JPH0265249A - Probe card device - Google Patents

Abstract

PURPOSE:To eliminate a need to exchange a probe card device according to the sizes of IC chips and to make possible an increase in the efficiency of a test by a method wherein 1/4 probe card assembly bodies are combined with one another on a supporting stand in a nonbeam type and are designed movably. CONSTITUTION:Probes, which are shown by codes 20a to 23a, among probes 20 to 23 are made to press out in a measuring window 28 from each side of the window 28. By using such an adjusted probe card device 10A, probes 20a to 23a come into contact with pads of an IC chip and are tested. Probes 20b to 23b which are not used for a test are respectively engaged with engaging members 25, 26, 17 and 24 to prevent the IC chip from being damaged by the probes 20b to 23b. Subsequently, in case a large chip is tested, 1/4 probe card assembly bodies 12 to 15 are moved to adjust.

Description

[Detailed Description of the Invention] [Summary] Regarding a probe card device, the purpose is to reduce equipment costs and improve test efficiency. four 1/4 probe card assemblies formed of probe needles and arranged in a substantially cross-shaped pattern on the support base so as to form a square measurement window and each probe needle protrudes into the measurement window; a moving mechanism that allows each of the 1/4 probe card assemblies to be moved relative to the support stand in two directions, ie, a direction perpendicular to the side of the measurement window and a direction parallel to the side of the measurement window;
a fixing mechanism for fixing the probe card assembly at a position after movement; and a quarter probe card set in which probe needles located outside the measurement window among the probes 11 of each quarter probe card assembly are adjacent to each other. J: A locking member that locks the probe needle and does not protrude from between the three-dimensional space, and a measuring window of a size corresponding to the size of the chip to be measured by moving each of the 1/4 probe card assemblies. Configure to be formed.

[Industrial application field]

The present invention relates to a probe card device.

During the manufacturing process of ICs and LSIs, there is a probing test step in which the electrical characteristics of IC chips formed on a wafer are measured and the quality of the IC chips is determined. This test is performed by attaching the probe card device to a prober and bringing the probe hook into contact with the pads of the IC chip.

In an IC manufacturing factory, several types of IC chips of different sizes are manufactured. Regarding the pads, each IC chip may have the same pad spacing and the same pad arrangement.

In this case, it is desirable that one type of probe card device is sufficient.

[Conventional technology]

As shown in FIG. 10, a conventional probe card device 1 has a configuration in which a plurality of probe nails 4 are fixed in a radial line to a probe card 3 having a rectangular measurement window 2.

[Problem to be solved by the invention]

This probe card device 1 cannot change the size of the measurement window 2, and is used exclusively for testing IC depths 5 of the size shown in FIG. 11.
It cannot be used for chip 6 testing.

Note that the pads 29 of the IC chip 5 and the pads 31 of the IC chip 6 have the same spacing and are arranged according to the same rule.

In order to test this IC chip 6, as shown in FIG. 13, it is necessary to separately create another probe card device 8 with a measuring window 7 having a large knurl corresponding to the size of the IC chip 6. . 9 is a probe needle.

Therefore, it is necessary to create a probe card device for each size of IC chip, which increases the cost.

Furthermore, during testing, it was necessary to replace the probe card device depending on the size of the IC chip, which required a lot of man-hours.

SUMMARY OF THE INVENTION An object of the present invention is to provide a probe card device that makes it possible to reduce equipment costs and improve test efficiency.

[Means for Solving the Problems] FIGS. 1(A) and 1(B) show a probe quad apparatus 10 of the present invention.
(10A, IOB> is a principle configuration diagram.

11 is a frame-shaped support stand.

12 to 15 are 1/4 probe card assemblies, respectively;
The X+, X2 directions, and Y+ directions are arranged on the support base 11 in a substantially parallel grid shape and arranged in a square shape.

It is movable in the Y2 direction.

