2,4-ditertiarybutylphenyl)phosphate. 0.0 to resin component (A) can be used.
3-0.3% by weight, preferably 0.05-0.2% by weight
Blend. These phosphorus compounds are used as heat stabilizers, but when used in combination with other components of the present invention, excellent transparency and rigidity can be obtained, and these properties are superior to other common components. It cannot be obtained with heat stabilizers.
本発明のポリエチレン樹脂組成物には、本発明の目的を
損わない範囲で、その他の耐熱安定剤を含む安定剤、改
質材、滑剤、酸化防止剤等の添加剤を配合することがで
きる。The polyethylene resin composition of the present invention may contain additives such as other stabilizers including heat-resistant stabilizers, modifiers, lubricants, antioxidants, etc., within a range that does not impair the purpose of the present invention. .
以上のような構成のポリエチレン樹脂組成物は上記各成
分をバンバリーミキサ−、ヘンシェルミキサー、押出機
等によるトライブレンド、および／またはメルトブレン
ドにより混合することにより得られる。この場合、樹脂
成分以外の成分は予め高密度ポリエチレン樹脂とヘンシ
ェルミキサー等により混合した後、低密度ポリエチレン
樹脂と押出機等により混合して押出し、ペレット化する
のが好ましい。The polyethylene resin composition having the structure described above can be obtained by mixing the above-mentioned components by tri-blending and/or melt-blending using a Banbury mixer, a Henschel mixer, an extruder, or the like. In this case, it is preferable that the components other than the resin component are mixed in advance with the high-density polyethylene resin using a Henschel mixer or the like, and then mixed with the low-density polyethylene resin using an extruder or the like and extruded to form pellets.
以上のように構成されたポリエチレン樹脂組成物からイ
ンフレーション法により製造されるフィルムは透明性お
よび剛性に優れる。A film produced from the polyethylene resin composition configured as described above by an inflation method has excellent transparency and rigidity.
本発明のポリエチレン樹脂フィルムは、上記ポリエチレ
ン樹脂組成物を通常押出温度２１０〜２５０℃、好まし
くは２２０〜２４５℃、フロストライン高さ通常２０〜
７０ａｏ、好ましくは２０〜５０ａ１の条件で空冷イン
フレーション法により製造され、ヘイズ１２％以下、ヤ
ング率７０００ｋｇ／ｃｄ以上のフィルムとすることが
できる。この様なフィルムは自動包装機等による包装材
料として適している。The polyethylene resin film of the present invention is prepared by extruding the above polyethylene resin composition at a temperature of usually 210 to 250°C, preferably 220 to 245°C, and a frost line height of usually 20 to 245°C.
The film is produced by an air-cooled inflation method under conditions of 70 ao, preferably 20 to 50 a1, and has a haze of 12% or less and a Young's modulus of 7000 kg/cd or more. Such a film is suitable as a packaging material for automatic packaging machines and the like.
以上のように、本発明によれば、高ＭＦＨの高密度ポリ
エチレン樹脂、低密度ポリエチレン樹脂、脂肪酸金属塩
、および特定のリン化合物を配合したため、自動包装機
による包装に好適な透明性および剛性に優れたフィルム
を通常の空冷インフレーション成形法により得ることが
できる。As described above, according to the present invention, since high-MFH high-density polyethylene resin, low-density polyethylene resin, fatty acid metal salt, and a specific phosphorus compound are blended, transparency and rigidity suitable for packaging with automatic packaging machines are achieved. Excellent films can be obtained by conventional air-cooled blow molding methods.
以下、本発明の実施例について説明する。各例中１部は
重量部、％は重量％である。また、本実施例における物
性値は下記の方法にて測定を行った。Examples of the present invention will be described below. In each example, 1 part is a part by weight, and % is a weight %. Moreover, the physical property values in this example were measured by the following method.
（１） ＭＦＲ１９０℃： ＡＳＴＭ ０１２３８（Ｅ
）に準じて１９０℃で２．１６ｋｇの荷重で測定した。(1) MFR190℃: ASTM 01238(E
) under a load of 2.16 kg at 190°C.
