JPH0263597U - - Google Patents
Info
- Publication number
- JPH0263597U JPH0263597U JP14286488U JP14286488U JPH0263597U JP H0263597 U JPH0263597 U JP H0263597U JP 14286488 U JP14286488 U JP 14286488U JP 14286488 U JP14286488 U JP 14286488U JP H0263597 U JPH0263597 U JP H0263597U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat sink
- mounting structure
- back side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14286488U JPH0263597U (it) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14286488U JPH0263597U (it) | 1988-10-31 | 1988-10-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0263597U true JPH0263597U (it) | 1990-05-11 |
Family
ID=31409174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14286488U Pending JPH0263597U (it) | 1988-10-31 | 1988-10-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0263597U (it) |
-
1988
- 1988-10-31 JP JP14286488U patent/JPH0263597U/ja active Pending
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