Each of the 1/4 probe card assemblies 12 to 15 is approximately 1
It has a structure in which a plurality of probes il-20 to 23 are fixed to probe cards 16 to 19 in the form of /4 discs, and locking members 24 to 27 made of rubber plates are further fixed to the probe cards 16 to 19.

[Effect]

The same figure (A) shows each 1/4 card assembly 12~
15 are arranged so that they are close to each other, and a square measuring window 28 having a size corresponding to the IC depth 5 in FIG.
It's Toshide.

Among the probe needles 20 to 23, probe needles indicated by reference numerals 20a to 23a protrude into the measurement window 28 from each side of the measurement window 28.

By using the probe card device 10A adjusted in this way, probe &+ 20a to 23a
contacts the pad 29 of the IC depth 5 in FIG.
Dep 5 is tested.

The remaining probe needles 20b to 23b not used for the test are
The probes & (20b to 2
3b is prevented from damaging IC chips other than the IC chip under test with the probe needle.

After completing the test of IC depth 5, the IC depth shown in FIG.
When testing the C-depth 6, each quarter probe card assembly 12-15 is moved and adjusted as shown in FIG. 1(B).

That is, the probe card assembly 12 is once moved in the Y2 direction, then moved in the X+ force direction, and the probe card assembly 13
is moved in the x22 direction and in the Y2 direction, the probe card assembly 14 is moved in the Y1 direction and then in the x2 direction, and the pro-1 card assembly 15 is moved in the x1 direction and then in the Y1 direction.

As a result, the measurement window 28 is varied and expanded to the 12th
The measurement window 30 has a size corresponding to the IC chip 6 shown in the figure, and the probe needles 20c to 2 extend along the entire length of each side of the measurement window 28.
3c protrudes, the number of probe needles protruding into the measurement window 28 is varied and increased, and the IC chip 6 becomes ready for testing.

With the thus readjusted probe card device 10B, the probe needles 20c to 23c come into contact with the pads 31 of the IC chip 6 shown in FIG. 12, and the IC depth 6 is tested.

〔Example〕

FIG. 2 shows a probe card device 40 according to one embodiment of the present invention.

Figure 2 shows the state adjusted so that the IC chip 5 in Figure 13 can be tested, Figure 7 shows the state adjusted so that the IC chip 6 in Figure 12 can be tested, and Figure 6 shows the adjustment in progress. Indicates the status of

41 is a rectangular frame-shaped support base. Opening 42 of support stand 41
is an order of magnitude larger than the largest measurement window.

43 to 46 are 1/4 probe card assemblies, respectively;
They extend in the X and Y directions and are arranged in a substantially cross-shaped pattern on the support base 41, and have a rectangular measurement window 47 formed inside.

Each 1/4 probe card assembly 43-46 includes rectangular probe cards 48-51 and each probe card 48.
- 51 is comprised of a plurality of probe needles 52 - 55 protruding from the long sides and fixed in parallel to each other.

As shown in FIG. 3, the probe card 48 has long holes 56 and 57 formed along its long and short sides, respectively.

The support base 41 also has long holes 58.58 in a direction perpendicular to the long holes 56.57. ．． 59 is formed.

The shaft 60.61 is supported through the bracket 62.

As shown in FIG. 4, the shaft 60 has a long hole 56 and a long hole 5.
8 and passes through them, and the shaft 61 is inserted into the elongated hole 5.
8 and passes through it.

A shaft 64 supported by another bracket 63 is fitted into the elongated hole 57 and the elongated hole 59, and the shaft 65 is fitted into the elongated hole 59.
is fitted.

This allows the probe card assembly/1.3 to
．． 61 is guided by the elongated hole 58, and the elongated hole 57 is guided by the shaft 64, and is movable in the Y2 direction (direction perpendicular to the side 66 of the measurement window 47 formed by the PRO-1 card assembly 43).

Further, in the probe card assembly 43, the shafts 64 and 65 are guided in the elongated hole 59, the elongated hole 56 is guided in the shaft 60, and
It is movable in one direction (direction parallel to side 66).

