JPH0262773U - - Google Patents
Info
- Publication number
- JPH0262773U JPH0262773U JP14153788U JP14153788U JPH0262773U JP H0262773 U JPH0262773 U JP H0262773U JP 14153788 U JP14153788 U JP 14153788U JP 14153788 U JP14153788 U JP 14153788U JP H0262773 U JPH0262773 U JP H0262773U
- Authority
- JP
- Japan
- Prior art keywords
- resistance layer
- conductor lands
- arrangement direction
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14153788U JPH0262773U (US08197722-20120612-C00093.png) | 1988-10-28 | 1988-10-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14153788U JPH0262773U (US08197722-20120612-C00093.png) | 1988-10-28 | 1988-10-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0262773U true JPH0262773U (US08197722-20120612-C00093.png) | 1990-05-10 |
Family
ID=31406688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14153788U Pending JPH0262773U (US08197722-20120612-C00093.png) | 1988-10-28 | 1988-10-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0262773U (US08197722-20120612-C00093.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3386281A4 (en) * | 2016-04-06 | 2019-03-06 | Mitsubishi Heavy Industries Thermal Systems, Ltd. | WIRING SUBSTRATE, WIRING SUBSTRATE ATTACHED TO AN ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING THE WIRING SUBSTRATE ATTACHED TO AN ELECTRONIC COMPONENT |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61140193A (ja) * | 1984-12-13 | 1986-06-27 | 松下電器産業株式会社 | プリント配線板 |
JPS6226074B2 (US08197722-20120612-C00093.png) * | 1979-05-17 | 1987-06-06 | Tokyo Shibaura Electric Co |
-
1988
- 1988-10-28 JP JP14153788U patent/JPH0262773U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6226074B2 (US08197722-20120612-C00093.png) * | 1979-05-17 | 1987-06-06 | Tokyo Shibaura Electric Co | |
JPS61140193A (ja) * | 1984-12-13 | 1986-06-27 | 松下電器産業株式会社 | プリント配線板 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3386281A4 (en) * | 2016-04-06 | 2019-03-06 | Mitsubishi Heavy Industries Thermal Systems, Ltd. | WIRING SUBSTRATE, WIRING SUBSTRATE ATTACHED TO AN ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING THE WIRING SUBSTRATE ATTACHED TO AN ELECTRONIC COMPONENT |