（２）密 度： ＡＳＴＭ ０１５０５に準じて測定し
た。(2) Density: Measured according to ASTM 01505.
（３） ＭＩ、。／Ｍ１．： ２１．６ｋｇ荷重時のＭ
ＦＲ１９０℃／２．１６−荷重時のＭＦＬｓａ’ｃ
（４）融 点：示差走査熱量計（パーキンエルマー社製
）
試料量；４〜５■
加熱条件；１０℃／分の昇温速度により、４７３’にま
で昇温し、１０分保持後降温速度２０℃／分にて３２０
″Ｋまで降温その後１０℃／分の速度にて昇温
し融点を測定した。(3) MI. /M1. : M at 21.6kg load
FR190℃/2.16-MFLsa'c under load (4) Melting point: Differential scanning calorimeter (manufactured by PerkinElmer) Sample amount: 4 to 5cm Heating conditions: 473 at heating rate of 10℃/min After heating to
The temperature was lowered to "K" and then raised at a rate of 10° C./min to measure the melting point.
関連規格； ＡＳＴＭ ０３４１７−７５ＡＳＴＭ ０
３４１８−７５
（５）溶融張カニ東洋精機社製メルトテンションテスタ
ーにて測定した。Related standards; ASTM 03417-75ASTM 0
3418-75 (5) Melt tension measured using a melt tension tester manufactured by Toyo Seiki Co., Ltd.
使用ノズル； Ｌ＝８．０００ｍ、 Ｄ＝２．０９５閣
試験温度；１９０℃
押出速度；１５ｍ／分
引取速度；２ｍ１分
（６）ヘイズ： ＡＳＴＭ ０１００３に準じて測定し
た。Nozzle used: L=8.000 m, D=2.095 Test temperature: 190°C Extrusion speed: 15 m/min Take-up speed: 2 m/min (6) Haze: Measured according to ASTM 01003.
（７）グロス： ＡＳＴＭ Ｄ５２３に準じて測定した
。(7) Gloss: Measured according to ASTM D523.
（８）ヤング率：クロスヘッド移動速度一定型引張り試
験機（インストロン社製）
材 料： ＪＩＳ Ｋ ６７８１ （ダンベル）
雰囲気温度；２３℃
引張速度： ５００ｍｍ／分
チャート速度； ２００＋ｍ／分
以上の条件で、杓およびＴＤ力方向それぞれ測定し、得
られたチャートから次式により計算し、求めた値を平均
してヤング率（Ｅ）とした、Ｅ０＝Ｒ，−
（式中、Ｅｏは各方向でのヤング率を、Ｒｏは初期勾配
を、Ｌ、はチャック間距離を、Ａは試料作成時の最小面
積をそれぞれ示す。）
このときのＲｏは次式により計算した。(8) Young's modulus: Crosshead constant speed tensile tester (manufactured by Instron) Material: JIS K 6781 (dumbbell)
Atmospheric temperature: 23°C Tensile speed: 500 mm/min Chart speed: Measurements were made in both the ladle and TD force directions under conditions of 200+ m/min or more, and the obtained chart was calculated using the following formula, and the obtained values were averaged to determine Young's ratio (E), E0 = R, - (where Eo is the Young's modulus in each direction, Ro is the initial slope, L is the distance between chucks, and A is the minimum area at the time of sample preparation. ) Ro at this time was calculated using the following formula.
Ｒ０＝□
（式中、Ｆｌは初期接線上の任意の点の荷重を、Ｌｌは
接線上のＦ、に相当する伸びをそれぞれ示す。）（９）
フィルムインパクト強度： ＡＳＴＭ ０３４２０に準
じて測定した。R0=□ (In the formula, Fl represents the load at any point on the initial tangent, and Ll represents the elongation corresponding to F on the tangent.) (9)
Film impact strength: Measured according to ASTM 03420.
（１０）フィルム外観：目視にて判断した。(10) Film appearance: Judged visually.