Further, a gear 67 is fixed to the shaft 61, and this gear 67 is fixed to the shaft 61.
7 is engaged with a rack 68 on the long side of the probe card 48. At the top of the shaft 61 are six operating knobs.

Similarly, a gear 70 is fixed to the shaft 65, and this gear 70 meshes with a rack 71 on the short side of the probe card 48. An operating knob 72 is provided at the top of the shaft 61.

By rotating the operation knob 72, the probe card assembly 43 is moved in the Y direction.

When the six operation knobs are rotated, the probe card assembly 43 is moved in the X direction.

The long holes 56 to 59 above. Axis 60.61, 64°65, gear 67.70. Racks 68, 71, etc. constitute the movement mechanism 73 for the probe card assembly 43.

Reference numerals 74 and 75 each designate a lock lever, which is rotatably mounted on a shaft 60 degrees 64. By rotating each lock lever 74, 75 and tightly fitting between the operating knob 69.72 and the bracket 62.63, the operating knob 69.7
2 is locked against rotation, and the probe card assembly 43 is X.

Movement in the Y direction is restricted and fixed at that position.

The lock levers 74, 75 are the probe card assembly 43
A fixed machine TF 76 is constructed.

Reference numeral 77 is a locking member made of an elastic material such as rubber, and is provided extending from the lower surface of the probe card 48 in the x1 direction.

Although the configuration of the probe card assembly 43 has been described above, other probe card assemblies 44, 45, 46. Also, the moving mechanism 80.81°82 and the fixing mechanism 84
．． 85.86. Furthermore, locking members 87, 88, 89 are provided. Since these have the same configuration as above, the explanation thereof will be omitted.

Next, the operation and operation of the probe card device 4o having the above configuration will be explained.

FIG. 2 shows a state in which the IC chip 5 shown in FIG. 11 is adjusted so that it can be tested. Actually the fixing mechanism is 76.84
~86 are in operation.

The measurement window 47 has a size corresponding to the size of the IC chip 5.

Probe needles 52a to 55a protrude into the measurement window 47, and these contact the pads 29 and the IC chip 5.
will be tested.

As shown in FIG. 5, the other probe needles 52b to 55b are locked to locking members 87, 88, 89.degree. 77, and do not protrude toward the wafer. Therefore, the probe needles 52b to 55b are prevented from damaging the IC chips around the IC chip under test.

Further, the locking members 77.87-89 are made of elastic bodies such as rubber and have soft surfaces, so that the probe needles 52b-55
The tip of b will not be damaged.

When the test of the IC chip 5 is finished and then the IC chip 6 of the size shown in FIG.
is adjusted to a size corresponding to the IC chip 6.

First, each of the fixing mechanisms 76, 84 to 86 is released, and the probe card assembly 43 is moved in the Y2 direction by rotating the operating knob 72 in the direction of the arrow.

Next, another operation knob 69 is rotated in the direction of the arrow to move it in the x1 direction as shown in FIG. 7, and the fixing mechanism 76.
77 to fix the probe card assembly 43 in that position.

The probe card assembly 44 is first moved in the x2 direction and then in the Y2 direction.
move in the direction. The probe card assembly 45 is first moved in the Y1 direction and then in the x2 direction, and the probe card assembly 46 is first moved in the x1 direction and then in the Y1 direction. Finally, operate the fixing mechanisms 84 to 86 to assemble the probe card assembly 44.
．． 45. Fix 46 in that position.

As a result, as shown in FIG. 7, the size of the measurement window is changed to a measurement window 90 large enough to correspond to the IC chip 6, and the number of probe needles protruding into the measurement window is also changed, so that all the probes The needles 52 to 55 protrude.

The probe needles 52 to 55 come into contact with the pad 31, and the IC chip 6 is tested.

