JPH0263572U - - Google Patents
Info
- Publication number
- JPH0263572U JPH0263572U JP14318288U JP14318288U JPH0263572U JP H0263572 U JPH0263572 U JP H0263572U JP 14318288 U JP14318288 U JP 14318288U JP 14318288 U JP14318288 U JP 14318288U JP H0263572 U JPH0263572 U JP H0263572U
- Authority
- JP
- Japan
- Prior art keywords
- conductive pattern
- soldered
- wiring body
- printed wiring
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14318288U JPH0263572U (zh) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14318288U JPH0263572U (zh) | 1988-10-31 | 1988-10-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0263572U true JPH0263572U (zh) | 1990-05-11 |
Family
ID=31409773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14318288U Pending JPH0263572U (zh) | 1988-10-31 | 1988-10-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0263572U (zh) |
-
1988
- 1988-10-31 JP JP14318288U patent/JPH0263572U/ja active Pending