実施例Ｉ
ＭＦＲｌ、Ｉ、、０．５６ｇ／１０分、密度０．９５７
ｇ／ｃｃ、 ＭＩ２．／ＭＩ２２５の高密度ポリエチレ
ンパウダー（ＩＩＤＰＥ） ８０部に。Example I MFRl, I, 0.56 g/10 min, density 0.957
g/cc, MI2. /MI225 high density polyethylene powder (IIDPE) 80 parts.
テトラキス（２，４−ジターシャリブチルフェニル）−
４，４−ビフェニレンジフォスフォナイトを樹脂成分に
対して０．１％、脂肪酸金属塩の１．２−ヒドロキシス
テアリン酸カルシウムを樹脂成分に対して０．７％、お
よびイルガノックス１０７６ （チバガイギー社製、商
ｍ）を樹脂成分に対して０．０７％ヘンシェルミキサー
にて混合し、押出機にてペレット化した。Tetrakis(2,4-ditertiarybutylphenyl)-
0.1% of 4,4-biphenylene diphosphonite based on the resin component, 0.7% of calcium 1,2-hydroxystearate, a fatty acid metal salt, based on the resin component, and Irganox 1076 (manufactured by Ciba Geigy). , quotient m) was mixed with the resin component in an amount of 0.07% using a Henschel mixer, and pelletized using an extruder.
得られたベレットおよびＭＦＲ１９０℃０．６ｇ／１０
分、密度０．９２２ｇ／ｃｃ、融点１０９℃、溶融張力
（１９０℃）１２ｇの低密度ポリエチレン（ＬＤＰＥ）
２０部をヘンシェルミキサーで混合し、押出機にてペレ
ット化した。さらに、下記の成形条件にてフィルム成形
時の樹脂組成物温度２４０℃、フロストライン高さ２５
ｃｍで空冷インフレーション法により成形して厚さ２５
μｍのフィルムを製造し、前記測定方法にて試験を行っ
た。結果を表１に示す。Obtained pellet and MFR190℃0.6g/10
Low density polyethylene (LDPE) with density 0.922g/cc, melting point 109℃, melt tension (190℃) 12g
20 parts were mixed using a Henschel mixer and pelletized using an extruder. Furthermore, under the following molding conditions, the resin composition temperature during film molding was 240°C, and the frost line height was 25°C.
25cm thick by molding by air-cooling inflation method
A μm film was produced and tested using the measurement method described above. The results are shown in Table 1.
成 形 機：プラコーＬＭ５０φ（プラコー社製、商標
）
スクリュー：圧縮比＝１．２、Ｌ／Ｄ ＝ ２３、ダイ
ス径＝１００ｍｍφ、リップ幅＝１．２膿
引取速度：２０ｍ／分、ＢＵＲ＝３
ニアリングニオフェルベック社製、ＺＧＡＰタイプ実施
例２〜３．比較例１〜６
表１に示す配合で実施例１と同様に行い、表１に示すフ
ィルム成形時の樹脂組成物温度およびフロストライン高
さにて厚さ２５μＩのフィルムを製造し、測定を行った
。結果を表１に示す。Molding machine: Placo LM50φ (manufactured by Placo Co., Ltd., trademark) Screw: Compression ratio = 1.2, L/D = 23, die diameter = 100 mmφ, lip width = 1.2 Pus withdrawal speed: 20 m/min, BUR = 3 ZGAP type Examples 2 to 3, manufactured by Nearing Nioferbeck. Comparative Examples 1 to 6 A film with a thickness of 25 μI was produced using the formulation shown in Table 1 in the same manner as in Example 1, using the resin composition temperature and frost line height during film molding shown in Table 1, and measurements were taken. Ta. The results are shown in Table 1.