Note that the probe card device 40 is attached to the prober by clamping the support stand 41, and the above adjustment can be performed while the probe card device 40 is attached.

Therefore, after the test of the IC chip 5 is finished, the time required to make the test of the IC chip 6 ready is shortened, and the efficiency of the test is improved.

8 and 9 show modified examples of the locking member 77.

The locking member 100 is an elastic body made of rubber or the like, and has a U-shape. This locking member 100 is fixed to the upper surface of the probe card 48 and protrudes from the short side.

The arm part 101 of the locking member 100 rests on the upper surface of the adjacent probe card 51, and enters the lower part of the probe nail 55 midway and locks the unused probe needle 55 so as to scoop it up. This method does not damage the tip of the probe needle 55 as compared to the previous embodiment.

〔Effect of the invention〕

As explained above, according to the present invention, since the size of the measurement window and the number of probe needles protruding into the measurement window can be varied, IC chips of different sizes can be tested with one probe card device. The cost can be significantly reduced compared to the case of creating a probe card device for each IC chip size.

In addition, the above-mentioned variations can be performed with the probe card device attached to the prober without removing it from the prober, so you can complete the test on a - size IC chip and start testing a different size IC chip. The time required for the test can be shortened, and the IC chip can be tested efficiently.

[Brief explanation of the drawing]

1(A) and (B) are principle diagrams of a probe card device of the present invention, FIG. 2 is a plan view of a probe card device of an embodiment of the present invention, and FIG. 4 is an exploded perspective view showing the probe card assembly and its associated mechanism, FIG. 4 is an enlarged sectional view taken along line IV-rV in FIG. 2, and FIG.
6 is a plan view showing the state in the middle of changing the measurement window, FIG. 7 is a plan view showing the state after changing the measurement window, and FIG. 8 is a modification of the locking member. 9 is a cross-sectional view along line IX-rX in FIG. 8, FIG. 10 is a diagram showing a conventional probe card device, FIG. 11 is a diagram showing a small-sized IC chip, and FIG. 12 is a diagram showing a conventional probe card device. FIG. 13 is a diagram showing a large-sized IC chip, and FIG. 13 is a diagram showing a conventional probe card device. 66 is a side, 67.70 is a gear, 68.71 is a rack, 69.72 is an operating knob, 73.80 to 82 are moving mechanisms, 74.75 is a lock lever 1, and 76, 84 to 86 are fixing mechanisms. In the figure, 10, 10A, 108.40 are probe card devices, 11.41 is a support stand, 12-15, 43-46 are 1/4 probe card assembly, 20-23, 52-55 are probe needles, 24 ~27.7
7.87-89. 100 is a locking member, 28.30,4
7.90 is the measurement window, 56.57, 58.59 are the long holes, 60.61.64.65 are the shafts, patent applicant Fujitsu Ltd. 110 side lO diagram Figure ■

Claims (1)

[Claims] A frame-shaped support (11, 41), a probe card (16-19, 48-51), and a plurality of probe needles (20-23, 52-55) fixed thereto.
Then, there are square measurement windows (28, 30, 47, 90).
1/4 probes arranged in a substantially cross-shaped pattern on the support base so that each probe needle protrudes into the measurement window.
probe card assemblies (12 to 15, 43 to 46), and each of the quarter probe card assemblies to the support stand in two directions, one perpendicular and one parallel to the side (66) of the measurement window. Movement mechanism (73, 80-82) that allows movement in the direction
and a fixing mechanism (76, 84 to 86) for fixing each of the above 1/4 probe card assemblies in the position after movement, and each of the above 1/4 probe card assemblies (76, 84 to 86).
A locking member (24 to 24) that locks the probe needle of the probe card assembly so that the probe needle located outside the measurement window does not protrude beyond the space between adjacent 1/4 probe card assemblies. 27, 77, 87-89,
100), a probe card device configured such that a measurement window having a size corresponding to the size of a chip to be measured is formed by moving each of the 1/4 probe card assemblies.