以上の結果より明らかなように、実施例のものは、いず
れも透明性、光沢、剛性１強度、フィルム外観等が優れ
ていることがわかる。これに対して高密度ポリエチレン
樹脂のＭＦＲ，、。、が低くて、ＭＩ、。／ＭＩ、が高
く、低密度ポリエチレン樹脂のＭＦＲ１９０℃が高く、
またリン化合物を配合しない場合（比較例１）、低密度
ポリエチレン樹脂のＭＦＲ１９０℃が高く、リン化合物
および脂肪酸金属塩を配合しない場合（比較例２）、お
よび高密度ポリエチレン樹脂のＭＩ２゜／ＭＩ、が高く
、リン化合物および脂肪酸金属塩を配合しない場合（比
較例３）は、透明性が劣り、透明性と剛性のバランスが
良好でない、また実施例３で用いた樹脂成分にリン化合
物を配合しない場合（比較例４）、実施例３で用いた樹
脂成分にリン化合物および脂肪酸金属塩を配合しない場
合（比較例５）、および比較例３で用いた高密度ポリエ
チレン樹脂および実施例３で用いた低密度ポリエチレン
樹脂を含む場合（比較例６）も透明性が劣ることがわか
る。As is clear from the above results, all of the examples are excellent in transparency, gloss, rigidity, strength, film appearance, etc. On the other hand, the MFR of high-density polyethylene resin. , is low and MI,. /MI is high, MFR190℃ of low density polyethylene resin is high,
In addition, when a phosphorus compound is not blended (Comparative Example 1), when the low density polyethylene resin has a high MFR190°C and a phosphorus compound and a fatty acid metal salt are not blended (Comparative Example 2), and when the high density polyethylene resin has a high MFR190°C, the MI2°/MI of the high density polyethylene resin is is high, and when phosphorus compounds and fatty acid metal salts are not blended (Comparative Example 3), transparency is poor and the balance between transparency and rigidity is not good, and phosphorus compounds are not blended with the resin component used in Example 3. case (Comparative Example 4), case where the phosphorus compound and fatty acid metal salt were not blended with the resin component used in Example 3 (Comparative Example 5), and the high-density polyethylene resin used in Comparative Example 3 and the case where the resin used in Example 3 It can be seen that the transparency is also poor when low density polyethylene resin is included (Comparative Example 6).
代理人 弁理士 柳 原 成Agent: Patent attorney Sei Yanagi Hara
Claims (2)
ｃ、ＭＦＲ＿１＿９＿０＿℃０．５１〜１．０ｇ／１０
分、ＭＩ＿２＿０／ＭＩ＿２１０〜４０の高密度ポリエ
チレン樹脂、および （ｉｉ）密度０．９１５〜０．９３０ｇ／ｃｃ、ＭＦＲ
＿１＿９＿０＿℃０．１〜２．０ｇ／１０分、融点１０
６〜１１５℃、溶融張力５ｇ以上の低密度ポリエチレン
樹脂を、 高密度ポリエチレン樹脂／低密度ポリエチレン樹脂の重
量比で６０／４０〜８０／２０の割合で含む樹脂成分に
対して、 （Ｂ）脂肪酸金属塩０．４〜２重量％、ならびに（Ｃ）
テトラキス（２，４−ジターシャリブチルフェニル）−
４，４−ビフェニレンジフォスフォナイトおよびトリス
（２，４−ジターシャリブチルフェニル）フォスフェイ
トから選ばれるリン化合物０．０３〜０．３重量％ を配合したことを特徴とするポリエチレン樹脂組成物。(1) (A) (i) Density 0.950-0.962g/c
c, MFR_1_9_0_℃0.51-1.0g/10
min, MI_2_0/MI_210-40 high-density polyethylene resin, and (ii) density 0.915-0.930 g/cc, MFR
_1_9_0_℃0.1-2.0g/10min, melting point 10
(B) fatty acid for a resin component containing low density polyethylene resin with a melt tension of 5 g or more at a temperature of 6 to 115°C in a weight ratio of high density polyethylene resin/low density polyethylene resin of 60/40 to 80/20. 0.4-2% by weight of metal salt, and (C)
Tetrakis(2,4-ditertiarybutylphenyl)-
A polyethylene resin composition containing 0.03 to 0.3% by weight of a phosphorus compound selected from 4,4-biphenylene diphosphonite and tris(2,4-ditertibutylphenyl) phosphate.
ｃ、ＭＦＲ＿１＿９＿０＿℃０．５１〜１．０ｇ／１０
分、ＭＩ＿２＿０／ＭＩ＿２１０〜４０の高密度ポリエ
チレン樹脂、および （ｉｉ）密度０．９１５〜０．９３０ｇ／ｃｃ、ＭＦＲ
＿１＿９＿０＿℃０．１〜２．０ｇ／１０分、融点１０
６〜１１５℃、溶融張力５ｇ以上の低密度ポリエチレン
樹脂を、 高密度ポリエチレン樹脂／低密度ポリエチレン樹脂の重
量比で６０／４０〜８０／２０の割合で含む樹脂成分に
対して、 （Ｂ）脂肪酸金属塩０．４〜２重量％、ならびに（Ｃ）
テトラキス（２，４−ジターシャリブチルフェニル）−
４，４−ビフェニレンジフォスフォナイトおよびトリス
（２，４−ジターシャリブチルフェニル）フォスフェイ
トから選ばれるリン化合物０．０３〜０．３重量％ を配合した樹脂組成物を空冷インフレーション法により
成形させて得られるポリエチリン樹脂フィルム。(2) (A) (i) Density 0.950-0.962g/c
c, MFR_1_9_0_℃0.51-1.0g/10
min, MI_2_0/MI_210-40 high-density polyethylene resin, and (ii) density 0.915-0.930 g/cc, MFR
_1_9_0_℃0.1-2.0g/10min, melting point 10
(B) fatty acid for a resin component containing low density polyethylene resin with a melt tension of 5 g or more at a temperature of 6 to 115°C in a weight ratio of high density polyethylene resin/low density polyethylene resin of 60/40 to 80/20. 0.4-2% by weight of metal salt, and (C)
Tetrakis(2,4-ditertiarybutylphenyl)-
A resin composition containing 0.03 to 0.3% by weight of a phosphorus compound selected from 4,4-biphenylene diphosphonite and tris(2,4-ditertiarybutylphenyl) phosphate is molded by an air-cooled inflation method. A polyethylene resin film obtained by
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21943088A JP2564910B2 (en) | 1988-09-01 | 1988-09-01 | Polyethylene resin composition and film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21943088A JP2564910B2 (en) | 1988-09-01 | 1988-09-01 | Polyethylene resin composition and film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0267345A true JPH0267345A (en) | 1990-03-07 |
| JP2564910B2 JP2564910B2 (en) | 1996-12-18 |
Family
ID=16735276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21943088A Expired - Fee Related JP2564910B2 (en) | 1988-09-01 | 1988-09-01 | Polyethylene resin composition and film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2564910B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05635U (en) * | 1991-06-21 | 1993-01-08 | 凸版印刷株式会社 | Paper container spout plug |
| JPH06322189A (en) * | 1993-05-07 | 1994-11-22 | Showa Denko Kk | Polyethylene composition |
| JPH1112558A (en) * | 1997-04-30 | 1999-01-19 | Mitsui Chem Inc | Resin composition for sealant of retort film and sealant film |
| JP2017226849A (en) * | 2017-07-24 | 2017-12-28 | 大日本印刷株式会社 | Polyolefin resin film |
-
1988
- 1988-09-01 JP JP21943088A patent/JP2564910B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05635U (en) * | 1991-06-21 | 1993-01-08 | 凸版印刷株式会社 | Paper container spout plug |
| JPH06322189A (en) * | 1993-05-07 | 1994-11-22 | Showa Denko Kk | Polyethylene composition |
| JPH1112558A (en) * | 1997-04-30 | 1999-01-19 | Mitsui Chem Inc | Resin composition for sealant of retort film and sealant film |
| JP2017226849A (en) * | 2017-07-24 | 2017-12-28 | 大日本印刷株式会社 | Polyolefin resin film |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2564910B2 (en) | 1996-12-18 |
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